Thermal expansion matched chip module with integrated liquid cooling
A chip and cooler assembly includes an active or passive interposer that has a front side and a back side. Integrated circuit chips are mounted onto the back side of the interposer. Each of the chips has a front side that is attached to the interposer and a back side that faces away from the interposer. Gaps separate the chips. The assembly also includes a frame that is fitted into the gaps between the chips. The frame is CTE-matched to the chips. The frame and the chips define a back side surface. A cooler module is attached to the back side surface. The cooler module is CTE-matched to the chips. The cooler module includes a microchannel cooler that is disposed directly against the back sides of the chips and a manifold that is attached to the microchannel cooler opposite the chips. The manifold is CTE-matched to the microchannel cooler.
1 . A chip and cooler assembly comprising:
an interposer that has a front side and a back side;
a plurality of integrated circuit chips that are mounted onto the back side of the interposer, wherein each of the integrated circuit chips has a front side that is attached to the interposer and a back side that faces away from the interposer, wherein gaps separate the integrated circuit chips;
a frame that is fitted around the integrated circuit chips, wherein the frame is coefficient of thermal expansion (CTE)-matched to the integrated circuit chips, wherein the frame and the integrated circuit chips define a back side surface; and
a cooler module that is attached to the back side surface, the cooler module being CTE-matched to the integrated circuit chips, and the cooler module comprising a microchannel cooler that is disposed against the back sides of the integrated circuit chips and a manifold that is attached to the microchannel cooler opposite the integrated circuit chips, the manifold being CTE-matched to the microchannel cooler, and comprising a top piece and a bottom piece bonded together, wherein a material of the manifold comprises a glass.
2 . The chip and cooler assembly of claim 1 , further comprising:
a plurality of thinner chips that are embedded in portions of the gaps between the plurality of integrated circuit chips, wherein the frame is thinner above the thinner chips and is thicker where the thinner chips are not present.
3 . The chip and cooler assembly of claim 1 , wherein the integrated circuit chips have electrical contacts at their front sides, and the interposer comprises land grid array pads that are disposed at the front side of the interposer further comprises through vias that connect the electrical contacts of the integrated circuit chips to the land grid array pads.
4 . The chip and cooler assembly of claim 1 , wherein the interposer is CTE-matched to the integrated circuit chips and includes a redistribution wiring layer that is adjacent to the integrated circuit chips.
5 . The chip and cooler assembly of claim 1 , wherein at least one of the integrated circuit chips is mounted to the interposer by hybrid bonds.
6 . The chip and cooler assembly of claim 1 , wherein the frame comprises multiple pieces.
7 . The chip and cooler assembly of claim 6 , wherein the multiple pieces comprise multiple layers of silicon joined together.
8 . The chip and cooler assembly of claim 7 , wherein the multiple layers include a first layer that is present around an entire edge of the chip and cooler assembly and a second layer atop the first layer, wherein the second layer is present at a first side of the chip and cooler assembly but is not present at a side of the chip and cooler assembly that is opposite the first side.
9 . The chip and cooler assembly of claim 1 , further comprising a filled thermal rigid adhesive that attaches the microchannel cooler to the integrated circuit chips.
10 . The chip and cooler assembly of claim 1 , further comprising a metallic substance that attaches the microchannel cooler to the integrated circuit chips.
11 . The chip and cooler assembly of claim 1 , wherein the chip and cooler assembly is between 2 mm and 25 mm thick.
12 . The chip and cooler assembly of claim 1 , wherein the chip and cooler assembly is between 4 mm and 12 mm thick.
13 . The chip and cooler assembly of claim 1 , further comprising a filled material that adheres together the interposer, the frame, the integrated circuit chips, and the microchannel cooler and fills gaps therebetween.
14 . The chip and cooler assembly of claim 13 , wherein the filled material has a CTE between about 0.6×10 −6 /K and about 5.8×10 −6 /K.
15 . The chip and cooler assembly of claim 1 , further comprising a loading block atop the manifold, wherein the loading block has holes matching holes of the manifold, has O-rings surrounding the holes of the loading block, and has additional O-rings distributed in a uniform array across an interface of the loading block and the manifold.
16 . The chip and cooler assembly of claim 15 , wherein the top piece comprises one or more inlet holes and one or more outlet holes that extend from a top of the manifold through the top piece to grooves that run across a bottom of the top piece, and wherein the bottom piece comprises a plurality of holes that open from each groove through the bottom piece to the microchannel cooler.
17 . The chip and cooler assembly of claim 1 , wherein the interposer is an active interposer.