Electroplating systems and methods with increased metal ion concentrations
Electroplating methods may include providing an electrolyte feedstock comprising copper to a first compartment of an electrochemical cell. The methods may include providing an acidic solution to a second compartment of the electrochemical cell. The first compartment and second compartment may be separated by a membrane. The methods may include applying a current to an anode of the electrochemical cell. The anode of the electrochemical cell may be disposed proximate the first compartment and across from the membrane. The methods may include forming an anolyte and catholyte precursor.
1 . An electroplating method comprising:
providing an electrolyte feedstock to a first compartment and a second compartment of an existing plating chamber, wherein the first compartment and second compartment are separated by a membrane;
applying a current to an anode positioned in the existing plating chamber, wherein the anode is disposed proximate the first compartment and across from the membrane;
increasing a copper ion concentration in the electrolyte feedstock in the first compartment to form a catholyte;
directing the catholyte to a storage tank in fluid communication with the existing plating chamber;
providing a dilute electrolyte feedstock to the first compartment;
increasing a copper ion concentration in the electrolyte feedstock in the first compartment to form an anolyte; and
subsequent to forming the anolyte, directing the catholyte from the storage tank to a catholyte tank.
2 . The electroplating method of claim 1 , further comprising:
subsequent to forming the anolyte, transitioning the existing plating chamber to production mode.
3 . The electroplating method of claim 1 , wherein:
the catholyte and the anolyte are each characterized by a copper ion concentration of greater than 65.0 g/L.
4 . The electroplating method of claim 1 , wherein the current applied to the anode of the existing plating chamber is greater than 10 amperes.
5 . The electroplating method of claim 1 , wherein a temperature is maintained at greater than 40° C. while forming the catholyte and the anolyte.
6 . The electroplating method of claim 1 , wherein the existing plating chamber is operable to electroplate copper material from the catholyte onto a substrate.
7 . An electroplating method comprising:
transitioning an existing plating chamber from production mode to up concentration mode;
providing an electrolyte feedstock to a first compartment and a second compartment of the existing plating chamber, wherein the first compartment and second compartment are separated by a membrane;
applying a current to an anode positioned in the existing plating chamber, wherein the anode is disposed proximate the first compartment and across from the membrane;
increasing a copper ion concentration in the electrolyte feedstock in the first compartment to form a catholyte;
directing the catholyte to a storage tank in fluid communication with the existing plating chamber;
providing a dilute electrolyte feedstock to the first compartment;
increasing a copper ion concentration in the electrolyte feedstock in the second compartment to form an anolyte; and
transitioning the existing plating chamber from up concentration mode to production mode.
8 . The electroplating method of claim 7 , wherein the catholyte and the anolyte are each characterized by a copper ion concentration of greater than or about 65.0 g/L.