Surface property measuring system, surface property measuring method, polishing apparatus, and polishing method
A surface property measuring system capable of accurately measuring a surface property of a polishing pad without damaging the polishing pad and without reducing throughput of the entire polishing process is disclosed. The surface property measuring system includes: an optical measuring device configured to direct light to a polishing surface of a polishing pad when the polishing pad is rotating, and measure a surface property of the polishing pad based on reflected light from the polishing surface; a cover member disposed between the optical measuring device and the polishing pad; and a transparent-liquid supply line coupled to an inlet port provided in the cover member and configured to supply a transparent liquid onto the polishing pad through the inlet port. The cover member has a light transmissive portion on an optical path of the light and the reflected light.
1 . A surface property measuring system comprising:
an optical measuring device configured to direct light to a polishing surface of a polishing pad when the polishing pad is rotating, and measure a surface property of the polishing pad based on reflected light from the polishing surface;
a cover member disposed between the optical measuring device and the polishing pad, the cover member having a light transmissive portion on an optical path of the light and the reflected light;
a transparent-liquid supply line coupled to an inlet port provided in the cover member, the transparent-liquid supply line being configured to supply a transparent liquid onto the polishing pad through the inlet port; and
a supply flow-rate regulating valve configured to be able to regulate a flow rate of the transparent liquid to be supplied from the transparent-liquid supply line.
2 . The surface property measuring system according to claim 1 , wherein the inlet port is located upstream of the light transmissive portion in a rotating direction of the polishing pad.
3 . The surface property measuring system according to claim 1 , wherein the inlet port is located downstream of the light transmissive portion in a rotating direction of the polishing pad.
4 . The surface property measuring system according to claim 1 , further comprising a transparent-liquid suction line coupled to a suction port provided in the cover member, the transparent-liquid suction line being configured to suck the transparent liquid on the polishing pad through the suction port.
5 . The surface property measuring system according to claim 1 , wherein the cover member has a facing surface parallel to the polishing surface of the polishing pad.
6 . The surface property measuring system according to claim 5 , wherein a distance from the polishing surface of the polishing pad to the facing surface is 5 mm or less.
7 . The surface property measuring system according to claim 1 , further comprising a cover-member height adjusting mechanism configured to adjust a height of the cover member with respect to the polishing surface.
8 . The surface property measuring system according to claim 1 , further comprising an imaging device configured to generate an image of a monitoring region including a measurement point on the polishing surface where the light is applied and the light is reflected.
9 . A polishing apparatus comprising:
the surface property measuring system according to claim 1 ;
a polishing table configured to support the polishing pad;
a table motor configured to rotate the polishing table together with the polishing pad; and
a polishing head configured to press a substrate against the polishing surface of the polishing pad to polish the substrate.
10 . A surface property measuring system comprising:
an optical measuring device configured to direct light to a polishing surface of a polishing pad when the polishing pad is rotating, and measure a surface property of the polishing pad based on reflected light from the polishing surface;
a cover member disposed between the optical measuring device and the polishing pad, the cover member having a light transmissive portion on an optical path of the light and the reflected light;
a transparent-liquid supply line coupled to an inlet port provided in the cover member, the transparent-liquid supply line being configured to supply a transparent liquid onto the polishing pad through the inlet port;
a transparent-liquid suction line coupled to a suction port provided in the cover member, the transparent-liquid suction line being configured to suck the transparent liquid on the polishing pad through the suction port; and
a suction flow-rate regulating valve configured to be able to regulate a flow rate of the transparent liquid to be sucked by the transparent-liquid suction line.
11 . A surface property measuring system comprising:
an optical measuring device configured to direct light to a polishing surface of a polishing pad when the polishing pad is rotating, and measure a surface property of the polishing pad based on reflected light from the polishing surface;
a cover member disposed between the optical measuring device and the polishing pad, the cover member having a light transmissive portion on an optical path of the light and the reflected light;
a transparent-liquid supply line coupled to an inlet port provided in the cover member, the transparent-liquid supply line being configured to supply a transparent liquid onto the polishing pad through the inlet port;
an imaging device configured to generate an image of a monitoring region including a measurement point on the polishing surface where the light is applied and the light is reflected;
a supply flow-rate regulating valve configured to be able to regulate a flow rate of the transparent liquid to be supplied from the transparent-liquid supply line; and
an operation controller configured to control an operation of the supply flow-rate regulating valve based on the image of the monitoring region.
12 . The surface property measuring system according to claim 11 , further comprising:
a transparent-liquid suction line coupled to a suction port provided in the cover member, the transparent-liquid suction line being configured to suck the transparent liquid on the polishing pad through the suction port; and
a suction flow-rate regulating valve configured to be able to regulate a flow rate of the transparent liquid to be sucked by the transparent-liquid suction line,
wherein the operation controller is configured to control an operation of the suction flow-rate regulating valve based on the image of the monitoring region.
