Ground pin package substrate, semiconductor device, and electronic device

1 . A semiconductor device comprising:

a package substrate comprising:

a substrate body; and

a plurality of unit regions arranged on the substrate body, wherein each of the unit regions comprises two first pin structures, wherein each of the two first pin structures comprises six first pins, wherein the six first pins are disposed in three parallel rows of two pins, and wherein the three parallel rows of two pins comprises:

a first row of single-ended signal pins;

a second row of differential signal pins; and

a third row of single-ended signal pins,

wherein the two pins in the first row of pins and the two pins in the second row of pins are located at four vertices of a first parallelogram,

wherein the two pins in the second row of pins and the two pins in the third row of pins are located at four vertices of a second parallelogram,

wherein the first parallelogram and the second parallelogram are arranged axisymmetric about the second row of pins,

wherein in each of the unit regions, the two first pin structures are arranged in a row direction of the second row of pins, and wherein the two first pin structures are axisymmetric, and

wherein in each of the unit regions, a first distance between first rows of pins in the two first pin structures is greater than a second distance between second rows of pins in the two first pin structures; and

a chip disposed on the package substrate and operably coupled with the six first pins.

2 . The semiconductor device of claim 1 , further comprising ground pins disposed around each first pin structure of the two first pin structures.

3 . The semiconductor device of claim 2 , wherein a quantity of the ground pins is 11, and wherein the semiconductor device further comprises connection lines connected to the ground pins, sequentially spaced and arranged along a periphery of the first pin structure, and defining a nonagon.

4 . The semiconductor device of claim 3 , wherein, in each of the unit regions, the two first pin structures are arranged in a row direction of the second row of pins, wherein the two first pin structures are axisymmetric, wherein a first distance between first rows of pins in the two first pin structures is greater than a second distance between second rows of pins in the two first pin structures, and wherein each first pin structure of the two first pin structures comprises:

a first side located away from a remaining first pin structure in a same unit region;

a second side located opposite to the first side;

a third side located between the first side and the second side;

a fourth side located between the first side and the second side and further located opposite to the third side;

first three ground pins disposed on the first side, located at three vertices of an isosceles triangle, wherein two legs of the isosceles triangle are parallel to sides that are of the first parallelogram and the second parallelogram and that face the first side;

two ground pins disposed on the second side, wherein a connection line of the two ground pins is orthogonal to the row direction;

second three ground pins disposed on the third side and sequentially spaced and arranged in the row direction; and

third three ground pins disposed on the fourth side and sequentially spaced and arranged in the row direction.

5 . The semiconductor device of claim 4 , wherein, in each of the unit regions, the two first pin structures share the two ground pins.

6 . The semiconductor device of claim 4 , wherein the first rows of pins, the second rows of pins, and the third row of pins are sequentially disposed in a column direction, and wherein two adjacent unit regions in the row direction are staggered in the column direction and share some of the ground pins.

7 . The semiconductor device of claim 4 , wherein the first rows of pins, the second rows of pins, and the third row of pins are sequentially disposed in a column direction, and wherein two adjacent unit regions in the column direction are symmetrically arranged and share some of the ground pins.

8 . The semiconductor device of claim 1 , wherein, in each first pin structure of the two first pin structures, a first pin and a connection line of two adjacent first pins form an equilateral triangle.

9 . The semiconductor device of claim 1 , wherein connection lines of three adjacent pins in a plurality of first pins and a plurality of ground pins form an equilateral triangle.

10 . The semiconductor device of claim 1 , wherein the chip is a central processing unit comprising a plurality of memory channels, wherein each of the memory channels comprises a plurality of byte units, wherein each byte unit corresponds to one unit region, and wherein the single-ended signal pins in the one unit region are configured to transmit data signals of a corresponding byte unit.

