IP Library › Granted Patent US 12702003
Granted Patent B2
US 12702003 · App. 18/357,364 · Granted Aug 4, 2026

Heat radiation component and electronic apparatus

Inventors: Ryota Watanabe (Yokohama, JP); Masahiro Kitamura (Yokohama, JP); Junki Hashiba (Yokohama, JP); Takuroh Kamimura (Yokohama, JP)
Assignee: LENOVO (SINGAPORE) PTE. LTD.
H10W40/257G06F1/20H10W40/255H10W40/258
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Quick Facts
Patent No.
US 12702003
App. No.
18/357,364
Granted
Aug 4, 2026
Kind
B2
Abstract

A heat radiation component radiates heat from a GPU that generates heat, and includes a mesh impregnated with a liquid metal, and two film bodies that cover both surfaces of the mesh and have sealed peripheries. An opening is formed in the film body. In the mesh, an exposed portion that is exposed through the opening abuts on a surface of a die of the GPU. In the mesh, the portion exposed through the opening is formed of two layers, a first layer and a second layer. In the mesh, an area of the exposed portion exposed through the opening is smaller than an area of the other portion.

Claims (21)

1 . A heat radiation component that radiates heat from an electric component that generates heat, the heat radiation component comprising:

a mesh impregnated with a liquid metal, wherein the mesh is entirely on a single plane; and

two film bodies that cover surfaces of the mesh and have sealed peripheries,

wherein an opening is in at least one of the two film bodies and a portion of the mesh is exposed through the opening to abut a surface of the electric component.

2 . The heat radiation component according to claim 1 ,

wherein the portion of the mesh exposed through the opening is a plurality of layers.

3 . The heat radiation component according to claim 1 ,

wherein an area of the portion of the mesh exposed through the opening is smaller than an area of another portion of the mesh.

4 . The heat radiation component according to claim 1 ,

wherein a plurality of the electric components is in an electronic apparatus, and

the opening is formed at a plurality of portions of the mesh corresponding to the plurality of electric components.

5 . The heat radiation component according to claim 1 ,

wherein the opening is at a plurality of portions of the mesh, and

another heat radiation component abuts another opening in a portion of the mesh other than a portion of the mesh that abuts the electric component.

6 . An electronic apparatus comprising:

an electric component that generates heat; and

a heat radiation component that radiates heat from the electric component,

wherein the heat radiation component includes

a mesh impregnated with a liquid metal, wherein the mesh is entirely on a single plane, and

two film bodies that cover surfaces of the mesh and have sealed peripheries, and

an opening is in at least one of the two film bodies and a portion of the mesh is exposed through the opening to abut a surface of the electric component.