Substrate treatment method, storage medium, and substrate treatment apparatus
A substrate treatment method performs a treatment for forming a pattern of a metal-containing resist on a substrate. The method includes changing an acid concentration in a substrate existence space where the substrate exists in a substrate treatment apparatus before a developing treatment of a film of the metal-containing resist.
1 . A substrate treatment method of performing a treatment for forming a pattern of a metal-containing resist on a substrate, the substrate treatment method comprising
increasing an acid concentration in a substrate existence space where the substrate exists in a substrate treatment apparatus during a period after an exposure treatment on a film of the metal-containing resist and before transferring into a part for performing a post exposure bake treatment.
2 . The substrate treatment method according to claim 1 , wherein:
the substrate existence space includes:
a treatment space where a predetermined treatment is performed on the substrate; and
a transfer space where a transfer mechanism configured to transfer the substrate to the treatment space is provided; and
the acid concentration in the treatment space is increased, when the acid concentration in the substrate existence space is changed; and
the acid concentration in the transfer space is maintained equal to or lower than a minimum acid concentration in the treatment space by feeding air with an adjusted acid concentration.
3 . The substrate treatment method according to claim 2 , wherein:
the acid concentration of the air is adjusted by a collection component that collects acidic fluid.
4 . The substrate treatment method according to claim 1 , wherein
the acid concentration in the substrate existence space is increased between a formation of the film of the metal-containing resist and an exposure treatment on the film.
5 . The substrate treatment method according to claim 1 , wherein
the acid concentration in the substrate existence space is increased between an exposure treatment on the film of the metal-containing resist and a post exposure bake treatment.
6 . The substrate treatment method according to claim 1 , wherein
the acid concentration in the substrate existence space is increased between a post exposure bake treatment and the exposure treatment.
7 . The substrate treatment method according to claim 1 , wherein
the acid concentration in the substrate existence space is increased between transfer of the substrate to an inside of the substrate treatment apparatus and a formation of the film of the metal-containing resist.
8 . The substrate treatment method according to claim 1 , wherein
the acid concentration in the substrate existence space is increased in each of a plurality of periods included before the exposure treatment.
9 . The substrate treatment method according to claim 8 , wherein the plurality of periods are before the post exposure bake treatment and after the post exposure bake treatment.
10 . A substrate treatment apparatus for performing a treatment for forming a pattern of a metal-containing resist on a substrate, the substrate treatment apparatus comprising
an acid concentration change part configured to increase an acid concentration in a substrate existence space where the substrate exists in the substrate treatment apparatus during a period after an exposure treatment on a film of the metal-containing resist and before transferring into a part for performing a post exposure bake treatment.
11 . The substrate treatment apparatus according to claim 10 , wherein:
the substrate existence space includes:
a treatment space where a predetermined treatment is performed on the substrate; and
a transfer space where a transfer mechanism configured to transfer the substrate to the treatment space is provided; and
the acid concentration change part increases the acid concentration in the treatment space when changing the acid concentration in the substrate existence space; and
the acid concentration in the transfer space is maintained equal to or lower than a minimum acid concentration in the treatment space by feeding air with an adjusted acid concentration.
12 . The substrate treatment apparatus according to claim 11 , further comprising:
a collection component that collects acidic fluid, wherein the acid concentration of the air is adjusted by the collection component.
13 . The substrate treatment apparatus according to claim 10 , wherein
the acid concentration change part increases the acid concentration in the substrate existence space in each of a plurality of periods included before the exposure treatment.
14 . A substrate treatment method of performing a treatment for forming a pattern of a metal-containing resist on a substrate, the substrate treatment method comprising
increasing an acid concentration in a substrate existence space where the substrate exists in a substrate treatment apparatus during a period after transferring out from a part for performing a post exposure bake treatment and before a developing treatment of a film of the metal-containing resist.
15 . A substrate treatment apparatus for performing a treatment for forming a pattern of a metal-containing resist on a substrate, the substrate treatment apparatus comprising
an acid concentration change part configured to increase an acid concentration in a substrate existence space where the substrate exists in the substrate treatment apparatus during a period after transferring out from a part for performing a post exposure bake treatment and before a developing treatment of a film of the metal-containing resist.