IP Library › Granted Patent US 12703814
Granted Patent B2
US 12703814 · App. 18/017,791 · Granted Aug 11, 2026

Thermosetting composition, cured product, device, and method for manufacturing the device

Inventors: Haruka Fujita (Tokyo, JP); Takashi Saruwatari (Mie, JP); Hiroki Shinozaki (Mie, JP)
Assignee: Panasonic Intellectual Property Management Co., Ltd.
C09J163/00
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Quick Facts
Patent No.
US 12703814
App. No.
18/017,791
Granted
Aug 11, 2026
Kind
B2
Abstract

A thermosetting composition according to the present disclosure contains: an epoxy resin (A); a thiol compound (B) having at least two thiol groups per molecule; a radical polymerizable compound (C); a photo radical polymerization initiator (D); and a radical scavenger (E).

Claims (29)

1 . A thermosetting composition containing:

an epoxy resin (A);

a thiol compound (B) having at least two thiol groups per molecule;

a radical polymerizable compound (C);

a photo radical polymerization initiator (D);

a radical scavenger (E); and

a carbodiimide compound (H), wherein:

a ratio of a thiol group equivalent of the thiol compound (B) to one epoxy equivalent of the epoxy resin (A) is equal to or greater than 0.75 and equal to or less than 10.0,

a proportion of the radical scavenger (E) with respect to an entirety of the thermosetting composition is equal to or greater than 0.03% by mass and equal to or less than 0.2% by mass, and

a proportion of the carbodiimide compound (H) with respect to the total of the epoxy resin (A), the thiol compound (B), and the radical polymerizable compound (C) is equal to or less than 15% by mass.

2 . The thermosetting composition of claim 1 , further containing a curing catalyst (F).

3 . The thermosetting composition of claim 2 , wherein

the curing catalyst (F) includes a microcapsule latent curing catalyst (F1).

4 . The thermosetting composition of claim 3 , further containing an organic boric acid compound (G).

5 . The thermosetting composition of claim 1 , further containing an inorganic filler (I).

6 . The thermosetting composition of claim 1 , wherein

the thermosetting composition is an adhesive.

7 . The thermosetting composition of claim 2 , further containing an inorganic filler (I).

8 . The thermosetting composition of claim 3 , further containing an inorganic filler (I).

9 . The thermosetting composition of claim 4 , further containing an inorganic filler (I).

10 . The thermosetting composition of claim 6 , further containing an inorganic filler (I).

11 . A cured product formed by curing the thermosetting composition of claim 1 .

12 . The cured product of claim 11 , further containing an inorganic filler (I).

13 . A device comprising: a first part; a second part; and a cured product interposed between the first part and the second part to bond the first part and the second part together,

the cured product being formed by curing the thermosetting composition of claim 1 .

14 . A method for manufacturing a device, the device including: a first part; a second part; and a cured product interposed between the first part and the second part to bond the first part and the second part together, the method comprising:

interposing the thermosetting composition of claim 1 between the first part and the second part;

irradiating the thermosetting composition with light to temporarily bond the first part and the second part together; and then

heating the thermosetting composition to form the cured product.