Sensing assembly
The present disclosure provides a core temperature sensing assembly for measuring a core temperature of an object when positioned on a surface of the object. The sensing assembly uses a heat flux sensor in the form of a thermoelectric generator. The thermoelectric generator is provided as part of an integrated circuit. Alternatively or additionally, the sensing assembly uses the thermoelectric generator to actively heat or cool the object. Alternatively or additionally, the sensing assembly comprises a second heat flux sensor in the form of a thermoelectric generator, the first and second heat flux sensors having different thermal resistances determined by the configuration of the thermocouples.
1 . A core temperature sensing assembly to determine a core temperature of an object when positioned on a surface of the object, comprising:
a first sensor device for placement at a first surface location, the first sensor device comprising:
a first heat flux sensor configured to measure a heat flux at the first surface location and output a first heat flux signal relating to the measured heat flux; and
a first temperature sensor configured to measure a temperature at the first surface location and output a first temperature signal relating to the measured temperature,
wherein the first heat flux sensor is a first thermoelectric generator (TEG); and
wherein the core temperature sensing assembly comprises a first integrated circuit comprising the first TEG.
2 . The core temperature sensing assembly of claim 1 , wherein the core temperature sensing assembly is further configured to cause the first TEG of the first sensor device to actively heat or cool the first surface location.
3 . The core temperature sensing assembly of claim 1 , further comprising a second TEG comprised in a second integrated circuit and configured to measure a heat flux at a second surface location and output a second heat flux signal relating to the measured heat flux, wherein the first integrated circuit and second integrated circuit are parts of a single unitary integrated circuit with a single substrate.
4 . The core temperature sensing assembly of claim 1 , wherein the first integrated circuit is a monolithic integrated circuit die.
5 . The core temperature sensing assembly of claim 4 , wherein the monolithic integrated circuit die comprises a substrate and a dielectric layer over the substrate, and wherein a plurality of thermoelectric elements of the first thermoelectric generator are disposed within the dielectric layer.
6 . The core temperature sensing assembly of claim 1 , wherein the first integrated circuit further comprises the first temperature sensor.
7 . The core temperature sensing assembly of claim 6 ,
wherein the first integrated circuit comprises a substrate and the first TEG comprises at least one thermocouple provided in or on the substrate; and
wherein the first temperature sensor is located proximate to or in contact with the at least one thermocouple of the first TEG.
8 . The core temperature sensing assembly of claim 7 , wherein the first temperature sensor is located on or adjacent to one of: a backside of the substrate, and a frontside of a capping layer provided over the at least one thermocouple.
9 . The core temperature sensing assembly of claim 1 , further comprising a second sensor device for placement at a second surface location, the second sensor device comprising:
a second heat flux sensor configured to measure a heat flux at the second surface location and output a second heat flux signal relating to the measured heat flux; and
a second temperature sensor configured to measure a temperature at the second surface location and output a second temperature signal relating to the measured temperature,
wherein the second heat flux sensor is a second thermoelectric generator (TEG).
10 . The core temperature sensing assembly of claim 9 ,
wherein the first TEG has a first thermal resistance and the second TEG has a second thermal resistance; and
wherein the first thermal resistance and the second thermal resistances are different.
11 . The core temperature sensing assembly of claim 10 , wherein the first TEG has a first thermocouple configuration and the second TEG has a second thermocouple configuration, wherein the first thermocouple configuration and the second thermocouple configuration are different so as to provide the different first thermal resistance and second thermal resistance, wherein the first thermocouple configuration and the second thermocouple configuration are each determined by a number of thermocouples, an area of a substrate covered by the thermocouples, a thermal resistance of materials used in the thermocouples, a height of the thermocouples, or any combination thereof.
12 . The core temperature sensing assembly of claim 10 , wherein one of the first TEG or the second TEG further comprises an insulating layer so as to modify a corresponding one of the first thermal resistance or the second thermal resistance.
13 . The core temperature sensing assembly of claim 9 further comprising a second integrated circuit comprising the second TEG.