11 . An electronic device comprising:

a circuit board; and

a semiconductor device disposed on the circuit board and comprising:

a package substrate comprising:

a substrate body; and

a plurality of unit regions arranged on the substrate body, wherein each of the unit regions comprises two first pin structures, wherein each of the two first pin structures comprises six first pins, wherein the six first pins are disposed, with two of the six first pins in a row, to form three parallel rows of two pins, and wherein the three parallel rows of two pins comprises:

a first row of single-ended signal pins;

a second row of differential signal pins; and

a third row of single-ended signal pins,

wherein the two pins in the first row of pins and the two pins in the second row of pins are located at four vertices of a first parallelogram,

wherein the two pins in the second row of pins and the two pins in the third row of pins are located at four vertices of a second parallelogram,

wherein the first parallelogram and the second parallelogram are arranged axisymmetric about the second row of pins,

wherein in each of the unit regions, the two first pin structures are arranged in a row direction of the second row of pins, and wherein the two first pin structures are axisymmetric,

wherein in each of the unit regions, a first distance between first rows of pins in the two first pin structures is greater than a second distance between second rows of pins in the two first pin structures, and

wherein the single-ended signal pins and the differential signal pins are disposed on the circuit board and are electrically coupled to the semiconductor device; and

a chip disposed on the package substrate and operably coupled with the six first pins.

12 . The electronic device of claim 11 , wherein the semiconductor device further comprises ground pins disposed around each first pin structure of the two first pin structures.

13 . The electronic device of claim 12 , wherein a quantity of the ground pins is 11, and wherein the electronic device further comprises connection lines connected to the ground pins, sequentially spaced and arranged along a periphery of the first pin structure, and defining a nonagon.

14 . The electronic device of claim 13 , wherein, in each of the unit regions, the two first pin structures are arranged in a row direction of the second row of pins, wherein the two first pin structures are axisymmetric, wherein a first distance between first rows of pins in the two first pin structures is greater than a second distance between second rows of pins in the two first pin structures, and wherein each first pin structure of the two first pin structures comprises:

a first side located away from a remaining first pin structure in a same unit region;

a second side located opposite to the first side;

a third side located between the first side and the second side;

a fourth side located between the first side and the second side and further located opposite to the third side;

first three ground pins disposed on the first side, located at three vertices of an isosceles triangle, wherein two legs of the isosceles triangle are parallel to sides that are of the first parallelogram and the second parallelogram and that face the first side;

two ground pins disposed on the second side, wherein a connection line of the two ground pins is orthogonal to the row direction;

second three ground pins disposed on the third side and sequentially spaced and arranged in the row direction; and

third three ground pins disposed on the fourth side and sequentially spaced and arranged in the row direction.

15 . The electronic device of claim 14 , wherein, in each of the unit regions, the two first pin structures share the two ground pins.

16 . The electronic device of claim 14 , wherein the first rows of pins, the second rows of pins, and the third row of pins are sequentially disposed in a column direction, and wherein two adjacent unit regions in the row direction are staggered in the column direction and share some of the ground pins.

17 . A package substrate comprising:

a substrate body; and

a plurality of unit regions arranged on the substrate body, wherein each of the unit regions comprises two first pin structures, wherein each of the two first pin structures comprises six first pins, wherein the six first pins are disposed in three parallel rows of two pins, and wherein the three parallel rows of two pins comprises:

a first row of single-ended signal pins;

a second row of differential signal pins; and

a third row of single-ended signal pins,

wherein the two pins in the first row of pins and the two pins in the second row of pins are located at four vertices of a first parallelogram,

wherein the two pins in the second row of pins and the two pins in the third row of pins are located at four vertices of a second parallelogram,

wherein the first parallelogram and the second parallelogram are arranged axisymmetric about the second row of pins,

wherein in each of the unit regions, the two first pin structures are arranged in a row direction of the second row of pins, and wherein the two first pin structures are axisymmetric, and

wherein in each of the unit regions, a first distance between first rows of pins in the two first pin structures is greater than a second distance between second rows of pins in the two first pin structures.

18 . The package substrate of claim 17 , further comprising ground pins disposed around each first pin structure of the two first pin structures.

19 . The package substrate of claim 17 , wherein, in each first pin structure of the two first pin structures, a first pin and a connection line of two adjacent first pins form an equilateral triangle.

20 . The package substrate of claim 17 , wherein connection lines of three adjacent pins in a plurality of first pins and a plurality of ground pins form an equilateral triangle.