Strong base-assisted direct bonding method
A direct bonding method between two substrates includes the steps of: providing a first substrate and a second substrate respectively including a first hydrophilic bonding surface and a second hydrophilic bonding surface; depositing on the first and/or on the second hydrophilic bonding surface a basic solution consisting of strong base molecules and deionized water; drying the first and/or the second hydrophilic bonding surface until a concentration with between approximately 10 9 atom/cm 2 and 10 15 atom/cm 2 of cations resulting from the strong base molecules on the first and/or on the second hydrophilic bonding surface; contacting the first and the second hydrophilic bonding surface so as to obtain a spontaneous direct bonding and an assembly of the first substrate with the second substrate including a direct bonding interface.
1 . A direct bonding method between two substrates, the method comprising the steps of:
a) providing a first substrate and a second substrate respectively comprising a first hydrophilic bonding surface and/or a second hydrophilic bonding surface,
b) depositing on the first and/or on the second hydrophilic bonding surface a basic solution consisting of strong base molecules and deionized water,
c) drying the first and/or the second hydrophilic bonding surface so as to reach a concentration comprised between approximately 10 9 atoms/cm 2 and 10 15 atoms/cm 2 of cations resulting from the strong base molecules on the first and/or on the second hydrophilic bonding surface,
d) bringing the first and the second hydrophilic bonding surface into contact so as to obtain a spontaneous direct bonding and an assembly of the first substrate with the second substrate comprising a direct bonding interface.
2 . The direct bonding method according to claim 1 , wherein the drying step c) is carried out so that the first hydrophilic bonding surface and the second hydrophilic bonding surface are covered with one to five atomic monolayers of H 2 O.
3 . The direct bonding method according to claim 1 , wherein the strong base molecules are selected from the bases LiOH, NaOH, KOH, RbOH, CsOH, Mg(OH) 2 , Ca(OH) 2 , Sr(OH) 2 , Ba(OH) 2 and a mixture of these bases.
4 . The direct bonding method according to claim 1 , wherein the basic solution has a concentration of strong base molecules comprised between 10 −8 mol/l and 10 −2 mol/l in the deionized water.
5 . The direct bonding method according to claim 1 , wherein step c) is carried out by centrifugation, for example with a rotational speed of approximately 2000 revolutions/min of the first and/or the second hydrophilic bonding surface.
6 . The direct bonding method according to claim 1 , comprising a step e) of applying a heat treatment to the assembly obtained in step d) at a temperature comprised between 50° C. and 500° C.
7 . The direct bonding method according to claim 1 , wherein the first and second substrates are made of silicon.
8 . The direct bonding method according to claim 1 , wherein the first hydrophilic bonding surface and/or the second hydrophilic bonding surface are formed at least in part by a hydrophilic film in a material selected from silicon oxide, silicon nitride, copper oxide and a mixture of these materials.
9 . The direct bonding method according to claim 1 , wherein the first substrate provided in step a) comprises one or more first vignettes originating from the vignetting of the first substrate so to obtain a direct bonding of one or more first vignettes to the second substrate.
10 . An assembly comprising a first substrate and a second substrate made of silicon respectively comprising a first hydrophilic bonding surface and a second hydrophilic bonding surface, the first and the second surface hydrophilic bonding surface being bonded by direct bonding, strong base molecules being arranged with a concentration comprised between approximately 10 9 atoms/cm 2 and 10 15 atoms/cm 2 , at the direct bonding interface between the first and the second hydrophilic bonding surface.