Microelectronic package with antenna waveguide
A microelectronic package includes a waveguide radiation receiver formed in a first conductor layer of a multilayer package substrate, the multilayer package substrate comprising the first conductor layer spaced from a second conductor layer by a dielectric layer. The microelectronic package further includes a tubular waveguide mounted to the multilayer package substrate such that a central aperture of the tubular waveguide is over the waveguide radiation receiver, and a feed line coupling the waveguide radiation receiver to a transmitter-receiver, the feed line including a conductive via traversing the dielectric layer electrically coupling a first portion of the feed line in the first conductor layer to a second portion of the feed line in the second conductor layer, the first portion adjacent the waveguide radiation receiver, and the second portion adjacent the transmitter-receiver.
1 . A microelectronic package, comprising:
a waveguide radiation receiver formed in a first conductor layer on a first surface of a multilayer package substrate;
a second conductor layer on a second surface of the multilayer package substrate spaced from the first conductor layer by a dielectric layer;
a tubular waveguide mounted to the multilayer package substrate such that a central aperture of the tubular waveguide is over the waveguide radiation receiver;
a transmitter-receiver on the second surface of the multilayer package substrate; and
a feed line coupling the waveguide radiation receiver to the transmitter-receiver, the feed line including a conductive via traversing the dielectric layer coupling a first portion of the feed line in the first conductor layer to a second portion of the feed line in the second conductor layer, wherein the first conductor layer includes a ground plane around a profile of the central aperture and wherein the tubular waveguide is coupled to the ground plane.
2 . The microelectronic package of claim 1 , further comprising a solder connection between the ground plane and the tubular waveguide.
3 . The microelectronic package of claim 2 , further comprising a built-up layer over the first conductor layer between the solder connection and the ground plane.
4 . The microelectronic package of claim 1 , wherein the tubular waveguide provides an extruded rectangular profile.
5 . The microelectronic package of claim 4 , wherein the extruded rectangular profile is selected from the group consisting of:
a straight extruded rectangular profile; and
a curved extruded rectangular profile.
6 . The microelectronic package of claim 1 , wherein the waveguide radiation receiver formed in the first conductor layer includes a conductive probe adjacent the central aperture of the tubular waveguide.
7 . The microelectronic package of claim 6 , wherein the conductive probe is formed as a rectangular pattern in the first conductor layer.
8 . The microelectronic package of claim 7 , wherein the rectangular pattern of the conductive probe has a length of between 100 and 500 micrometers and a width of between 100 and 500 micrometers.
9 . The microelectronic package of claim 7 , wherein corners of the rectangular pattern of the conductive probe form chamfers with a radius in a range of 10 to 150 micrometers.
10 . The microelectronic package of claim 1 , wherein the microelectronic package is a leadless package.
11 . The microelectronic package of claim 1 , wherein the transmitter-receiver is a patch antenna formed in the second conductor layer.
12 . The microelectronic package of claim 11 , wherein the transmitter-receiver further comprises a planar ground ring formed of the second conductor layer around the patch antenna.
13 . The microelectronic package of claim 12 , further comprising an elevated ground ring formed with an elevated trace over the planar ground ring of the second conductor layer.
14 . The microelectronic package of claim 11 , wherein the patch antenna is formed as a rectangular pattern in the second conductor layer, the rectangular pattern having a width of between 1 and 4 millimeters, and having a length of between 1 and 4 millimeters.
15 . The microelectronic package of claim 11 , wherein the patch antenna includes a planar antenna formed of the second conductor layer in a bow-tie shape, a rectangular shape, a circular shape, a triangular shape, or an oval shape.
16 . The microelectronic package of claim 1 , further comprising a semiconductor die on the second surface of the multilayer package substrate including the transmitter-receiver, the semiconductor die coupled to the second conductor layer.
17 . The microelectronic package of claim 1 , further comprising a mold compound covering the transmitter-receiver and at least a portion of the multilayer package substrate.
18 . The microelectronic package of claim 1 , wherein the transmitter-receiver and the waveguide radiation receiver are configured to radiate signals at frequencies between 30 GHz and 300 GHz.
19 . The microelectronic package of claim 1 , wherein the transmitter-receiver and the waveguide radiation receiver are configured to radiate signals at frequencies between 140 GHz and 220 GHz.
20 . The microelectronic package of claim 1 , wherein the dielectric layer between the first conductor layer and the second conductor layer includes acrylonitrile butadiene styrene (ABS), acrylonitrile styrene acrylate (ASA), or epoxy resin mold compound.
21 . A method of forming a microelectronic package, comprising:
forming a waveguide radiation receiver in a first conductor layer on a first surface of a multilayer package substrate;
forming a second conductor layer on a second surface of the multilayer package substrate spaced from the first conductor layer by a dielectric layer;
forming a transmitter-receiver on the second surface of the multilayer package substrate;
forming a feed line coupling the waveguide radiation receiver to the transmitter-receiver, the feed line including a conductive via traversing the dielectric layer coupling a first portion of the feed line in the first conductor layer to a second portion of the feed line in the second conductor layer; and
mounting a tubular waveguide to the multilayer package substrate such that a central aperture of the tubular waveguide is over the waveguide radiation receiver, wherein mounting the tubular waveguide to the multilayer package substrate includes soldering the tubular waveguide to the first conductor layer at a ground plane around a profile of the central aperture.
22 . The method of claim 21 , wherein forming the waveguide radiation receiver comprises plating the first conductor layer on a seed layer, the first conductor layer comprising copper, gold, silver, aluminum, or an alloy thereof.
23 . The method of claim 21 , wherein the transmitter-receiver is a patch antenna, the method further comprising forming the patch antenna in the second conductor layer.
24 . The method of claim 21 , wherein forming the transmitter-receiver comprises mounting a semiconductor die to the second surface of the multilayer package substrate, wherein the semiconductor die includes the transmitter-receiver.
25 . The method of claim 21 , further comprising molding a mold compound to cover the transmitter-receiver and at least a portion of the multilayer package substrate.