Electronic device comprising antenna module
This antenna module may comprise a multi-layer substrate composed of a plurality of dielectrics, and conductive patterns. The multi-layer substrate includes: a first layer made of a flexible first material; second layers, which are formed on one side surface of the first layer and are composed of a plurality of layers made of a stiff second material; and third layers, which are formed on the other side surface of the first layer and are composed of a plurality of layers made of the stiff second material. The conductive patterns includes: a first conductive pattern formed on the one side surface in first and second regions of the one side surface of the first layer; a second conductive pattern formed on a lower third layer; and a third conductive pattern formed on a lower fourth layer. The second and third conductive patterns can be connected through via holes.
1 . An antenna module comprising a multi-layer substrate made of a plurality of dielectrics and a conductive pattern, the multi-layer substrate comprising:
a first layer made of a flexible first material;
second layers comprising a plurality of layers made of a stiff (rigid) second material arranged on one side surface of the first layer; and
third layers comprising a plurality of layers made of the rigid second material arranged on another side surface of the first layer,
wherein the first layer comprises a first region arranged in parallel with the second layers and the third layers, and a second region arranged to be vertical to the second layers and the third layers, and
wherein the conductive pattern comprises:
a first conductive pattern arranged on the one side surface in the first region and the second region of the one side surface of the first layer to transmit and receive a signal;
a second conductive pattern arranged on a lower third layer which is one layer of the third layers; and
a third conductive pattern arranged on a lower fourth layer which is another layer among the third layers, and
wherein the second conductive pattern and the third conductive pattern are connected to each other through via holes, and
the lower third layer is arranged close to the another side surface of the first layer, and the lower fourth layer is arranged further apart from the another side surface of the first layer compared to the lower third layer.
2 . The antenna module of claim 1 , wherein a space in the first conductive pattern arranged in the first region is narrower than a space in the second conductive pattern connected to ground of the multi-layer substrate.
3 . The antenna module of claim 1 , wherein the second conductive pattern comprises a first sub-pattern connected to one region of the ground of the multi-layer substrate and a second sub-pattern connected to the via holes, and
a space in the first sub-pattern, which is a part of the second conductive pattern, is narrower than a space in the second sub-pattern arranged in the lower fourth layer among the third layers.
4 . The antenna module of claim 3 , wherein a length of the third conductive pattern is shorter than a length of the first sub-pattern of the second conductive pattern.
5 . The antenna module of claim 3 , wherein one end region of the third conductive pattern is configured to be electrically connected to the second sub-pattern through a plurality of rows of a plurality of the via holes.
6 . The antenna module of claim 3 , wherein a first height of the first conductive pattern is configured to be within a predetermined range with reference to 1 mm, and
a second height of a via structure between the third conductive pattern and the second conductive pattern each connected to the via structure constituted by the via holes is configured to be within a predetermined range with reference to 0.3 mm.
7 . The antenna module of claim 6 , wherein the first height of the first conductive pattern is configured to be greater than the second height of the via structure by a predetermined height or more, and
a difference between the first height and the second height is configured to be within a predetermined range with reference to 0.14λ 0 at 60 GHz.
8 . The antenna module of claim 7 , wherein a third width of the third sub-pattern is configured to be within a range between 0.2 mm and 1.0 mm.
9 . The antenna module of claim 8 , wherein the third conductive pattern is configured to have the third width in a first axial direction and a third length in a second axial direction vertical to the first axial direction,
the third width of the third conductive pattern is configured to be identical to a second width of the second sub-pattern, and
the third conductive pattern is configured to have the third length from one side end portion to another side end portion.
10 . The antenna module of claim 9 , wherein the third conductive pattern is connected to the second sub-pattern through the via holes at a point adjacent to the one side end portion of the third conductive pattern, and
the another side end portion of the third conductive pattern is located to a point adjacent to an end portion of a ground wall configured as a multilayer structure in an inner region of the multi-layer substrate.
