Wafer grinding parameter optimization method and electronic device

1 . A wafer grinding parameter optimization method adapted to an electronic device, comprising:

obtaining a natural frequency of a grinding wheel spindle by controlling an impact hammer to strike the grinding wheel spindle of wafer processing equipment to generate a force signal, collecting the force signal by a force sensor and receiving a vibration signal by an accelerometer, and accordingly generating a grinding stability lobe diagram corresponding to the grinding wheel spindle;

selecting at least one grinding speed from the grinding stability lobe diagram based on a speed range of the grinding wheel spindle;

determining a plurality of grinding parameter combinations based on the at least one grinding speed;

generating a plurality of grinding simulation result combinations corresponding to the grinding parameter combinations;

selecting a specific grinding parameter combination from the grinding parameter combinations based on each of the grinding simulation result combinations, and setting the wafer processing equipment accordingly, wherein the specific grinding parameter combination comprises a specific grinding speed and a specific turntable speed that are prime to each other; and

processing a wafer by the wafer processing equipment with the specific grinding parameter combination.

2 . The method according to claim 1 , wherein obtaining the natural frequency of the grinding wheel spindle comprises:

obtaining the force signal and the vibration signal generated by the grinding wheel spindle after being knocked, and converting the force signal and the vibration signal into the natural frequency of the grinding wheel spindle.

3 . The method according to claim 1 , wherein each of the grinding parameter combinations comprises at least one geometric parameter and at least one processing parameter, wherein the at least one processing parameter comprises one of the at least one grinding speed.

4 . The method according to claim 3 , wherein the wafer processing equipment comprises a grinding wheel and a turntable, and the at least one geometric parameter comprises at least one of following parameters:

a radius of the grinding wheel;

a radius of a wafer to be ground;

an eccentric distance of the grinding wheel relative to the turntable; and

an inclination angle of the grinding wheel relative to the turntable.

5 . The method according to claim 3 , wherein the wafer processing equipment comprises a grinding wheel and a turntable, and the at least one processing parameter further comprises at least one of following parameters:

a turntable speed of the turntable; and

a grinding wheel feed rate of the grinding wheel.

6 . The method according to claim 1 , wherein each of the grinding simulation result combinations comprises at least one of a grinding depth diagram, a grinding range, a material removing rate, a grinding trajectory diagram, and a maximum grinding depth.

7 . The method according to claim 1 , wherein the grinding stability lobe diagram comprises a plurality of peaks, and selecting the at least one grinding speed from the grinding stability lobe diagram based on the speed range of the grinding wheel spindle comprises:

finding a plurality of specific peaks corresponding to the speed range among the peaks, wherein each of the specific peaks corresponds to a specific speed; and

determining the at least one grinding speed based on the specific speed corresponding to each of the specific peaks.

8 . The method according to claim 7 , wherein a difference between each of the grinding speeds and the specific speed corresponding to one of the specific peaks is less than a preset threshold.

9 . An electronic device, comprising:

a non-transitory storage circuit storing a program code; and

a processor coupled to the non-transitory storage circuit and accessing the program code to:

obtain a natural frequency of a grinding wheel spindle by controlling an impact hammer to strike the grinding wheel spindle of wafer processing equipment to generate a force signal, collect the force signal by a force sensor and receive a vibration signal by an accelerometer, and accordingly generate a grinding stability lobe diagram corresponding to the grinding wheel spindle;

select at least one grinding speed from the grinding stability lobe diagram based on a speed range of the grinding wheel spindle;

determine a plurality of grinding parameter combinations based on the at least one grinding speed;

generate a plurality of grinding simulation result combinations corresponding to the grinding parameter combinations;

select a specific grinding parameter combination from the grinding parameter combinations based on each of the grinding simulation result combinations, and set the wafer processing equipment accordingly, wherein the specific grinding parameter combination comprises a specific grinding speed and a specific turntable speed that are prime to each other; and

process a wafer by the wafer processing equipment with the specific grinding parameter combination.