Polishing pad, double-side polishing device, and double-side polishing method for wafer

Inventor: Junichi Ueno (Shirakawa, JP)

Assignee: SHIN-ETSU HANDOTAI CO., LTD.

B24B37/22 B24B37/00 B24B37/08 B24D11/00 H10P52/402 H10P72/0428 H10P90/129

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Quick Facts

Patent No.: US 12703059
App. No.: 18/035,339
Granted: Aug 11, 2026
Kind: B2

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Abstract

The present invention is a polishing pad having a polishing layer for polishing surface of a wafer and a double-sided tape for attaching the polishing layer to an upper turn table of a double-side polishing apparatus, wherein, the double-sided tape has a 90° peeling adhesive strength A of 2000 g/cm or more, and a ratio A/B of the 90° peeling adhesive strength A to a 180° peeling adhesive strength B of 1.05 or more, the double-sided tape has a base material, a polishing-layer-side adhesive layer to be attached to the polishing layer, and an upper-turn-table-side adhesive layer to be attached to the upper turn table, and total thickness of the polishing-layer-side adhesive layer and the upper-turn-table-side adhesive layer is 80 μm or less. This provides a polishing pad capable of suppressing deterioration of flatness of the wafer when performing double-side polishing of the wafer.

Claims (10)

1 . A polishing pad having a polishing layer for polishing surface of a wafer and a double-sided tape for attaching the polishing layer to an upper turn table of a double-side polishing apparatus, wherein,

the double-sided tape has a 90° peeling adhesive strength A of 2000 g/cm or more, and a ratio A/B of the 90° peeling adhesive strength A to a 180° peeling adhesive strength B of 1.05 or more,

the double-sided tape has a base material, a polishing-layer-side adhesive layer to be attached to the polishing layer, and an upper-turn-table-side adhesive layer to be attached to the upper turn table,

and total thickness of the polishing-layer-side adhesive layer and the upper-turn-table-side adhesive layer is 80 μm or less.

2 . The polishing pad according to claim 1 , wherein the double-sided tape has the polishing-layer-side adhesive layer with a thickness of 40 μm or less and the upper-turn-table-side adhesive layer with a thickness of 40 μm or less.

3 . A double-side polishing apparatus comprising, polishing pads, rotatable upper and lower turn tables to which the polishing pads are respectively attached, a carrier having a holding hole for holding a wafer between the upper and lower turn tables, and a slurry supply port for supplying polishing slurry to the wafer held by the carrier,

wherein the polishing pad attached to the upper turn table is the polishing pad according to claim 1 .

4 . A double-side polishing apparatus comprising, polishing pads, rotatable upper and lower turn tables to which the polishing pads are respectively attached, a carrier having a holding hole for holding a wafer between the upper and lower turn tables, and a slurry supply port for supplying polishing slurry to the wafer held by the carrier,

wherein the polishing pad attached to the upper turn table is the polishing pad according to claim 2 .

5 . A double-side polishing method for a wafer, including: holding a wafer in a carrier of a double-side polishing apparatus; interposing the held wafer between an upper turn table and a lower turn table each having a polishing pad according to claim 1 attached thereto; and supplying polishing slurry from a polishing slurry supply port while rotating the upper and lower turn tables to simultaneously polish both surfaces of the wafer.