Substrate processing method and substrate processing apparatus
The present invention relates to a substrate processing method and a substrate processing apparatus. A substrate processing method includes: a rinsing liquid/brush cleaning step of moving a brush exerting force onto an upper surface of a substrate from a center of the substrate toward a perimeter of the substrate while causing a fixed nozzle to discharge a rinsing liquid onto the upper surface of the substrate rotated by a holding and rotating unit; a rinsing liquid stopping step of stopping discharge of the rinsing liquid from the fixed nozzle when the brush having moved toward the perimeter of the substrate arrives at a switching position set in advance between the center of the substrate and the perimeter of the substrate; and a chemical liquid/brush cleaning step of moving, after the rinsing liquid stopping step, the brush exerting force on the upper surface of the substrate from the switching position toward the perimeter of the substrate while causing the chemical liquid nozzle to discharge the chemical liquid onto the upper surface of the substrate being rotated.
1 . A substrate processing method for processing a substrate using a substrate processing apparatus, the substrate processing apparatus including:
a spin chuck that holds and rotates a substrate in a horizontal orientation;
a brush that is movable from a center of the substrate toward a perimeter of the substrate and performs brush cleaning by exerting force onto an upper surface of the substrate;
a rinsing liquid nozzle that is provided at a fixed position offset from the center of the substrate and discharges a rinsing liquid onto the upper surface of the substrate; and
a chemical liquid nozzle that is movable from a retracted position offset from the center of the substrate toward the center of the substrate, and that discharges a chemical liquid downwards onto the upper surface of the substrate from above the center of the substrate, the substrate processing method comprising:
(a) moving the brush exerting force on the upper surface of the substrate being rotated by the spin chuck from the center of the substrate toward the perimeter of the substrate, while causing the rinsing liquid nozzle to discharge the rinsing liquid onto the upper surface;
(b) stopping discharge of the rinsing liquid from the rinsing liquid nozzle when the brush having moved toward the perimeter of the substrate arrives at a switching position set in advance between the center of the substrate and the perimeter of the substrate; and
(c) moving, after (b) stopping discharge of the rinsing liquid from the rinsing liquid nozzle, the brush exerting force on the upper surface of the substrate from the switching position toward the perimeter of the substrate while causing the chemical liquid nozzle to discharge the chemical liquid onto the upper surface of the substrate being rotated.
2 . The substrate processing method according to claim 1 , wherein (a) moving the brush exerting force on the upper surface of the substrate, (b) stopping discharge of the rinsing liquid from the rinsing liquid nozzle, and (c) moving, after stopping discharge of the rinsing liquid from the rinsing liquid nozzle, the brush exerting force on the upper surface of the substrate are repeated a preset number of times.
3 . The substrate processing method according to claim 1 , further comprising (d) moving the chemical liquid nozzle to a preset position above the substrate, the preset position being a position not interfering with the brush, before the brush exerts force onto the upper surface of the center of the substrate.
4 . The substrate processing method according to claim 1 , wherein,
in (c) moving, after stopping the discharge of the rinsing liquid from the rinsing liquid nozzle, the brush exerting force on the upper surface of the substrate, the brush exerting force on the upper surface of the substrate is moved from the switching position toward the perimeter of the substrate while causing the chemical liquid nozzle to discharge the chemical liquid onto the upper surface of the substrate in a manner allowing the chemical liquid landed on the upper surface of the substrate being rotated to cover the center of the substrate.
5 . The substrate processing method according to claim 1 , wherein
the brush is configured to perform brushing by exerting force while in contact with the upper surface of the substrate, and
the substrate comprising a semiconductor substrate, a substrate for a flat panel display, a glass substrate for a photomask, a substrate for an optical disk, a substrate for a magnetic disk, a ceramic substrate, or a substrate for a solar cell.
6 . The substrate processing method according to claim 2 , further comprising moving the chemical liquid nozzle to above the center of the substrate when the brush having moved toward the perimeter of the substrate arrives at the switching position, wherein
the switching position is a position where the brush does not interfere with the chemical liquid nozzle positioned at above the center of the substrate.
7 . The substrate processing method according to claim 3 , further comprising moving the chemical liquid nozzle to above the center of the substrate while (c) moving, after stopping discharge of the rinsing liquid from the rinsing liquid nozzle, the brush exerting force on the upper surface of the substrate, in a manner maintaining the chemical liquid nozzle not interfering with the brush.