Refrigeration chip, refrigeration system, and sample testing system and method
View Patent ↗The embodiments of the present disclosure disclose a refrigeration chip, a refrigeration system, and a sample testing system and method. The refrigeration chip is in contact with a low-temperature cold source, is used for refrigerating a sample, and comprises a heating layer and a heat conducting layer that are disposed in sequence. The heating layer comprises at least one temperature control unit that is disposed on the heat conducting layer; and the heat generated by the temperature control unit is transferred to the low-temperature cold source along the thickness direction of the heat conducting layer. The described technology enables a particular time period to be selected for refrigeration and thawing during the in-situ observation and representation of a sample, and refrigeration and heating rates higher than 105° C./s are attained by means of an interface thermal resistance design, thus ensuring that the sample is not damaged. The described technology is a significant improvement to operations related to the refrigeration, thawing, in-situ microscopic observation and so on of biological samples, and has great significance and broad application prospects.
1 . A refrigeration chip, wherein, the refrigeration chip is configured to be positioned in contact with a low-temperature cold source, and the refrigeration chip comprising: a heating layer, a thermal conductive layer, and a chip substrate arranged in sequence, with the thermal conductive layer positioned between the heating layer and the chip substrate;
wherein, the heating layer comprises a plurality of temperature control units disposed on the thermal conductive layer; and the heat generated by at least one temperature control unit of the plurality of temperature control units is configured to be transferred to the low-temperature cold source along a thickness direction of the thermal conductive layer,
wherein a thermal conductivity of the chip substrate is greater than a thermal conductivity of the thermal conductive layer, and
wherein the refrigeration chip further comprises a thermal insulation element arranged laterally between adjacent temperature control units of the plurality of temperature control units.
2 . The refrigeration chip according to claim 1 , wherein, each of the plurality of temperature control units is an assembly formed by a plurality of heating elements arranged in an array, or a heating element with a predetermined surface area.
3 . The refrigeration chip according to claim 1 , further comprising:
a sample placement layer, which is located on the heating layer, and the surface of the sample placement layer has a local temperature control region for placing the sample, and an area of the local temperature control region corresponds to a surface area of a respective temperature control unit of the plurality of temperature control units.
4 . The refrigeration chip according to claim 3 , wherein, the local temperature control region is provided with one or more of at least one closed sample containing cavity or open sample containing cavity for containing the sample.
5 . The refrigeration chip according to claim 4 , wherein, the plurality of temperature control units further include an auxiliary temperature control unit disposed on one or more of the wall of the closed sample containing cavity or the open sample containing cavity.
6 . The refrigeration chip according to claim 3 , wherein the sample placement layer and the heating layer are integrated with each other or separate from each other.
7 . The refrigeration chip according to claim 1 , wherein, the thermal conductivity of the thermal insulation element is not greater than the thermal conductivity of the thermal conductive layer, and the lateral thermal conductivity of the thermal insulation element is smaller than the lateral thermal conductivity of the thermal conductive layer.
8 . The refrigeration chip according to claim 1 , wherein
the chip substrate supports the thermal conductive layer.
9 . The refrigeration chip according to claim 8 , wherein, the chip substrate is provided with an accommodating chamber for accommodating a low-temperature cold source.
10 . The refrigeration chip according to claim 1 , wherein, the refrigeration chip is provided with optical path channels to adapt to microscopes, photodetectors, X-rays, Raman spectrometers, and infrared spectrometers.
11 . The refrigeration chip according to claim 10 , wherein the refrigeration chip is made of a light transmissive material or has perforated channels as the optical path channels.
12 . The refrigeration chip of claim 1 , wherein, the refrigeration chip is made by the chip micro-nano processing technology.
13 . The refrigeration chip according to claim 12 , wherein, the thickness of the refrigeration chip is in a range from 0.1 to 2 mm, inclusive.
14 . A refrigeration system, comprising:
a sample stage assembly having the refrigeration chip of claim 1 and a controller electrically connected to the plurality of temperature control units, the controller configured to adjust a temperature of at least one of the plurality of temperature control units;
a low-temperature cold source; and
a heat sink base for fixing the sample stage assembly, which is in contact with the low-temperature cold source.
15 . The refrigeration system according to claim 14 , further comprising:
a freezing medium sealing cover plate, which is used for sealing the low-temperature cold source.
16 . The refrigeration system according to claim 14 , further comprising:
a sample cover, the area of which is capable of at least sealing the opening of the heat sink base.
17 . A sample testing system comprising the refrigeration system according to claim 14 , comprising;
one or more of a microscopic observation device or a detection device,
wherein, the microscopic observation device is at least one of an upright optical microscope or an electron microscope; and
the detection device is at least one of a photodetector, an X-ray, a Raman spectrometer, or an infrared spectrometer.
18 . The refrigeration system according to claim 14 , further comprising: a sample heat sink, in which the refrigeration chip is positioned.