Semiconductor module with bent external terminal

1 . A semiconductor module, comprising:

a semiconductor element;

a case that houses the semiconductor element; and

an external terminal that electrically connects a main electrode of the semiconductor element to an external conductor, wherein

the external terminal includes an intermediate portion that projects out in a first direction from a top surface of the case, and an end portion that is bent along the top surface of the case in a second direction that is orthogonal to the first direction, such that the intermediate portion and the end portion form a right angle, and

the case includes

a protruding part having first and second surfaces facing each other, the protruding part projecting from the top surface of the case in the first direction to a predetermined height above the top surface, and being disposed adjacent to a position where the right angle is formed by the intermediate portion and the end portion, such that the protruding part acts as a fulcrum for bending the external terminal, and

a slit penetrating through the protruding part from the first surface to the second surface in the second direction, the slit starting from a top surface of the protruding part and extending toward a bottom of the case in the first direction, to divide the protruding part along a third direction orthogonal to both the first direction and the second direction, and

the protruding part includes a first protruding part and a second protruding part that are divided by the slit, the first protruding part, the slit, and the second protruding part being entirely covered with the external terminal, the external terminal being a single terminal.

2 . The semiconductor module according to claim 1 , wherein

the case has an opposing wall part that faces one side of the external terminal,

the protruding part is formed along a top end of the opposing wall part, and

the slit extends up and down in the first direction of the protruding part, and a bottom end of the slit is formed all the way to the opposing wall part.

3 . The semiconductor module according to claim 2 , wherein the bottom end of the slit is formed all the way to a bottom end of the opposing wall part.

4 . The semiconductor module according to claim 2 , wherein the bottom end of the slit is formed partway through the opposing wall part, and has an arc shape.

5 . The semiconductor module according to claim 2 , wherein

the case has a recess in the second direction with respect to the opposing wall part, for housing a nut, and

the slit penetrates the recess in the second direction with respect to the opposing wall part.

6 . The semiconductor module according to claim 1 , wherein the slit is provided in plurality, and the plurality of slits are arranged in the third direction intersecting the first direction of the protruding part.

7 . The semiconductor module according to claim 1 , wherein a bottom end of the slit diverges into a plurality of paths.

8 . The semiconductor module according to claim 1 , wherein

the case further includes a through-hole into which the external terminal is insertable,

the through-hole has a rectangular shape in a plan view and has a width and a depth respectively larger than a width and thickness of a cross section of the external terminal, and

the external terminal is inserted into the through-hole from inside the case and projects out from the top surface of the case.

9 . The semiconductor module according to claim 1 , wherein the case further includes a reinforcement at a position corresponding to a bottom end of the slit.

10 . The semiconductor module according to claim 9 , wherein

the case has an opposing wall part having an inner surface and a back surface that are opposite to each other, the inner surface facing one side of the external terminal, and

the reinforcement is formed by a thick part thickened on a back surface side of the opposing wall part.

11 . The semiconductor module according to claim 1 , wherein

the case has an opposing wall part that faces one side of the external terminal,

the slit in the protruding part is a first slit, and

the opposing wall part has a second slit disposed at a bottom end of the opposing wall part.

12 . The semiconductor module according to claim 1 , wherein

the case has an opposing wall part having an inner surface and a back surface that are opposite to each other, the inner surface facing one side of the external terminal, and

the inner surface of the opposing wall part has a fillet.

13 . The semiconductor module according to claim 1 , wherein

the case has a recess in the top surface of the case at a position facing the external terminal, for housing a nut, and

the external terminal has a through-hole at a position facing the recess.

14 . A semiconductor module, comprising:

a semiconductor element;

a case that houses the semiconductor element; and

an external terminal that electrically connects a main electrode of the semiconductor element to an external conductor, wherein

the external terminal projects out from a top surface of the case and is bent at a right angle along the top surface of the case,

the case includes a protruding part that projects from the top surface of the case in a first direction to a predetermined height above the top surface, and acts as a fulcrum for bending the external terminal, the protruding part having a slit that extends in a second direction intersecting the first direction to divide the protruding part,

the case has an opposing wall part that faces one side of the external terminal,

the protruding part is formed along a top end of the opposing wall part,

the slit extends up and down in the first direction of the protruding part, and a bottom end of the slit is formed all the way to the opposing wall part, and

a bottom part of the slit in the second direction with respect to the opposing wall part has an arc shape.

15 . A semiconductor module, comprising:

a semiconductor element;

a case that houses the semiconductor element; and

an external terminal that electrically connects a main electrode of the semiconductor element to an external conductor, wherein

the external terminal includes an intermediate portion that extends and projects outward in a first direction from a top surface of the case, and an end portion that is bent along the top surface of the case, such that the intermediate portion extends in the first direction and the end portion extends in a second direction orthogonal to the first direction and parallel to the top surface of the case, whereby the intermediate portion and the end portion form a right angle when viewed from a third direction orthogonal to both the first direction and the second direction, and

the case includes

a protruding part having first and second surfaces facing each other in the second direction, the protruding part projecting from the top surface of the case in the first direction to a predetermined height above the top surface, and being disposed adjacent to a position where the right angle is formed by the intermediate portion and the end portion, such that the protruding part acts as a fulcrum for bending the external terminal, and

a slit penetrating through the protruding part from the first surface to the second surface in the second direction, the slit starting from a top surface of the protruding part and extending toward a bottom of the case in the first direction, to divide the protruding part along the third direction, and

the protruding part includes a first protruding part and a second protruding part that are divided by the slit, the first protruding part, the slit, and the second protruding part being aligned in the third direction and covered with the end portion of the external terminal.