Multilayer electronic component
A multilayer electronic component according to an example embodiment may include: a body including dielectric layers and internal electrodes; and an external electrode including a connection portion, and a band portion extending from the connection portion, wherein the external electrode may include an electrode layer connected to the internal electrode and including a first conductive metal and glass, a conductive resin layer disposed on the electrode layer and including a second conductive metal and a resin, and a silver (Ag) coating layer disposed between an electrode layer and a conductive resin layer of the band portion, and an average thickness of the silver (Ag) coating layer may be 2 μm or more and 5 μm or less.
1 . A multilayer electronic component, comprising:
a body including a dielectric layer, and internal electrodes alternately disposed with the dielectric layer in a first direction, the body comprising first and second surfaces opposing each other in the first direction, third and fourth surfaces opposing each other in a second direction and connected to the first and second surfaces, and fifth and sixth surfaces opposing each other in a third direction and connected to the first to fourth surfaces; and
an external electrode including a connection portion disposed on the third and fourth surfaces, and a band portion extending from the connection portion to a portion of the first and second surfaces,
wherein the external electrode comprises an electrode layer connected to the internal electrodes and including a first conductive metal and glass, a conductive resin layer disposed on the electrode layer and including a second conductive metal and a resin, and a silver (Ag) coating layer disposed in the band portion and between the electrode layer and the conductive resin layer, and
an average thickness of the silver (Ag) coating layer is 2 μm or more and 5 μm or less.
2 . The multilayer electronic component according to claim 1 , wherein the silver (Ag) coating layer is not disposed in the connection portion.
3 . The multilayer electronic component according to claim 1 , wherein the silver (Ag) coating layer has an average atomic percentage of silver (Ag) of 90 at % or more.
4 . The multilayer electronic component according to claim 1 , wherein the silver (Ag) coating layer has an average weight percentage of silver (Ag) of 95 wt % or more.
5 . The multilayer electronic component according to claim 1 , wherein, when a length of the electrode layer of the band portion is referred to IFL and a length of the silver (Ag) coating layer is referred to L, 50%≤L/IFL is satisfied.
6 . The multilayer electronic component according to claim 5 , wherein L/IFL≤80% is satisfied.
7 . The multilayer electronic component according to claim 1 , wherein the first and second conductive metals are the same metal.
8 . The multilayer electronic component according to claim 7 , wherein the first and second conductive metals are copper (Cu).
9 . The multilayer electronic component according to claim 1 , wherein the external electrode further comprises a plating layer disposed on the conductive resin layer.
10 . A multilayer electronic component, comprising:
a body including a dielectric layer, and internal electrodes alternately disposed with the dielectric layer in a first direction, the body comprising first and second surfaces opposing each other in the first direction, third and fourth surfaces opposing each other in a second direction and connected to the first and second surfaces, and fifth and sixth surfaces opposing each other in a third direction and connected to the first to fourth surfaces; and
an external electrode including a connection portion disposed on the third and fourth surfaces, and a band portion extending from the connection portion to a portion of the first and second surfaces,
wherein the external electrode comprises an electrode layer connected to the internal electrodes and including a first conductive metal and glass, a conductive resin layer disposed on the electrode layer and including a second conductive metal and a resin, and a silver (Ag) coating layer disposed in the band portion and between the electrode layer and the conductive resin layer, and
the silver (Ag) coating layer has an average atomic percentage of silver (Ag) of 90 at % or more.
11 . The multilayer electronic component according to claim 10 , wherein the silver (Ag) coating layer is not disposed in the connection portion.
12 . The multilayer electronic component according to claim 10 , wherein, when a length of the electrode layer of the band portion is referred to IFL and a length of the silver (Ag) coating layer is referred to as L, 50%≤L/IFL is satisfied.
13 . The multilayer electronic component according to claim 12 , wherein L/IFL≤80% is satisfied.
14 . The multilayer electronic component according to claim 13 , wherein the silver (Ag) coating layer is disposed only in the band portion.
15 . The multilayer electronic component according to claim 14 , wherein an average thickness of the silver (Ag) coating layer is 2 μm or more and 5 μm or less.
16 . The multilayer electronic component according to claim 15 , wherein the silver (Ag) coating layer includes a plurality of silver islands that are spaced apart from each other.
17 . The multilayer electronic component according to claim 10 , wherein the first and second conductive metals are the same metal.
18 . The multilayer electronic component according to claim 17 , wherein the first and second conductive metals are copper (Cu).
19 . The multilayer electronic component according to claim 10 , wherein the external electrode further comprises a plating layer disposed on the conductive resin layer.