Multilayer electronic component
A multilayer electronic component includes a multilayer body including inner electrodes and dielectric layers alternately stacked, underlying electrodes, and outer electrodes. The inner electrodes include first inner electrodes and second inner electrodes. The underlying electrodes include a first underlying electrode and a second underlying electrode. The outer electrodes include a first outer electrode and a second outer electrode. The first underlying electrode and the second underlying electrode each include multiple sintered bodies composed of dielectric particles. At least part of the multiple sintered bodies are located on an interface between each underlying electrode and the multilayer body.
1 . A multilayer electronic component comprising:
a multilayer body comprising multiple inner electrodes and multiple dielectric layers alternately stacked and comprising a first surface and a second surface opposed to each other in a stacking direction;
multiple underlying electrodes comprising a first underlying electrode located on the first surface; and
multiple outer electrodes each connected to one or more of the multiple inner electrodes and one or more of the multiple underlying electrodes, wherein
in a cross-sectional view in the stacking direction, the first underlying electrode contains multiple sintered bodies composed of dielectric particles, and at least part of the multiple sintered bodies are located on an interface between the first underlying electrode and the multilayer body, and
an average particle diameter of the dielectric particles contained in the sintered bodies is smaller than an average particle diameter of the dielectric particles contained in the dielectric layers.
2 . The multilayer electronic component according to claim 1 , wherein
the at least part of the multiple sintered bodies each include one of multiple portions of the interface, and
in a cross-sectional view of the first underlying electrode in the stacking direction, a ratio of a length of the multiple portions to a length of the interface is 15% or more.
3 . The multilayer electronic component according to claim 1 , wherein
in a cross-sectional view of the first underlying electrode in the stacking direction, a ratio of an area of the multiple sintered bodies to a cross-sectional area of the first underlying electrode is 21% or more and 44% or less.
4 . The multilayer electronic component according to claim 1 , wherein
the at least part of the multiple sintered bodies each include one of multiple portions of the interface, and
the at least part of the multiple sintered bodies each have a shape protruding from the corresponding one of the multiple portions.
5 . The multilayer electronic component according to claim 1 , wherein
the first underlying electrode is not directly joined to the multiple inner electrodes.
6 . The multilayer electronic component according to claim 1 , wherein
the first underlying electrode does not contain a glass component.
7 . The multilayer electronic component according to claim 1 , wherein
when it is assumed that a cross section of the first underlying electrode in the stacking direction is divided into two regions in the stacking direction, a larger number of the multiple sintered bodies are present in the region away from the multilayer body than in the region close to the multilayer body.
8 . The multilayer electronic component according to claim 1 , wherein
at least part of the multiple sintered bodies in a cross section in the stacking direction are three-dimensionally linked and form a network.
9 . The multilayer electronic component according to claim 1 , wherein
a dimension in the stacking direction is smaller than a dimension in a longitudinal direction and smaller than a dimension in a width direction.
10 . The multilayer electronic component according to claim 1 , wherein
the multilayer body comprises:
a first side surface and a second side surface opposed to each other in a longitudinal direction orthogonal to the stacking direction; and
a third side surface and a fourth side surface opposed to each other in a width direction orthogonal to the stacking direction and the longitudinal direction,
the multiple underlying electrodes comprise second, third, and fourth underlying electrodes located on the first surface,
the multiple inner electrodes comprise:
multiple first inner electrodes exposed at a first corner portion extending over the first side surface and the third side surface and a second corner portion extending over the second side surface and the fourth side surface; and
multiple second inner electrodes exposed at a third corner portion extending over the first side surface and the fourth side surface and a fourth corner portion extending over the second side surface and the third side surface,
the multiple outer electrodes comprise:
a first outer electrode extending from the first corner portion at least onto the first surface and connected to the multiple first inner electrodes and the first underlying electrode;
a second outer electrode extending from the second corner portion at least onto the first surface and connected to the multiple first inner electrodes and the second underlying electrode;
a third outer electrode extending from the third corner portion at least onto the first surface and connected to the multiple second inner electrodes and the third underlying electrode; and
a fourth outer electrode extending from the fourth corner portion at least onto the first surface and connected to the multiple second inner electrodes and the fourth underlying electrode, and
each of the second underlying electrode, the third underlying electrode, and the fourth underlying electrode, in a cross-sectional view in the stacking direction, comprises multiple sintered bodies, and at least part of the multiple sintered bodies are located on an interface between each underlying electrode and the multilayer body.
11 . The multilayer electronic component according to claim 1 , wherein
the multilayer body comprises:
a first end surface and a second end surface opposed to each other in a longitudinal direction orthogonal to the stacking direction; and
a first side surface and a second side surface opposed to each other in a width direction orthogonal to the stacking direction and the longitudinal direction,
the multiple underlying electrodes comprise a second underlying electrode located on the first surface,
the multiple inner electrodes comprise:
multiple first inner electrodes exposed on the first end surface; and
multiple second inner electrodes exposed on the second end surface,
the multiple outer electrodes comprise:
the first outer electrode extending from the first end surface at least onto the first surface and connected to the multiple first inner electrodes and the first underlying electrode; and
the second outer electrode extending from the second end surface at least onto the first surface and connected to the multiple second inner electrodes and the second underlying electrode, and
in a cross-sectional view in the stacking direction, the second underlying electrode comprises multiple sintered bodies, and at least part of the multiple sintered bodies are located on an interface between the second underlying electrode and the multilayer body.
12 . A multilayer electronic component comprising:
a multilayer body comprising multiple inner electrodes and multiple dielectric layers alternately stacked and comprising a first surface and a second surface opposed to each other in a stacking direction;
multiple underlying electrodes comprising a first underlying electrode located on the first surface; and
multiple outer electrodes each connected to one or more of the multiple inner electrodes and one or more of the multiple underlying electrodes, wherein
in a cross-sectional view in the stacking direction, the first underlying electrode contains multiple sintered bodies composed of an aggregate of dielectric particles, and at least part of the multiple sintered bodies are located on an interface between the first underlying electrode and the multilayer body,
the at least part of the multiple sintered bodies each include one of multiple portions of the interface, and
the at least part of the multiple sintered bodies each have a shape protruding from the corresponding one of the multiple portions, the shape being wider on a side of the interface than on a side opposite thereto.
13 . The multilayer electronic component according to claim 12 , wherein
an average particle diameter of the dielectric particles contained in the sintered bodies is smaller than an average particle diameter of the dielectric particles contained in the dielectric layers.
14 . The multilayer electronic component according to claim 12 , wherein
in a cross-sectional view of the first underlying electrode in the stacking direction, a ratio of a length of the multiple portions to a length of the interface is 15% or more, and
in the cross-sectional view of the first underlying electrode in the stacking direction, a ratio of an area of the multiple sintered bodies to a cross-sectional area of the first underlying electrode is 21% or more and 44% or less.
15 . The multilayer electronic component according to claim 12 , wherein
the first underlying electrode does not contain a glass component.
16 . The multilayer electronic component according to claim 15 , wherein
an average particle diameter of the dielectric particles contained in the sintered bodies is smaller than an average particle diameter of the dielectric particles contained in the dielectric layers.
17 . The multilayer electronic component according to claim 12 , wherein
when it is assumed that a cross section of the first underlying electrode in the stacking direction is divided into two regions in the stacking direction, a larger number of the multiple sintered bodies are present in the region away from the multilayer body than in the region close to the multilayer body.
18 . The multilayer electronic component according to claim 12 , wherein
at least part of the multiple sintered bodies in a cross section in the stacking direction are three-dimensionally linked and form a network.