Independent thermal controller for memory devices and device interface boards
Systems and methods of independent thermal control of devices under test (DUTs) (e.g., memory devices) are disclosed herein. DUTs are coupled to dedicated cooling channels that include one or more controllable fans. The fans can be controlled independently according to temperature information of the DUTs, which is typically measured by an internal temperature sensor disposed in the DUTs. The fans of the cooling channels can be top-mounted (e.g., downdraft), bottom-mounted (e.g., updraft), or mounted on the front side of a DUT. Each cooling channel also has an exhaust channel on the front, top, and/or bottom of the channel for releasing heat. Advantageously, the air in the channel is guided by a shroud or cover placed over the DUT that can include internal vectored louvres, ridges, fins, ducts, chambers, etc., for directing air across surfaces of the DUT to evenly and efficiently cool the DUT during testing.
1 . A device interface board (DIB) for testing a device under test, the DIB comprising:
a temperature sensor board; and
a controller board,
wherein the temperature sensor board is operable to receive temperature information, wherein the controller board is operable to independently control the operation of a plurality of fans for selectively cooling a plurality of devices under test (DUTs) to a plurality of respective temperatures, wherein each DUT of the plurality of DUTs is cooled independently from every other DUT of the plurality of DUTs, and wherein the plurality of DUTs are disposed in a plurality of shrouds, and are operatively coupled to the controller board of the DIB for testing thereof.
2 . The DIB as described in claim 1 , further comprising an LED bar that displays DUT status information according to the temperature information received by the temperature sensor board.
3 . The DIB as described in claim 1 , wherein each DUT of the plurality of DUTs is disposed in a respective shroud of said plurality of shrouds and wherein each respective shroud encloses a corresponding DUT and guides air over surfaces of the corresponding DUT to evenly cool the corresponding DUT during testing.
4 . The DIB as described in claim 3 , wherein the plurality of fans comprises two front-mounted fans for each DUT of the plurality of DUTs, and wherein the front-mounted fans blow air that is exhausted out of at least one of: a top of the plurality of shrouds; and a bottom of the plurality of shrouds.
5 . The DIB as described in claim 3 , wherein the plurality of shrouds comprise a plurality of fins respectively disposed on an interior surface of the plurality of shrouds to guide air across the surfaces of the plurality of DUTs.
6 . The DIB as described in claim 3 , wherein the plurality of shrouds are composed of plastic and produced by a 3D printer.
7 . The DIB as described in claim 1 , wherein the plurality of DUTs comprises at least 16 DUTs.
8 . The DIB as described in claim 1 , wherein the plurality of fans are independently controllable via the controller board according to the temperature information and operable to cause the plurality of DUTs to reach a prescribed temperature.
9 . The DIB as described in claim 1 , wherein the plurality of fans are independently controlled by the controller board according to the temperature information, and wherein the temperature information comprises internal DUT temperature sensor information.
10 . The DIB as described in claim 1 , wherein the plurality of fans comprises two respective bottom-mounted fans for each DUT of the plurality of DUTs that provide updraft airflow to cool the plurality of DUTs.
11 . The DIB as described in claim 1 , wherein the plurality of fans comprises two respective top-mounted fans for each DUT of the plurality of DUTs that provide downdraft airflow to cool the plurality of DUTs.
12 . The DIB as described in claim 1 , wherein the plurality of shrouds comprise respective internal vectored louvers operable to direct air along respective surfaces of the plurality of DUTs.
13 . The DIB as described in claim 12 , wherein the plurality of DUTs comprise respective cooling fins disposed on the DUTs, and wherein the respective internal vectored louvers are operable to direct air along a length of the cooling fins.
14 . The DIB as described in claim 12 , wherein the internal vectored louvers are operable to split air between different respective surfaces of the plurality of DUTs.
15 . A method of thermal management for testing a plurality of devices under test (DUTs), the method comprising:
accessing temperature information of a plurality of DUTs;
controlling a plurality of fans to selectively cool the plurality of DUTs to a plurality of respective temperatures according to the temperature information, wherein each DUT of the plurality of DUTs is associated with at least one respective fan of the plurality of fans, wherein a first DUT of the plurality of DUTs is cooled independently from a second DUT of the plurality of DUTs; and
performing a test on the plurality of DUTs, wherein the test is performed at the plurality of respective temperatures.
16 . The method as described in claim 15 , further comprising illuminating an LED bar to display DUT status information of the plurality of DUTs according to the temperature information during execution of test.
17 . The method as described in claim 15 , wherein each DUT of the plurality of DUTs are disposed in respective shrouds that enclose the plurality of DUTs and further comprising using the shrouds to guide air over surfaces of the plurality of DUTs to evenly cool the plurality of DUTs during testing.
18 . The method as described in claim 17 , wherein the plurality of fans comprises two respective front-mounted fans for each DUT of the plurality of DUTs, and further comprising using the front-mounted fans to blow air that is exhausted out of at least one of: a top of the shrouds; and a bottom of the shrouds.
19 . The method as described in claim 17 , wherein the shrouds comprise respective fins disposed on an interior surface of the shrouds and further comprising using the respective fins to guide air across the surfaces of the plurality of DUTs.
20 . The method as described in claim 17 , wherein the plurality of DUTs comprise respective cooling fins disposed on the plurality of DUTs, and wherein the shrouds comprise a top exhaust port and internal vectored louvers operable to direct air along a length of the cooling fins.
21 . A method of thermal management for testing a plurality of devices under test (DUTs), the method comprising:
accessing temperature information of a plurality of DUTs; and
controlling a plurality of fans using thermal control signals sent by a controller board to selectively cool the plurality of DUTs to a plurality of respective temperatures according to the temperature information using an independent thermal control (ITC) device interface board (DIB), the DIB comprising:
a temperature sensor board operable to provide the temperature information; and the controller board operable to send and receive the thermal control signals,
wherein a first DUT of the plurality of DUTs is cooled independently from a second DUT of the plurality of DUTs.
22 . The method of claim 21 , wherein the temperature sensor board is operable to receive temperature information from the plurality of DUTs, wherein the controller board is operable to independently control the operation of a plurality of fans for cooling the plurality of devices under test (DUTs), wherein a plurality of shrouds are formed to enclose the plurality of DUTs, and wherein the plurality of DUTs are operatively coupled to controller board of the ITC DIB.
23 . The method of claim 21 , wherein the plurality of DUTs comprise solid state drives (SSDs) disposed in respective external hard drive enclosures, and wherein the external hard drive enclosures comprise a respective independent cooling channel and a respective thermal feedback control system, wherein the respective feedback control system comprises a controller to control the respective independent cooling channel.
24 . The method of claim 21 , wherein the controlling a plurality of fans using thermal control signals comprises:
controlling some fans of the plurality of fans to perform stress testing; and
controlling other fans of the plurality of fans to perform device testing under normal operating conditions concurrently with the stress testing.