Electronic device

1 . An electronic device, comprising:

an electronic component having a first surface and a second surface opposite to the first surface;

an input/output (I/O) signal delivery circuit disposed under the first surface of the electronic component; and

a power delivery circuit disposed over the second surface of the electronic component and configured to balance a warpage of the electronic device,

wherein the power delivery circuit comprises a first reinforcement structure configured to enhance a rigidity of the power delivery circuit,

the power delivery circuit comprises a first redistribution structure and a second redistribution structure sandwiching the first reinforcement structure,

the first reinforcement structure includes a first conductive layer, the first redistribution structure includes a second conductive layer, and the first conductive layer is directly bonded to the second conductive layer,

the first reinforcement structure includes a first dielectric layer, the second redistribution structure includes a second dielectric layer, and the first dielectric layer is directly bonded to the second dielectric layer.

2 . The electronic device of claim 1 , wherein the first reinforcement structure comprises a plurality of through-vias configured to transmit a power to the electronic component.

3 . The electronic device of claim 2 , wherein each of the plurality of through-vias is tapered toward the electronic component.

4 . An electronic device, comprising:

an electronic component having a first surface and a second surface opposite to the first surface;

an input/output (I/O) signal delivery circuit disposed under the first surface of the electronic component; and

a power delivery circuit disposed over the second surface of the electronic component and configured to balance a warpage of the electronic device,

wherein the power delivery circuit comprises a first reinforcement structure configured to enhance a rigidity of the power delivery circuit,

the power delivery circuit comprises a first redistribution structure and a second redistribution structure sandwiching the first reinforcement structure, and

wherein the first redistribution structure comprises a first conductive pattern with a first surface area and a second conductive pattern with a second surface area different from the first surface area.

5 . The electronic device of claim 4 , wherein the first conductive pattern is configured to transmit a first power, and the second conductive pattern is configured to transmit a second power different from the first power.

6 . The electronic device of claim 4 , wherein the first redistribution structure comprises first vias connected to the first conductive pattern and second vias connected to the second conductive pattern, and a first dimension of each of the first vias is substantially the same as a second dimension of each of the second vias.

7 . The electronic device of claim 4 , wherein the first redistribution structure comprises a plurality of first vias connected to the first conductive pattern and a plurality of second vias connected to the second conductive pattern, and a quantity of the first vias is different from a quantity of the second vias.

8 . The electronic device of claim 1 , wherein a dielectric material of the I/O signal delivery circuit has a coefficient of thermal expansion different from that of the power delivery circuit.

9 . The electronic device of claim 1 , wherein the electronic component includes a base portion supporting the I/O signal delivery circuit, and a thickness of the first reinforcement structure is greater than a thickness of the base portion of the electronic component.

10 . An electronic device, comprising:

an electronic component having a front surface and a backside surface opposite to the front surface;

a first redistribution structure disposed over the backside surface of the electronic component; and

a reinforcement structure disposed over the first redistribution structure, wherein the first redistribution structure and the reinforcement structure are collectively configured to transmit a power to the electronic component,

and wherein the electronic component comprises a logic portion adjacent to the front surface, a base portion adjacent to the backside surface and at least one through-via passing through the base portion, and the through-via is electrically connected to the first redistribution structure and the logic portion.

11 . The electronic device of claim 10 , further comprising:

a second redistribution structure, wherein the reinforcement structure is disposed between the first redistribution structure and the second redistribution structure.

12 . The electronic device of claim 10 , wherein the first redistribution structure includes a first dielectric element, the reinforcement structure includes a second dielectric element, wherein a material of the first dielectric element is different from a material of the second dielectric element.

13 . The electronic device of claim 10 , wherein a material of the base portion and a material of the reinforcement structure comprises silicon.