Substrate for facilitating one or more interconnections of an opto-electrical device
In some implementations, an opto-electrical device includes a heatsink; a thermally conductive element disposed on a first region of a surface of the heatsink; an adaptive thickness thermally conductive pad disposed on the thermally conductive element; an integrated circuit (IC) disposed on the adaptive thickness thermally conductive pad; a thermoelectric cooler (TEC) disposed on a second region of the surface of the heatsink; an opto-electrical chip disposed on the TEC; and a substrate disposed on the IC and the opto-electrical chip, wherein the substrate is configured to electrically connect the IC and the opto-electrical chip.
1 . An opto-electrical device, comprising:
a heatsink;
a first substructure disposed on the heatsink that includes:
a thermally conductive element,
an adaptive thickness thermally conductive pad disposed on the thermally conductive element,
wherein the adaptive thickness thermally conductive pad is compressible, and
an integrated circuit (IC) disposed on the adaptive thickness thermally conductive pad;
a second substructure disposed on the heatsink that includes:
a thermoelectric cooler (TEC), and
an opto-electrical chip disposed on the TEC;
a substrate disposed on the first substructure and the second substructure,
wherein the substrate is disposed on the IC and the opto-electrical chip, and
wherein the substrate is configured to electrically connect the IC and the opto-electrical chip; and
attachment structures directly connecting a surface of the substrate to the IC and directly connecting the surface of the substrate to the opto-electrical chip.
2 . The opto-electrical device of claim 1 , wherein the substrate is connected to the IC and the opto-electrical chip via the attachment structures in a flip-chip configuration.
3 . The opto-electrical device of claim 2 , wherein the attachment structures include at least one of:
an attachment structure that provides a mechanical connection;
an attachment structure that provides an electrical connection; or
an attachment structure that provides a mechanical connection and an electrical connection.
4 . The opto-electrical device of claim 1 , wherein a difference between a thickness of the first substructure and a thickness of the second substructure satisfies a difference threshold,
wherein the difference threshold is less than or equal to 50 micrometers.
5 . The opto-electrical device of claim 1 , wherein the adaptive thickness thermally conductive pad comprises at least one of a resin or a polymer.
6 . The opto-electrical device of claim 1 , wherein the substrate is disposed on the first substructure and the second substructure such that the substrate is substantially parallel, within a threshold number of degrees, to a horizontal plane associated with the opto-electrical device.
7 . The opto-electrical device of claim 1 , wherein the second substructure further includes an additional adaptive thickness thermally conductive pad,
wherein the additional adaptive thickness thermally conductive pad is disposed on the TEC or the TEC is disposed on the additional adaptive thickness thermally conductive pad.
8 . The opto-electrical device of claim 1 , wherein the thermally conductive element, the adaptive thickness thermally conductive pad, and the TEC are configured to thermally conduct heat in a same vertical direction to the heatsink.
9 . The opto-electrical device of claim 1 , wherein the substrate includes one or more electrical elements,
wherein an electrical element, of the one or more electrical elements, provides a functionality associated with operation of the IC or a functionality associated with operation of the opto-electrical chip.
10 . The opto-electrical device of claim 1 , wherein a gap exists between the first substructure and the second substructure.
11 . An opto-electrical device, comprising:
a heatsink;
a thermally conductive element disposed on a first region of a surface of the heatsink;
an adaptive thickness thermally conductive pad disposed on the thermally conductive element,
wherein the adaptive thickness thermally conductive pad is compressible;
an integrated circuit (IC) disposed on the adaptive thickness thermally conductive pad;
a thermoelectric cooler (TEC) disposed on a second region of the surface of the heatsink;
an opto-electrical chip disposed on the TEC;
a substrate disposed on the IC and the opto-electrical chip,
wherein the substrate is configured to electrically connect the IC and the opto-electrical chip; and
a plurality of attachment structures directly connecting a surface of the substrate to the IC and directly connecting the surface of the substrate to the opto-electrical chip.
12 . The opto-electrical device of claim 11 , wherein the substrate has a flip-chip profile.
13 . The opto-electrical device of claim 12 , wherein the plurality of attachment structures includes at least one of:
a non-metal-doped solder ball; or
a metal-doped solder ball.
14 . The opto-electrical device of claim 11 , wherein a thickness of the adaptive thickness thermally conductive pad while compressed matches a difference between a cumulative thickness of the opto-electrical chip and the TEC and a cumulative thickness of the thermally conductive element and the IC.
15 . The opto-electrical device of claim 11 , wherein the substrate is disposed on the IC and the opto-electrical chip such that the substrate is substantially parallel, within a threshold number of degrees, to a horizontal plane associated with the opto-electrical device.
16 . The opto-electrical device of claim 11 , wherein the thermally conductive element, the adaptive thickness thermally conductive pad, and the TEC are configured to thermally conduct heat in a same vertical direction to the heatsink.
17 . The opto-electrical device of claim 11 , wherein the substrate includes one or more electrically conductive structures that are configured to electrically connect the IC and the opto-electrical chip.
18 . An opto-electrical device, comprising:
a heatsink;
a thermally conductive element disposed on a first region of a surface of the heatsink;
an adaptive thickness thermally conductive pad disposed on the thermally conductive element,
wherein the adaptive thickness thermally conductive pad is compressible;
an integrated circuit (IC) disposed on the adaptive thickness thermally conductive pad;
a thermoelectric cooler (TEC) disposed on a second region of the surface of the heatsink;
an opto-electrical chip disposed on the TEC;
a package body component disposed on a third region of the surface of the heatsink;
a substrate disposed on the IC and the opto-electrical chip,
wherein the substrate is configured to electrically connect the IC and the opto-electrical chip; and
a plurality of attachment structures directly connecting a surface of the substrate to the IC and directly connecting the surface of the substrate to the opto-electrical chip.
19 . The opto-electrical device of claim 18 , further comprising:
a wire bond connecting the package body component to the substrate.
20 . The opto-electrical device of claim 18 , wherein the adaptive thickness thermally conductive pad comprises at least one of a resin or a polymer.