Multilayer ceramic electronic component and method for producing multilayer ceramic electronic component
A multilayer ceramic electronic component includes a multilayer body including a plurality of insulator layers including ceramic, and a plurality of inner electrode layers. An aspect ratio of a metal particle of the inner electrode layers is about 1.8 or greater.
1 . A multilayer ceramic electronic component comprising:
a multilayer body including a plurality of insulator layers including ceramic, and a plurality of inner electrode layers; wherein
an aspect ratio of a metal particle in the inner electrode layers is about 1.8 or greater and less than 2.09.
2 . The multilayer ceramic electronic component according to claim 1 , wherein
a thickness T (μm) of the plurality of inner electrode layers and a volume V (mm 3 ) of the multilayer body satisfy a following relational expression (1):
T≤ 0.0552×ln V+ 0.5239 (1).
3 . The multilayer ceramic electronic component according to claim 1 , wherein the multilayer ceramic electronic component is a multilayer ceramic capacitor.
4 . The multilayer ceramic electronic component according to claim 1 , further comprising a plurality of outer electrodes on an outer surface of the multilayer body.
5 . The multilayer ceramic electronic component according to claim 4 , wherein each of the plurality of outer electrodes includes an underlying electrode layer and a plating layer on the underlying electrode layer.
6 . The multilayer ceramic electronic component according to claim 5 , wherein the underlying electrode layer is a baked electrode layer including a glass and a metal.
7 . The multilayer ceramic electronic component according to claim 6 , wherein the glass includes a BaO—SrO—B 2 O 3 —SiO 2 glass frit.
8 . The multilayer ceramic electronic component according to claim 6 , wherein the a thickness of the baked electrode layer is about 5 μm or greater and about 150 μm or less.
9 . The multilayer ceramic electronic component according to claim 5 , wherein the underlying electrode layer is a resin electrode layer including conductive particles and a thermosetting resin.
10 . The multilayer ceramic electronic component according to claim 5 , wherein the underlying electrode layer is a thin film layer having a thickness of about 1 μm or less.
11 . The multilayer ceramic electronic component according to claim 5 , wherein the plating layer includes at least one of Cu, Ni, Ag, Pd, Ag—Pd alloy, Au, or Sn.
12 . The multilayer ceramic electronic component according to claim 5 , wherein the plating layer includes a Ni plating layer and an Sn plating layer.
13 . The multilayer ceramic electronic component according to claim 12 , wherein the Ni plating layer has an average thickness of about 1 μm or greater and about 15 μm or less.
14 . The multilayer ceramic electronic component according to claim 12 , wherein the Sn plating layer has an average thickness of about 1 μm or greater and about 15 μm or less.
15 . The multilayer ceramic electronic component according to claim 1 , wherein the multilayer body has a rectangular or substantially rectangular parallelepiped shape.
16 . The multilayer ceramic electronic component according to claim 15 , wherein the multilayer body includes rounded corners and ridges.
17 . The multilayer ceramic electronic component according to claim 1 , wherein each of the plurality of insulator layers includes barium titanate, calcium titanate, strontium titanate, barium calcium titanate, or calcium zirconate as a main component.
18 . The multilayer ceramic electronic component according to claim 17 , wherein each of the plurality of insulator layers includes Mg compounds, Mn compounds, Si compounds, Al compounds, V compounds, or Ni compounds as a subcomponent.
19 . The multilayer ceramic electronic component according to claim 1 , wherein an average thickness of each of the plurality of insulator layers is about 0.2 μm or greater and about 2 μm or less.
20 . A method for producing the multilayer ceramic electronic component according to claim 1 , comprising:
sintering the plurality of insulator layers including the ceramic, and the plurality of inner electrode layers.