Semiconductor package and display apparatus including the same
A semiconductor package includes a base film, a first conductive structure disposed on a first surface of the base film, a second conductive structure disposed on a second surface of the base film, a via passing through the base film and connecting the first conductive structure to the second conductive structure, a semiconductor chip on the first surface and electrically connected to the first conductive structure, a first insulating layer covering the first conductive structure and including a first opening exposing a first conductive pattern of the first conductive structure, a first conductive layer disposed on the first insulating layer, covering the first insulating layer and the semiconductor chip, and contacting a region of the first conductive pattern exposed by the first opening, and a second conductive layer disposed on the second surface, covering the second conductive structure, and contacting at least a portion of the second conductive structure.
1 . A semiconductor package comprising:
a base film having a first surface and a second surface opposite each other;
a first conductive structure disposed on the first surface of the base film;
a second conductive structure disposed on the second surface of the base film;
a via passing through the base film and connecting the first conductive structure to the second conductive structure;
a semiconductor chip on the first surface of the base film and electrically connected to the first conductive structure;
a first insulating layer covering the first conductive structure on the first surface of the base film and including a first opening exposing a first conductive pattern of the first conductive structure;
a first conductive layer disposed on the first insulating layer and covering the first insulating layer and the semiconductor chip, wherein the first conductive layer directly contacts a region of the first conductive pattern exposed by the first opening; and
a second conductive layer disposed on the second surface of the base film and covering the second conductive structure, wherein a portion of the second conductive layer directly contacts at least a portion of the second conductive structure.
2 . The semiconductor package of claim 1 ,
wherein each of the first conductive layer and the second conductive layer is formed of metal.
3 . The semiconductor package of claim 2 ,
wherein each of the first conductive layer and the second conductive layer includes at least one of aluminum (Al) and copper (Cu).
4 . The semiconductor package of claim 1 , further comprising:
pads formed on the first surface of the base film and electrically connected to the first conductive structure,
wherein the pads include at least one ground pad, at least one power pad, and signal pads, and
wherein the first conductive pattern of the first conductive structure is electrically connected to the at least one power pad or the at least one ground pad.
5 . The semiconductor package of claim 1 , further comprising:
a second insulating layer disposed between the second conductive structure and the second conductive layer and covering a portion of the second conductive structure,
wherein the second insulating layer includes a second opening exposing a second conductive pattern of the second conductive structure.
6 . The semiconductor package of claim 5 ,
wherein the second conductive layer directly contacts a region of the second conductive pattern of the second conductive structure.
7 . The semiconductor package of claim 5 ,
wherein the second conductive pattern is electrically connected to the first conductive pattern by the via.
8 . The semiconductor package of claim 1 ,
wherein the second conductive structure includes a plate-shaped second conductive pattern.
9 . The semiconductor package of claim 8 ,
wherein the second conductive layer has an area larger than an area of the plate-shaped second conductive pattern.
10 . The semiconductor package of claim 8 ,
wherein the plate-shaped second conductive pattern has one surface directly contacting the second surface of the base film and the other surface opposite the one surface, and
wherein the second conductive layer covers the entirety of the other surface of the plate-shaped second conductive pattern.
11 . The semiconductor package of claim 1 , further comprising:
a conductive bump disposed on the first conductive structure,
wherein the conductive bump connects the semiconductor chip to the first conductive structure.
12 . The semiconductor package of claim 1 ,
wherein the first conductive layer includes:
a first conductive portion disposed on the first surface of the base film and directly contacting the first conductive pattern of the first conductive structure;
a second conductive portion covering an upper surface of the semiconductor chip; and
a third conductive portion connecting the first conductive portion to the second conductive portion, and
wherein the second conductive portion is higher than the first conductive portion relative to the first surface of the base film.
13 . The semiconductor package of claim 12 ,
wherein the third conductive portion includes a portion spaced apart from a side surface of the semiconductor chip.
14 . A semiconductor package comprising:
a base film having a first surface and a second surface opposing each other;
a first conductive structure disposed on the first surface of the base film and including first conductive lines and first conductive patterns extending from the first conductive lines, respectively;
a semiconductor chip mounted on the first surface of the base film and electrically connected to the first conductive lines;
a second conductive structure disposed on the second surface of the base film;
a via passing through the base film and electrically connecting the first conductive structure to the second conductive structure;
a first conductive layer disposed on the first conductive structure and directly contacting the first conductive patterns; and
a second conductive layer disposed on the second conductive structure and directly contacting at least a portion of the second conductive structure.
15 . The semiconductor package of claim 14 ,
wherein the second conductive structure includes a plurality of second conductive patterns spaced apart from each other.
16 . The semiconductor package of claim 15 ,
wherein the second conductive layer includes a plurality of conductive patterns respectively covering the plurality of second conductive patterns and spaced apart from each other.
17 . A semiconductor package comprising:
a base film having a first surface on which a semiconductor chip is mounted and a second surface opposite the first surface;
pads disposed on the first surface of the base film and including at least one ground pad, at least one power pad, and signal pads;
a first wiring line disposed on the first surface of the base film and including a first end portion electrically connected to the at least one ground pad or the at least one power pad and a second end portion electrically connected to the semiconductor chip;
a first conductive pattern extending from the first wiring line;
a first insulating layer covering the first wiring line and exposing the first conductive pattern;
a first conductive layer disposed on the first insulating layer and covering the semiconductor chip, wherein the first conductive layer directly contacts the first conductive pattern;
a second conductive pattern disposed on the second surface of the base film and electrically connected to the first conductive pattern; and
a second conductive layer directly contacting the second conductive pattern.
18 . The semiconductor package of claim 17 , further comprising:
a via passing through the base film,
wherein the first conductive pattern and the second conductive pattern are electrically connected through the via.
19 . The semiconductor package of claim 17 ,
wherein the first conductive layer and the second conductive layer include at least one of aluminum (Al) and copper (Cu).
20 . The semiconductor package of claim 17 , further comprising:
second wiring lines disposed on the second surface of the base film,
wherein the second wiring lines are spaced apart from the second conductive pattern and electrically connected to the signal pads.