14 . The core temperature sensing assembly of claim 13 , wherein the first integrated circuit and the second integrated circuit are a single integrated circuit.
15 . The core temperature sensing assembly of claim 13 , wherein the second integrated circuit further comprises the second temperature sensor.
16 . The core temperature sensing assembly of claim 15 ,
wherein the second integrated circuit comprises a substrate and the second TEG comprises at least one thermocouple provided in or on the substrate; and
wherein the second temperature sensor is located proximate to or in contact with the at least one thermocouple of the second TEG, wherein the first second temperature sensor is located on or adjacent to one of: a backside of the substrate, and a frontside of a capping layer provided over the at least one thermocouple.
17 . A core temperature sensing system, comprising
a core temperature sensing assembly comprising:
a first sensor device for placement at a first surface location, the first sensor device comprising:
a first heat flux sensor configured to measure a heat flux at the first surface location and output a first heat flux signal relating to the measured heat flux; and
a first temperature sensor configured to measure a temperature at the first surface location and output a first temperature signal relating to the measured temperature,
wherein the first heat flux sensor is a first thermoelectric generator (TEG); and
wherein the sensing assembly comprises a first integrated circuit comprising the first TEG; and
a controller configured to:
receive the first heat flux signal from the first heat flux sensor;
receive the first temperature signal from the first temperature sensor; and
calculate a core temperature based on the measured heat flux from the first heat flux signal and the measured temperature from the first temperature signal.
18 . The core temperature sensing system of claim 17 ,
wherein the core temperature sensing assembly further comprises a second sensor device for placement at a second surface location, the second sensor device comprising:
a second heat flux sensor configured to measure a heat flux at the second surface location and output a second heat flux signal relating to the measured heat flux; and
a second temperature sensor configured to measure a temperature at the second surface location and output a second temperature signal relating to the measured temperature,
wherein the second heat flux sensor is a second thermoelectric generator; and
wherein the controller is further configured to:
receive the second heat flux signal from the second heat flux sensor;
receive the second temperature signal from the second temperature sensor; and
calculate the core temperature based on the measured heat flux from the first heat flux signal, the measured temperature from the first temperature signal, the measured heat flux from the second heat flux signal and the measured temperature from the second temperature signal.
19 . The core temperature sensing system of claim 17 , wherein the first integrated circuit further comprises the first temperature sensor.
20 . The core temperature sensing system of claim 19 ,
wherein the first integrated circuit comprises a substrate and the first TEG comprises at least one thermocouple provided in or on the substrate; and
wherein the first temperature sensor is located proximate to or in contact with the at least one thermocouple of the first TEG.
21 . The core temperature sensing system of claim 20 , wherein the first temperature sensor is located on or adjacent to one of: a backside of the substrate, and a frontside of a capping layer provided over the at least one thermocouple.
22 . A method for determining a core temperature of an object, comprising:
receiving a first heat flux signal from a first heat flux sensor of a first sensor device relating to a measured first heat flux and receiving a first temperature signal from a first temperature sensor of the first sensor device relating to a measured first temperature, the first heat flux sensor being a first thermoelectric generator (TEG) and the first sensor device comprising a first integrated circuit comprising the first TEG;
calculating a core temperature based on the measured first heat flux from the first heat flux signal and the measured first temperature from the first temperature signal:
receiving a second heat flux signal from a second heat flux sensor of a second sensor device relating to a measured second heat flux and receiving a second temperature signal from a second temperature sensor of the second sensor device relating to a measured second temperature, the second heat flux sensor being a second TEG and the second sensor device comprising a second integrated circuit comprising the second TEG; and
calculating a core temperature based on the measured first heat flux from the first heat flux signal, the measured first temperature from the first temperature signal, the measured second heat flux from the second heat flux signal and the measured second temperature from the second temperature signal.
23 . One or more non-transitory computer readable media having a computer program stored thereon, the computer program comprising computer program code which is configured, when said computer program is run on one or more physical computing devices, to cause said one or more physical computing devices to implement the method of claim 22 .