Electronic device
An electronic device is disclosed. The electronic device includes an interposer, a voltage regulator, a first circuit structure, and an electronic component. The voltage regulator is attached to the interposer. The first circuit structure is supported by the interposer. The electronic component is disposed adjacent to the interposer and electrically connected to the voltage regulator through the first circuit structure and the interposer.
1 . An electronic device, comprising:
an interposer;
a voltage regulator attached to the interposer and overlapping the interposer along a first direction;
a first circuit structure supported by the interposer and overlapping the interposer and the voltage regulator along a second direction substantially orthogonal to the first direction; and
an electronic component disposed adjacent to the interposer and electrically connected to the voltage regulator through the first circuit structure and the interposer, wherein the electronic component overlaps the interposer and the voltage regulator along the first direction and overlaps the first circuit structure along the second direction, and wherein the first circuit structure has a first surface and a second surface over the first surface, and the interposer, the voltage regulator, and the electronic component are disposed under the first surface of the first circuit structure along the second direction.
2 . The electronic device of claim 1 , wherein the first circuit structure covers the voltage regulator and the electronic component, and the interposer is configured to transmit a power passing by a lateral side surface of the electronic component.
3 . The electronic device of claim 2 , wherein the electronic component comprises a first surface, a second surface and a logic circuit closer to the first surface than to the second surface, and the logic circuit is configured to receive the power from the first circuit structure through the second surface of the electronic component, and wherein the lateral side surface of the electronic component extends between the first surface and the second surface of the electronic component.
4 . The electronic device of claim 3 , wherein the second surface of the electronic component is a passive surface.
5 . The electronic device of claim 1 , wherein the voltage regulator has a passive surface and an active surface disposed between the interposer and the passive surface of the voltage regulator, and the active surface of the voltage regulator extends along a direction substantially orthogonal to an active surface of the electronic component.
6 . The electronic device of claim 5 , wherein the voltage regulator is disposed between the interposer and the electronic component along the first direction, the voltage regulator is electrically connected to the interposer through a solder material between the voltage regulator and the interposer along the first direction, and the solder material overlaps the first circuit structure along the second direction.
7 . The electronic device of claim 5 , wherein a lateral side surface of the interposer is substantially parallel to a lateral side surface of the electronic component.
8 . The electronic device of claim 7 , wherein the lateral side surface of the interposer overlaps the lateral side surface of the electronic component along the first direction.
9 . The electronic device of claim 8 , wherein the first circuit structure and the interposer define a substantially L-shaped profile.
10 . The electronic device of claim 1 , further comprising:
a heat spreader adjacent to the interposer and covered by the first circuit structure, wherein the heat spreader overlaps the voltage regulator along the first direction and overlaps the first circuit structure along the second direction.
11 . The electronic device of claim 10 , wherein the voltage regulator is disposed at a first side of the interposer and the heat spreader is disposed at a second side of the interposer opposite to the first side.
12 . The electronic device of claim 10 , wherein the voltage regulator is connected to the heat spreader.
13 . An electronic device, comprising:
a first circuit structure;
a second circuit structure disposed under the first circuit structure;
a voltage regulator configured to transmit a power between the first circuit structure and the second circuit structure, wherein the voltage regulator vertically overlaps the first circuit structure and the second circuit structure along a first direction; and
an electronic component disposed between the first circuit structure and the second circuit structure along the first direction, wherein the electronic component is configured to receive the power, and the voltage regulator extends along a second direction substantially orthogonal to the first direction.
14 . The electronic device of claim 13 , further comprising:
a heat spreader disposed between the electronic component and the voltage regulator along the second direction.
15 . The electronic device of claim 14 , wherein the heat spreader is disposed between the first circuit structure and the second circuit structure along the first direction.
16 . The electronic device of claim 14 , wherein the electronic component is connected to the first circuit structure.
17 . The electronic device of claim 16 , wherein the electronic component is connected to the second circuit structure.
18 . The electronic device of claim 13 , wherein the first circuit structure has a top surface and a bottom surface, and the first circuit structure comprises a thermal dissipating layer closer to the top surface than to the bottom surface.
19 . An electronic device, comprising:
a first circuit structure;
an interposer connected to the first circuit structure along a first direction; and
an electronic component overlapping the interposer along a second direction substantially orthogonal to the first direction, wherein the first circuit structure and the interposer define a space to accommodate a voltage regulator, an active surface of the voltage regulator extends along the first direction, and an active surface of the electronic component extends along the second direction in a cross-sectional view.
20 . The electronic device of claim 19 , further comprising a second circuit structure disposed under the first circuit structure along the first direction, wherein the electronic component has a first surface facing the first circuit structure and a second surface facing the second circuit structure, and the electronic component is configured to receive a power from the first circuit structure through the first surface and configured to transmit a signal to the second circuit structure through the second surface.