Devices having and methods of forming thermally conductive substrates
Aspects of diamond growth on semiconductors are described. Some aspects include deposition of a layer of diamond seeds on a semiconductor-containing layered structure. Some aspects include the deposition of an intermediate layer over the layer of diamond seeds. In some aspects, the intermediate layer is an immobilizing layer to immobilize the diamond seeds. Some aspects include generating synthetic diamond over a surface of a semiconductor-containing layered structure. In some aspects, synthetic diamond is generated over a surface comprising diamond seeds and an intermediate layer. In some aspects, semiconductor-containing layered structure is etched with diamond seeds in place over a surface of the semiconductor-containing layered structure. In some aspects, an interface of a substrate comprises an interface between a layer of diamond seeds and a semiconductor-containing layered structure, an interface between an intermediate layer and the layer of diamond seeds, and an interface between synthetic diamond and the intermediate layer.
1 . A semiconductor structure comprising:
a layered structure comprising a wide-bandgap semiconductor material;
a plurality of diamond seeds disposed over at least a portion of the layered structure; and
an intermediate layer disposed over at least a portion of the plurality of diamond seeds.
2 . The semiconductor structure of claim 1 , further comprising a layer of material disposed over at least a portion of the intermediate layer, wherein the layer of material has an average value of thermal conductivity equal to or greater than about 1,000 Watts per meter Kelvin (W/m·K).
3 . The semiconductor structure of claim 2 , wherein the layer of material comprises diamond.
4 . The semiconductor structure of claim 2 , wherein an interface between the layered structure and the layer of material comprises at least a portion of the plurality of diamond seeds.
5 . The semiconductor structure of claim 4 , wherein the interface has an average value of thermal boundary resistance from about 1 square meter Kelvin per gigawatt (m 2 K/GW) to about 12 m 2 K/GW.
6 . The semiconductor structure of claim 4 , wherein the interface comprises a material forming a discontinuous layer across a surface of the semiconductor structure.
7 . The semiconductor structure of claim 4 , wherein the interface is an articulated interface.
8 . The semiconductor structure of claim 4 , wherein the interface comprises at least a portion of the intermediate layer, and wherein the interface has a thickness greater than about 50 nanometers.
9 . The semiconductor structure of claim 4 , further comprising a second plurality of diamond seeds disposed over at least a portion of the intermediate layer, wherein the interface comprises at least a portion of the second plurality of diamond seeds.
10 . The semiconductor structure of claim 9 , wherein the second plurality of diamond seeds has an average diameter less than an average diameter of the plurality of diamond seeds.
11 . The semiconductor structure of claim 9 , wherein the second plurality of diamond seeds forms a discontinuous layer across a surface of the intermediate layer.
12 . The semiconductor structure of claim 9 , wherein at least one diamond column from a first diamond seed of the second plurality of diamond seeds and at least one diamond column from a second diamond seed of the second plurality of diamond seeds coalesce at a distance from a surface of the semiconductor structure.
13 . The semiconductor structure of claim 1 , wherein the plurality of diamond seeds has an average value of thermal conductivity less than about 500 Watts per meter Kelvin (W/m·K).
14 . The semiconductor structure of claim 1 , wherein the plurality of diamond seeds has an average diameter from about 40 nanometers to about 300 nanometers.
15 . The semiconductor structure of claim 1 , wherein at least a portion of the plurality of diamond seeds is disposed over and in contact with at least a portion of the layered structure.
16 . The semiconductor structure of claim 1 , wherein the intermediate layer is configured to attach the plurality of diamond seeds to a surface of the layered structure.
17 . The semiconductor structure of claim 1 , wherein at least a portion of the intermediate layer is disposed over and in contact with at least a portion of the plurality of diamond seeds.
18 . The semiconductor structure of claim 1 , wherein at least a portion of the plurality of diamond seeds is disposed between the intermediate layer and the layered structure.