13 . The surface property measuring system according to claim 12 , wherein the operation controller is configured to generate an alarm when the operation controller detects an abnormality in a flow of the transparent liquid on the polishing pad based on the image of the monitoring region.
14 . A surface property measuring system comprising:
an optical measuring device configured to direct light to a polishing surface of a polishing pad when the polishing pad is rotating, and measure a surface property of the polishing pad based on reflected light from the polishing surface;
a cover member disposed between the optical measuring device and the polishing pad, the cover member having a light transmissive portion on an optical path of the light and the reflected light;
a transparent-liquid supply line coupled to an inlet port provided in the cover member, the transparent-liquid supply line being configured to supply a transparent liquid onto the polishing pad through the inlet port;
a first prism disposed between the optical measuring device and the cover member, the first prism being configured to allow the light from the optical measuring device to pass therethrough and deflect an optical path of the light;
a second prism disposed between the optical measuring device and the cover member, the second prism being configured to allow the reflected light from the polishing surface to pass therethrough and deflect an optical path of the reflected light; and
a light shielding member disposed between the first prism and the second prism, the light shielding member being configured to block light between the first prism and the second prism,
wherein the cover member includes a first cover member configured to allow the light from the optical measuring device to pass therethrough, and the second cover member configured to allow the reflected light from the polishing surface to pass therethrough, and
the light shielding member is disposed between the first cover member and the second cover member, and is configured to block light between the first cover member and the second cover member.
15 . A surface property measuring method comprising:
rotating a polishing table together with a polishing pad which is supported by the polishing table;
supplying a transparent liquid onto the polishing pad through an inlet port provided in a cover member, the cover member being disposed between an optical measuring device and the polishing pad and having a light transmissive portion; and
directing light to a polishing surface of the polishing pad through the light transmissive portion, receiving reflected light from the polishing surface through the light transmissive portion, and measuring a surface property of the polishing pad based on the reflected light by the optical measuring device.
16 . The surface property measuring method according to claim 15 , wherein the inlet port is located upstream of the light transmissive portion in a rotating direction of the polishing pad.
17 . The surface property measuring method according to claim 15 , wherein the inlet port is located downstream of the light transmissive portion in a rotating direction of the polishing pad.
18 . The surface property measuring method according to claim 15 , further comprising regulating a flow rate of the transparent liquid to be supplied onto the polishing pad.
19 . The surface property measuring method according to claim 15 , further comprising sucking the transparent liquid on the polishing pad through a suction port provided in the cover member, while supplying the transparent liquid onto the polishing pad through the inlet port.
20 . The surface property measuring method according to claim 19 , further comprising regulating a flow rate of the transparent liquid to be sucked from the polishing pad.
21 . The surface property measuring method according to claim 15 , wherein the cover member has a facing surface parallel to the polishing surface of the polishing pad.
22 . The surface property measuring method according to claim 21 , wherein a distance from the polishing surface of the polishing pad to the facing surface is 5 mm or less.
23 . The surface property measuring method according to claim 15 , further comprising adjusting a height of the cover member with respect to the polishing surface.
24 . The surface property measuring method according to claim 15 , further comprising generating an image of a monitoring region including a measurement point on the polishing surface where the light is applied and the light is reflected.
25 . The surface property measuring method according to claim 24 , further comprising regulating a flow rate of the transparent liquid to be supplied onto the polishing pad based on the image of the monitoring region.
26 . The surface property measuring method according to claim 25 , further comprising:
sucking the transparent liquid on the polishing pad through a suction port provided in the cover member, while supplying the transparent liquid onto the polishing pad through the inlet port; and
regulating a flow rate of the transparent liquid to be sucked from the polishing pad based on the image of the monitoring region.
27 . The surface property measuring method according to claim 25 , further comprising generating an alarm when an abnormality in a flow of the transparent liquid on the polishing pad is detected based on the image of the monitoring region.
28 . A polishing method comprising:
polishing a substrate with use of a polishing pad; and
measuring a surface property of the polishing pad by the surface property measuring method according to claim 15 , and determining whether the polishing pad has reached a replacement time based on a measurement result of the surface property.
29 . A polishing method comprising:
supporting a new polishing pad by a polishing table;
polishing a break-in substrate to perform a break-in process of the new polishing pad;
measuring a surface property of the new polishing pad by the surface property measuring method according to according to claim 15 ;
determining whether the break-in process is completed based on a measurement result of the surface property; and
polishing a substrate with use of the new polishing pad when it has been determined that the break-in process is completed.