Programming methods for memory devices, memory devices and memory systems to decrease programming time of a programming operation
A programming method for a memory device, a memory device and a memory system including applying first and second pass voltages with different ramp timings. The programming method includes: applying a programming voltage on a selected word line; applying a first pass voltage on a first word line adjacent to the selected word line; and applying a second pass voltage on a second word line adjacent to the selected word line, wherein the first pass voltage and the second pass voltage include at least two ramp phases, and the first pass voltage and the second pass voltage have different ramp timings in at least one ramp phase among other ramp phases after the first ramp phase, and the ramp timing is the timing when the voltage value starts to ramp up from a certain voltage value.
1 . A programming method for a memory device, comprising:
applying a programming voltage on a selected word line;
applying a first pass voltage on a first word line adjacent to the selected word line; and
applying a second pass voltage on a second word line adjacent to the selected word line, wherein the first pass voltage and the second pass voltage include at least two successive ramp phases, the first pass voltage and the second pass voltage have different ramp timings in a second ramp phase after a first ramp phase and the second ramp phase begins at a first voltage of the first ramp phase, the first voltage being greater than any other voltage of the first ramp phase, and a ramp timing is a timing when a voltage value starts to ramp up from a certain voltage value.
2 . The programming method of claim 1 , wherein the at least two successive ramp phases include two ramp phases, and the ramp timing of the second ramp phase of the second pass voltage precedes the ramp timing of the second ramp phase of the first pass voltage.
3 . The programming method of claim 2 , wherein a time interval between the ramp timing of the second ramp phase of the first pass voltage and the ramp timing of the second ramp phase of the second pass voltage is influenced by a pulse width of the programming voltage and a ramp speed of a ramp phase of the programming voltage.
4 . The programming method of claim 1 , wherein the first pass voltage and the second pass voltage are provided by different voltage sources, and
when a maximum voltage value of the first pass voltage is given, a speed at which the first pass voltage reaches the maximum voltage value of the first pass voltage is controlled by controlling pulse widths of the respective ramp phases provided by a first voltage source; or
when a maximum voltage value of the second pass voltage is given, a speed at which the second pass voltage reaches the maximum voltage value of the second pass voltage is controlled by controlling the pulse widths of the respective ramp phases provided by a second voltage source.
5 . The programming method of claim 1 , wherein after respective ramp phases end, a maximum voltage value of the first pass voltage and a maximum voltage value of the second pass voltage are equal.
6 . The programming method of claim 1 , further including applying a third pass voltage to other word lines other than the first word line, the second word line, and the selected word line, wherein, after respective ramp phases end, a maximum voltage value of the third pass voltage is different from the maximum voltage values of the first pass voltage and the second pass voltage.
7 . The programming method of claim 1 , wherein applying the programming voltage on the selected word line includes applying the programming voltage including a plurality of pulse phases, wherein:
in a previous pulse phase, a first sub-programming voltage is applied to the selected word line; and
in a subsequent pulse phase, a second sub-programming voltage is applied to the selected word line, a voltage value of the first sub-programming voltage is smaller than a voltage value of the second sub-programming voltage.
8 . The programming method of claim 1 , wherein applying the programming voltage on the selected word line includes applying the programming voltage including a plurality of pulse phases, wherein:
in a previous pulse phase, a first sub-pass voltage is applied on the first word line, and a second sub-pass voltage is applied on the second word line; and
in a subsequent pulse phase, a third sub-pass voltage is applied on the first word line, and a fourth sub-pass voltage is applied on the second word line, wherein, after respective ramp phases end, a voltage value of the first sub-pass voltage is smaller than a voltage value of the third sub-pass voltage, and a voltage value of the second sub-pass voltage is smaller than a voltage value of the fourth sub-pass voltage.
9 . The programming method of claim 1 , wherein applying the programming voltage on the selected word line includes applying the programming voltage including a plurality of pulse phases and, in a pulse phase of the plurality of pulse phases, a pass voltage applied to the first word line and a pass voltage applied to the second word line include at least two ramp phases, and the pass voltage applied to the first word line and the pass voltage applied to the second word line have different ramp timings in at least one ramp phase among other ramp phases after the first ramp phase.
10 . A memory device, comprising:
a memory cell array including a plurality of memory strings including a plurality of memory cells;
a plurality of word lines, a word line of the plurality of word lines coupled with a corresponding memory cell in the plurality of memory strings; and
a periphery circuit coupled with the plurality of word lines and configured to:
apply a programming voltage on a selected word line;
apply a first pass voltage on a first word line adjacent to the selected word line; and
apply a second pass voltage on a second word line adjacent to the selected word line, wherein the first pass voltage and the second pass voltage include at least two successive ramp phases, the first pass voltage and the second pass voltage have different ramp timings in a second ramp phase after a first ramp phase and the second ramp phase begins at a first voltage of the first ramp phase, the first voltage being greater than any other voltage of the first ramp phase, and a ramp timing is a timing when a voltage value starts to ramp up from a certain voltage value.
