Substrate processing system, aligning apparatus, and substrate shape monitoring method including speed and/or acceleration decreasing protocol

1 . A substrate processing system for processing a substrate, the substrate processing system comprising:

a stage on which the substrate is to be placed;

a rotation mechanism unit configured to rotate the stage;

a sensor configured to detect an outline position of the substrate while the substrate is rotated; and

a control device, wherein

the control device performs control of:

(a) rotating the stage at a first speed and a first acceleration when the substrate is initially rotated;

(b) with reference to information on the outline position of the substrate detected by the sensor when the stage is rotated by one full rotation from a rotation start point to a rotation end point, determining whether a misalignment amount of the outline position of the substrate between the rotation start point and the rotation end point is greater than or equal to a threshold value; and

(c) rotating the stage at a second speed lower than the first speed, a second acceleration lower than the first acceleration, or both, and performing a retry operation of the determination of (b) in response to determining that the misalignment amount of the outline position of the substrate is greater than or equal to the threshold value,

the control device sequentially performs (a), (b) and (c), and

(c) includes determining whether the first speed is an initial speed in response to determining that the misalignment amount of the outline position of the substrate is greater than or equal to the threshold value, and performing the retry operation of the determination of (b) while the stage is rotated at the second speed in response to determining that the first speed is the initial speed.

2 . The substrate processing system according to claim 1 , wherein

the second speed, the second acceleration, or both are set gradually lower in (c) in response to determining that the misalignment amount of the outline position of the substrate is greater than or equal to the threshold value in the retry operation, and

the control device repeats (c) and the retry operation of (b) until it is determined that the misalignment amount of the outline position of the substrate is less than the threshold value, or until the second speed becomes a preset minimum speed and the second acceleration becomes a preset minimum acceleration.

3 . The substrate processing system according to claim 2 , wherein

the control device determines that the outline of the substrate is abnormal and notifies error information in response to determining that the misalignment amount of the outline position of the substrate is greater than or equal to the threshold value as a result of repeating (c) and the retry operation of (b) until the second speed becomes the preset minimum speed and the second acceleration becomes the preset minimum acceleration.

4 . The substrate processing system according to claim 2 , wherein

the control device determines slip while the substrate is rotated in response to determining the misalignment amount of the outline position of the substrate is less than the threshold value as a result of repeating (c) and the retry operation of (b).

5 . The substrate processing system according to claim 2 , wherein

a value of the second speed, a value of the second acceleration, or both that are set gradually lower are set by a user.

6 . The substrate processing system according to claim 1 , wherein

the control device performs:

(d) calculating an eccentric amount of the substrate in response to determining in (b) that the misalignment amount of the outline position of the substrate is less than the threshold value.

7 . The substrate processing system according to claim 1 , wherein

the control device

performs control such that the outline position of the substrate is repeatedly detected with respect to a plurality of said substrates, and

sets an initial speed predetermined as the first speed and an initial acceleration predetermined as the first acceleration and initially rotates the stage at the first speed and the first acceleration when the outline position of each of the plurality of substrates is detected in (a).

8 . The substrate processing system according to claim 1 , wherein

the control device

performs control such that the outline position of the substrate is repeatedly detected with respect to a plurality of said substrates, and

in response to determining that the misalignment amount of the outline position of the substrate is less than the threshold value as a result of performing the retry operation on any previous one of the plurality of substrates while setting the second speed, the second acceleration, or both, sets the second speed or a third speed higher than the second speed as the first speed, the second acceleration or a third acceleration higher than the second acceleration as the first acceleration, or sets the second speed or the third speed as the first speed and the second acceleration or the third acceleration as the first acceleration, and rotates the stage at the first speed, the first acceleration, or both in (a) when detection of outline positions of current and subsequent substrates is to be performed.

9 . The substrate processing system according to claim 1 , wherein

the control device

stores, in a storage unit, a type of the substrate and a rotation speed of the substrate when it is determined that the misalignment amount of the substrate is less than the threshold value,

acquires a type of a current substrate whose outline position is to be detected, and

in response to determining that the type of the substrate stored in the storage unit is a same as the type of the current substrate, sets the rotation speed of the substrate stored in the storage unit when the current substrate is initially rotated after the current substrate is placed on the stage.

10 . An aligning apparatus for aligning a position of a substrate based on information on an outline position of the substrate, the aligning apparatus comprising:

a stage on which the substrate is to be placed;

a rotation mechanism unit configured to rotate the stage; and

a sensor configured to detect the outline position of the substrate while the substrate is rotated, wherein

the sensor detects the outline position of the substrate while the rotation mechanism unit rotates the stage by one full rotation from a rotation start point to a rotation end point at a first speed and a first acceleration,

a retry operation, in which the sensor detects the outline position of the substrate while the rotation mechanism unit rotates the stage by one full rotation from the rotation start point to the rotation end point at a second speed lower than the first speed, a second acceleration lower than the first acceleration, or both, is performed in response to determining that the rotation start point and the rotation end point in the information on the outline position of the substrate detected by the sensor are misaligned by a threshold value or greater, the outline position of the substrate being detected while the stage is rotated at the first speed and the first acceleration, and

the retry operation is performed in response to determining that the first speed is an initial speed and the rotation start point and the rotation end point in the information on the outline position of the substrate detected by the sensor are misaligned by the threshold value or greater.

11 . A substrate shape monitoring method, comprising:

(a) rotating a stage on which a substrate is placed at a first speed and a first acceleration when initially detecting an outline position of the substrate;

(b) with reference to information on the outline position of the substrate detected by a sensor when the stage is rotated by one full rotation from a rotation start point to a rotation end point, determining whether a misalignment amount of the outline position of the substrate between the rotation start point and the rotation end point is greater than or equal to a threshold value; and

(c) rotating the stage at a second speed lower than the first speed, a second acceleration lower than the first acceleration, or both, and performing a retry operation of the determination of (b) in response to determining that the misalignment amount of the outline position of the substrate is greater than or equal to the threshold value,

wherein (a), (b), and (c) are sequentially performed, and

wherein (c) includes determining whether the first speed is an initial speed in response to determining that the misalignment amount of the outline position of the substrate is greater than or equal to the threshold value, and performing the retry operation of the determination of (b) while the stage is rotated at the second speed in response to determining that the first speed is the initial speed.

12 . The substrate processing system according to claim 1 , wherein

the second speed is a minimum speed at which the substrate does not slip with respect to the stage, and

(c) includes determining whether the first speed is the minimum speed in response to determining that the misalignment amount of the outline position of the substrate is greater than or equal to the threshold value, and performing the retry operation of the determination of (b) while the stage is rotated at the second speed in response to determining that the first speed is not the minimum speed.