Semiconductor devices including conductive structures
Semiconductor devices and fabrication methods thereof. For example, a semiconductor device may include a dielectric structure, and first conductive structures and second conductive structures. The dielectric structure may include a first dielectric layer that surrounds the first conductive structures and a second dielectric layer that surrounds the second conductive structures. The first dielectric layer may include a first intervention between the first conductive structures. The second dielectric layer may include a second intervention between the second conductive structures. A width in a first direction of the first intervention may decrease in a second direction from a top surface toward a bottom surface of the first intervention. A width in the first direction of the second intervention may increase in the second direction from a top surface toward a bottom surface of the second intervention. The first dielectric layer and the second dielectric layer may include different dielectric materials.
1 . A semiconductor device, comprising:
a dielectric structure; and
first conductive structures and second conductive structures in the dielectric structure,
wherein the dielectric structure includes a first dielectric layer that surrounds the first conductive structures and a second dielectric layer that surrounds the second conductive structures,
wherein the first dielectric layer includes a first intervention in contact with and between the first conductive structures,
wherein the second dielectric layer includes a second intervention in contact with and between the second conductive structures,
wherein a width in a first direction of the first intervention decreases in a second direction from a top surface of the first intervention toward a bottom surface of the first intervention,
wherein a width in the first direction of the second intervention increases in the second direction from a top surface of the second intervention toward a bottom surface of the second intervention,
wherein the first dielectric layer and the second dielectric layer include different dielectric materials from each other, and
wherein each of the first conductive structures are spaced apart from each of the second conductive structures along the first direction.
2 . The semiconductor device of claim 1 , wherein
the first dielectric layer includes a first dielectric material, and
the second dielectric layer includes a second dielectric material having an etch selectivity with respect to the first dielectric material.
3 . The semiconductor device of claim 1 , wherein
a width of each of the first conductive structures increases in the second direction from a top surface of each of the first conductive structures toward a bottom surface of the each of the first conductive structures, and
a width of each of the second conductive structures decreases in the second direction from a top surface of each of the second conductive structures toward a bottom surface of the each of the second conductive structures.
4 . The semiconductor device of claim 1 , wherein
the first conductive structures are spaced apart from the second conductive structures in the first direction, with one of the first conductive structures proximate to one of the second conductive structures,
the first dielectric layer further includes a first connector between the one of the first conductive structures and the proximate one of the second conductive structures, and
the second dielectric layer further includes a second connector between the one of the first conductive structures and the proximate one of the second conductive structures.
5 . The semiconductor device of claim 4 , wherein a width in the first direction of the first connector decreases in the second direction from a top surface of the first connector toward a bottom surface of the first connector.
6 . The semiconductor device of claim 4 , wherein a width in the first direction of the second connector increases in the second direction from a top surface of the first connector toward a bottom surface of the second connector.
7 . The semiconductor device of claim 4 , wherein
a sidewall of the first connector is in contact with a sidewall of the second connector, and
the sidewall of each of the first and second connectors is non-perpendicular with a bottom surface of the dielectric structure.
8 . The semiconductor device of claim 1 , wherein upper surfaces of each of the first dielectric layer, the second dielectric layer, the first conductive structures, and the second conductive structures are coplanar.
9 . The semiconductor device of claim 1 , wherein
the first dielectric layer includes nitride or carbonitride, and
the second dielectric layer includes oxide.
10 . A semiconductor device, comprising:
a substrate;
a dielectric structure on the substrate; and
first conductive structures and second conductive structures in the dielectric structure,
wherein the dielectric structure includes a first dielectric layer that surrounds the first conductive structures and a second dielectric layer that surrounds the second conductive structures,
wherein the first dielectric layer includes a first intervention between the first conductive structures,
wherein the second dielectric layer includes a second intervention between the second conductive structures,
wherein a width of the first intervention in a first direction decreases with decreasing distance from a top surface of the substrate,
wherein a width of the second intervention in the first direction increases with decreasing distance from the top surface of the substrate,
wherein the first dielectric layer and the second dielectric layer include different dielectric materials from each other, and
wherein each of the first conductive structures are spaced apart from each of the second conductive structures along the first direction.
11 . The semiconductor device of claim 10 , wherein bottom surfaces of the first dielectric layer, the second dielectric layer, the first conductive structures, and the second conductive structures are coplanar with each other.
12 . The semiconductor device of claim 10 , wherein top surfaces of the first dielectric layer, the second dielectric layer, the first conductive structures, and the second conductive structures are coplanar with each other.
13 . The semiconductor device of claim 10 , wherein the first conductive structures and the second conductive structures are in direct contact with the top surface of the substrate.
14 . The semiconductor device of claim 10 , wherein
the first conductive structures are spaced apart from the second conductive structures in the first direction, with one of the first conductive structures proximate to one of the second conductive structures,
the first dielectric layer further includes a first connector between the one of the first conductive structures and the proximate one of the second conductive structures, and
the second dielectric layer further includes a second connector between the one of the first conductive structures and the proximate one of the second conductive structures.
15 . The semiconductor device of claim 14 , wherein
a width of the first connector in the first direction decreases with decreasing distance from the substrate, and
a width of the second connector in the first direction increases with decreasing distance from the substrate.
16 . The semiconductor device of claim 14 , wherein
a first sidewall of the first connector is in contact with the one of the first conductive structures,
a second sidewall of the first connector is in contact with the second connector, and
the first and second sidewalls of the first connector are non-perpendicular with a bottom surface of the dielectric structure.
17 . The semiconductor device of claim 16 , wherein
a first sidewall of the second connector is in contact with the one of the second conductive structures,
a second sidewall of the second connector is in contact with the second sidewall of the first connector, and
the first and second sidewalls of the second connector are non-perpendicular with a bottom surface of the dielectric structure.
18 . A semiconductor device, comprising:
a substrate that includes an active pattern;
a source/drain region on the active pattern;
a conductive structure connected to the source/drain region; and
a dielectric structure that surrounds the conductive structure,
wherein the dielectric structure includes a first dielectric layer and a second dielectric layer that include different dielectric materials from each other,
wherein the conductive structure includes first conductive structures in the first dielectric layer and second conductive structures in the second dielectric layer,
wherein the first dielectric layer includes a first separation structure between the first conductive structures,
wherein the second dielectric layer includes a second separation structure between the second conductive structures,
wherein a width in a first direction of each of the first conductive structures increases with decreasing distance from the substrate,
wherein a width in the first direction of each of the second conductive structures decreases with decreasing distance from the substrate,
wherein a width in the first direction of the first separation structure decreases with decreasing distance from the substrate,
wherein a width in the first direction of the second separation structure increases with decreasing distance from the substrate, and
wherein each of the first conductive structures are spaced apart from each of the second conductive structures along the first direction.
19 . The semiconductor device of claim 18 , wherein the first dielectric layer includes a dielectric material having an etch selectivity with respect to the second dielectric layer.
20 . The semiconductor device of claim 19 , wherein lower surfaces of the first dielectric layer and the second dielectric layer are coplanar.