Optoelectronic package
An optoelectronic package is provided. The optoelectronic package includes a photonic structure, an alignment component and a light transmission element. The photonic structure includes an optical I/O. The alignment component includes a through hole extending through the alignment component and aligned with the optical I/O of the photonic structure. The light transmission element entirely fills the through hole of the alignment component.
1 . An optoelectronic package, comprising:
a photonic structure including an upper surface and a waveguide embedded therein and disposed adjacent to the upper surface, wherein the waveguide has a first port exposed from the upper surface and configured to couple an optical signal, and a second port opposite to the first port and exposed from the upper surface;
a component fixing a light transmission channel and aligning the light transmission channel with the first port of the waveguide through a plurality of alignment pads on the component, wherein the light transmission channel includes a light communication port aligned with the first port of the waveguide;
a coupling material disposed between the light communication port and the first port of the waveguide; and
an optoelectronic component coupled with the second port of the waveguide, wherein the optoelectronic component horizontally overlaps the light communication port of the light transmission channel and the coupling material.
2 . The optoelectronic package of claim 1 , wherein one of the plurality of alignment pads vertically overlaps a portion of the waveguide.
3 . The optoelectronic package of claim 1 , wherein the waveguide includes a horizontal portion connected to the first port and the second port, the photonic structure further includes a plurality of bonding pads disposed adjacent to the upper surface, and one of the plurality of bonding pads vertically overlaps a portion of the horizontal portion.
4 . The optoelectronic package of claim 3 , wherein the horizontal portion of the waveguide extends along an extending direction that is substantially parallel to the upper surface of the photonic structure.
5 . An optoelectronic package, comprising:
a carrier including a first surface;
a photonic structure disposed on the first surface of the carrier and including an optical I/O, wherein the photonic structure has an upper surface, a lower surface opposite to the upper surface, and a lateral surface extending between the upper surface and the lower surface, wherein the optical I/O is exposed from the lateral surface, and the optical I/O includes an optical surface aligned with the lateral surface of the photonic structure;
a component aligning a light transmission channel with the optical I/O of the photonic structure in a first direction that is substantially parallel to the first surface of the carrier, wherein the light transmission channel includes a light communication port horizontally aligned with the optical I/O of the photonic structure, and wherein the optical surface of the optical I/O faces the light transmission channel;
a coupling material disposed between the light communication port and the optical I/O and vertically overlapping a portion of the carrier; and
a plurality of connectors connecting a plurality of alignment pads of the component to a plurality of bonding pads exposed from the lateral surface of the photonic structure, wherein the coupling material vertically overlaps the plurality of connectors.
6 . The optoelectronic package of claim 5 , wherein the component includes a plurality of alignment pads electrically connected to the carrier and vertically overlapping portions of the light transmission channel.
7 . The optoelectronic package of claim 6 , wherein the component further includes a V-groove horizontally aligned with the optical I/O of the photonic structure, and wherein the plurality of alignment pads vertically overlap portions of the V-groove.