11 . The memory device of claim 10 , wherein the at least two successive ramp phases include two ramp phases and a ramp timing of the second ramp phase of the second pass voltage precedes the ramp timing of the second ramp phase of the first pass voltage.
12 . The memory device of claim 11 , wherein a time interval between the ramp timing of the second ramp phase of the first pass voltage and the ramp timing of the second ramp phase of the second pass voltage is influenced by a pulse width of the programming voltage and a ramp speed of a ramp phase of the programming voltage.
13 . The memory device of claim 10 , wherein the peripheral circuit further includes a first voltage source and a second voltage source, wherein:
the first voltage source is configured to apply the first pass voltage to the first word line; and
the second voltage source is configured to apply the second pass voltage to the second word line, wherein:
when a maximum voltage value of the first pass voltage is given, a speed at which the first pass voltage reaches the maximum voltage value of the first pass voltage is controlled by controlling pulse widths of the respective ramp phases provided by the first voltage source; and
when a maximum voltage value of the second pass voltage is given, a speed at which the second pass voltage reaches the maximum voltage value of the second pass voltage is controlled by controlling the pulse widths of the respective ramp phases provided by the second voltage source.
14 . The memory device of claim 10 , wherein the peripheral circuit is further configured to apply a third pass voltage to other word lines other than the first word line, the second word line, and the selected word line in the plurality of word lines, wherein, after respective ramp phases end, a maximum voltage value of the third pass voltage is different from the maximum voltage values of the first pass voltage and the second pass voltage.
15 . The memory device of claim 10 , wherein to apply the programming voltage on the selected word line includes applying the programming voltage including a plurality of pulse phases, wherein:
in a previous pulse phase, a first sub-programming voltage is applied to the selected word line; and
in a subsequent pulse phase, a second sub-programming voltage is applied to the selected word line, a voltage value of the first sub-programming voltage is smaller than a voltage value of the second sub-programming voltage.
16 . The memory device of claim 10 , wherein to apply the programming voltage on the selected word line includes applying the programming voltage including a plurality of pulse phases:
in a previous pulse phase, a first sub-pass voltage is applied on the first word line, and a second sub-pass voltage is applied on the second word line; and
in a subsequent pulse phase, a third sub-pass voltage is applied on the first word line, and a fourth sub-pass voltage is applied on the second word line, wherein, after respective ramp phases end, a voltage value of the first sub-pass voltage is smaller than a voltage value of the third sub-pass voltage, and a voltage value of the second sub-pass voltage is smaller than a voltage value of the fourth sub-pass voltage.
17 . The memory device of claim 10 , wherein to apply the programming voltage on the selected word line includes applying the programming voltage including a plurality of pulse phases and, in a pulse phase of the plurality of pulse phases, a pass voltage applied to the first word line and a pass voltage applied to the second word line include at least two ramp phases, and the pass voltage applied to the first word line and the pass voltage applied to the second word line have different ramp timings in at least one ramp phase of other ramp phases after the first ramp phase.
18 . The memory device of claim 10 , wherein, after respective ramp phases end, a maximum voltage value of the first pass voltage and a maximum voltage value of the second pass voltage are equal.
19 . A memory system, comprising:
one or more memory devices, including:
a memory cell array including a plurality of memory strings including a plurality of memory cells;
a plurality of word lines, a word line of the plurality of word lines coupled with a corresponding memory cell in the plurality of memory strings; and
a periphery circuit coupled with the plurality of word lines and configured to:
apply a programming voltage on a selected word line;
apply a first pass voltage on a first word line adjacent to the selected word line; and
apply a second pass voltage on a second word line adjacent to the selected word line, wherein the first pass voltage and the second pass voltage include at least two successive ramp phases, the first pass voltage and the second pass voltage have different ramp timings in a second ramp phase after a first ramp phase and the second ramp phase begins at a first voltage of the first ramp phase, the first voltage being greater than any other voltage of the first ramp phase, and a ramp timing is a timing when a voltage value starts to ramp up from a certain voltage value; and
a memory controller coupled with the one or more memory devices and configured to control the one or more memory devices.
20 . The memory system of claim 19 , wherein the memory system is included in a solid-state drive (SSD) or a memory card.