Mold release film
The mold release film has a multilayer structure in which a mold release layer, a first base material layer, and a second base material layer are laminated. The mold release layer constitutes a mold release surface, and the second base material layer constitutes a surface of the mold release film on an opposite side of the mold release surface. The mold release layer contains one or two or more selected from a silicone resin, a fluororesin, a melamine resin, an epoxy resin, and a phenolic resin. The first base material layer is formed by a stretched or un-stretched film containing one or two or more selected from a polyester resin, a polyolefin resin, and a polyamide resin. The second base material layer is formed by a stretched or un-stretched film containing one or two or more selected from a polyester resin, a polyolefin resin, and a polyamide resin.
1 . A mold release film which has a multilayer structure in which a mold release layer, a first base material layer, and a second base material layer are laminated in this order,
wherein the mold release layer constitutes a mold release surface of the mold release film, and the second base material layer constitutes a surface of the mold release film on an opposite side of the mold release surface,
wherein the mold release layer contains one or two or more selected from a silicone resin, a fluororesin, a melamine resin, an epoxy resin, a phenolic resin, and an acrylic resin, the mold release layer formed by dissolving said one or two or more followed by coating,
wherein the first base material layer is formed by a stretched or un-stretched film containing one or two or more selected from a polyester resin, a polyolefin resin, and a polyamide resin, and
wherein the second base material layer is formed by a stretched or un-stretched film containing one or two or more selected from a polyester resin, a polyolefin resin, and a polyamide resin,
wherein a storage elastic modulus of the mold release film is 10 to 500 MPa at 180° C. when a dynamic viscoelasticity (DMA) is measured under a condition of a temperature rising rate of 5° C./minute and a frequency of 1 Hz.
2 . The mold release film according to claim 1 ,
wherein a value of the mold release film measured by a loop stiffness test is equal to or more than 2 mN/cm.
3 . The mold release film according to claim 1 ,
wherein a rate of dimensional change of the mold release film is 4% to 40% at 180° C. when a temperature is raised from 30° C. to 180° C. at 2° C./minute with a tensile load of 500 mN according to a thermomechanical analysis (TMA).
4 . The mold release film according to claim 1 ,
wherein a surface roughness Ra of the surface of the mold release layer of the mold release film is 0.3 to 2 μm.
5 . The mold release film according to claim 1 ,
wherein a surface roughness Ra of the surface of the mold release layer of the mold release film is less than 0.2 μm.
6 . The mold release film according to claim 1 ,
wherein a total thickness of the first base material layer and the second base material layer is 25 to 70 μm.
7 . The mold release film according to claim 1 ,
wherein in a sealing resin molding process for a resin-sealed semiconductor device in which a semiconductor device is resin-sealed, the mold release film is provided and used by being disposed between a mold and the semiconductor device.