IP Library Granted Patent US 12702178
Granted Patent B2
US 12702178 · App. 18/130,486 · Granted Aug 11, 2026

Cap and manufacturing method thereof

Inventor: Jung Hwan Kim (Anyang-si, KR)
Assignee: YUPOONG, INC.
A42B1/019A42B1/02
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Quick Facts
Patent No.
US 12702178
App. No.
18/130,486
Granted
Aug 11, 2026
Kind
B2
Abstract

A cap is formed of a crown portion formed by connecting a plurality of panels, a brim portion attached to a lower end of the crown portion, and a sweat absorbing portion attached to an inner lower end of the crown portion, and at least two adjacent panels among the plurality of panels are connected to each other by sewing and ultrasonic wave processing.

Claims (31)

1 . A cap comprising:

a crown portion, the crown portion having a plurality of panels connected together;

a brim portion attached to a lower end of the crown portion; and

a sweat absorbing portion attached to an inner lower end of the crown portion,

wherein at least two adjacent panels among the plurality of panels are overlapped and joined simultaneously by both a stitching and an ultrasonic bond,

wherein overlapping edge portions of the at least two adjacent panels are trimmed and fused by ultrasonic bonding to form the ultrasonic bond,

wherein the stitching is disposed at a position inward of and entirely spaced apart from the ultrasonic bond and does not overlap with the ultrasonic bond,

wherein a seam sealing tape is attached to cover both the ultrasonic bond and the stitching, and

wherein the plurality of panels are formed of synthetic fiber, natural fiber, or a combination of the synthetic fiber and the natural fiber.

2 . The cap of claim 1 , wherein:

the stitching is spaced apart from the ultrasonic bond by a distance of 0.5 mm to 1.5 mm.

3 . The cap of claim 1 , wherein:

an adhesive is coated to one side of the seam sealing tape, and

the seam sealing tape is attached to the ultrasonic bond and the stitching by the adhesive.

4 . The cap of claim 3 , wherein:

the seam sealing tape is attached to the ultrasonic bond and the stitching by thermal adhesion.

5 . The cap of claim 3 , wherein:

the adhesive has a thickness of 20 μm to 200 μm.

6 . The cap of claim 1 , wherein:

the seam sealing tape has a thickness of 0.2 mm to 0.5 mm.

7 . The cap of claim 1 , wherein:

the seam sealing tape has a width of 10 mm to 20 mm.

8 . The cap of claim 1 , wherein:

the seam sealing tape is formed of a mixed material of synthetic fiber and thermoplastic resin.

9 . The cap of claim 1 , wherein:

the plurality of panels are formed from the synthetic fiber, and

the synthetic fiber comprises polyester or nylon.

10 . The cap of claim 1 , wherein:

the plurality of panels are formed from the combination of the synthetic fiber and the natural fiber,

the synthetic fiber comprises polyester or nylon, and

the natural fiber comprises one of cotton, rayon, wool, or a combination of cotton, rayon, and wool.