11 . The antenna module of claim 10 , further comprising at least one conductive pad arranged between the second sub-pattern and the third conductive pattern,
wherein the via holes arranged in the first axial direction are configured to be:
arranged vertically in a third axial direction to connect the second sub-pattern to the at least one conductive pad; and
arranged vertically in the third axial direction to connect the at least one conductive pad to the third conductive pattern.
12 . The antenna module of claim 11 , wherein the second conductive pattern further comprises a third sub-pattern arranged at an end portion of the second sub-pattern to have a fourth width in the first axial direction and a fourth length in the second axial direction,
the second sub-pattern constitutes a first ground pad connected to a plurality of via holes in the first axial direction,
the third sub-pattern constitutes a second ground pad extending from an end portion of the first ground pad, and
a signal transmitted through a feeding line of the multi-layer substrate is transmitted to the first conductive pattern by the second ground pad extending from the first ground pad.
13 . The antenna module of claim 10 , wherein the one side end portion of the multi-layer substrate is arranged to be spaced apart from a flexible substrate made of the flexible material by a gap having a predetermined width, and
the width of the gap is configured to be 0.3 mm or less.
14 . The antenna module of claim 13 , further comprising a shield can arranged on a ground pattern in an upper portion of the ground wall of the multi-layer substrate,
wherein a distance d from the shield can to the flexible substrate is configured to be in a range of (0.17+n)*λ 0 <d< (0.33+n)*λ 0 .
15 . The antenna module of claim 6 , wherein the first conductive pattern, the second conductive pattern, the via structure, and the third conductive pattern operate as antenna elements having horizontal polarization in a millimeter wave band,
the antenna elements are arranged in plurality in a first axial direction to constitute an array antenna, and
a first antenna element to a fourth antenna element of the array antenna are configured to radiate a beamformed radio signal in the first axial direction.
16 . An electronic device having an antenna module, the electronic device comprising:
a metal frame constituting a side region of the electronic device;
a dielectric case arranged on one side of the metal frame; and
an antenna module arranged in an inner region of the dielectric case, arranged to face an inner surface of the dielectric case, and comprising a multi-layer substrate made of a plurality of dielectric materials and a conductive pattern,
wherein the multi-layer substrate comprises a first layer made of a flexible first material;
the multi-layer substrate comprises second layers comprising a plurality of layers made of a stiff (rigid) second material arranged on one side surface of the first layer; and
the multi-layer substrate comprises third layers comprising a plurality of layers made of the rigid second material arranged on another side surface of the first layer,
wherein the first layer comprises a first region arranged in parallel with the second layers and the third layers, and a second region arranged to be vertical to the second layers and the third layers,
wherein the conductive pattern comprises:
a first conductive pattern arranged on the one side surface in the first region and the second region of the one side surface of the first layer to transmit and receive a signal;
a second conductive pattern arranged on a lower third layer which is one layer of the third layers; and
a third conductive pattern arranged on a lower fourth layer which is another layer among the third layers, and
wherein the second conductive pattern and the third conductive pattern are connected to each other through via holes, and
the lower third layer is arranged close to the another side surface of the first layer, and the lower fourth layer is arranged further apart from the another side surface of the first layer compared to the lower third layer.
17 . The electronic device of claim 16 , wherein a space in the first conductive pattern arranged in the first region is narrower than a space in the second conductive pattern connected to ground of the multi-layer substrate.
18 . The electronic device of claim 16 , wherein the second conductive pattern comprises a first sub-pattern connected to one region of the ground of the multi-layer substrate and a second sub-pattern connected to the via holes, and
a space in the first sub-pattern, which is a part of the second conductive pattern, is narrower than a space in the second sub-pattern arranged in the lower fourth layer among the third layers.
19 . The electronic device of claim 18 , wherein a length of the third conductive pattern is shorter than a length of the first sub-pattern of the second conductive pattern.
20 . The electronic device of claim 18 , wherein one end region of the third conductive pattern is configured to be electrically connected to the second sub-pattern through a plurality of rows of a plurality of the via holes.