Power conversion device with overlapping solid wiring patterns
A power conversion device includes a first solid pattern provided on a multi-layer wiring substrate and connected to a positive side of a first power supply, a second solid pattern provided on the multi-layer wiring substrate and connected to a negative side of the first power supply, and a third solid pattern provided on the multi-layer wiring substrate and connected to a negative side of a second power supply that is insulated from the first power supply. The first solid pattern and the third solid pattern are arranged so as to at least partially overlap in a first direction of the multi-layer wiring substrate, and the second solid pattern and the third solid pattern are arranged so as to at least partially overlap in the first direction of the multi-layer wiring substrate.
1 . A power conversion device which converts power of a first power supply by a plurality of switching elements and includes a multi-layer wiring substrate, the power conversion device comprising:
a first solid pattern provided on the multi-layer wiring substrate and connected to a positive side of the first power supply;
a second solid pattern provided on the multi-layer wiring substrate and connected to a negative side of the first power supply; and
a third solid pattern provided on the multi-layer wiring substrate and connected to a negative side of a second power supply that provides operating power for a driver circuit that drives the switching elements, the second power supply being insulated from the first power supply, wherein
the first solid pattern and the third solid pattern are arranged so as to at least partially overlap in a first direction of the multi-layer wiring substrate, and the second solid pattern and the third solid pattern are arranged so as to at least partially overlap in the first direction of the multi-layer wiring substrate.
2 . The power conversion device according to claim 1 , wherein
heat generating components are mounted on the multi-layer wiring substrate, and
in a wiring layer positioned on the lower side in the first direction of at least some of the heat generating components,
the first solid pattern and the third solid pattern are arranged so as to at least partially overlap in the first direction of the multi-layer wiring substrate, and the second solid pattern and the third solid pattern are arranged so as to at least partially overlap in the first direction of the multi-layer wiring substrate.
3 . The power conversion device according to claim 1 , wherein a permittivity of a material forming the multi-layer wiring substrate has a positive gradient with respect to temperature rise.
4 . The power conversion device according to claim 1 , wherein
the first solid pattern and the second solid pattern are respectively arranged on separate layers in the multi-layer wiring substrate, and
the third solid pattern is arranged between the first solid pattern and the second solid pattern.
5 . The power conversion device according to claim 1 , wherein
a Y capacitor is formed by the first solid pattern and the third solid pattern arranged so as to at least partially overlap in the first direction of the multi-layer wiring substrate, and
another Y capacitor is formed by the second solid pattern and the third solid pattern arranged so as to at least partially overlap in the first direction of the multi-layer wiring substrate.
6 . The power conversion device according to claim 1 , wherein
the third solid patterns are respectively arranged at a topmost layer portion and a lowermost layer portion in the first direction of the multi-layer wiring substrate, and
the first solid pattern and the second solid pattern are respectively arranged on separate layers, between the third solid pattern arranged at the topmost layer portion and the third solid pattern arranged at the lowest layer portion.
7 . The power conversion device according to claim 6 , wherein the first solid pattern and the second solid pattern are arranged so as to at least partially overlap in the first direction of the multi-layer wiring substrate in order to form an X capacitor.
8 . The power conversion device according to claim 1 , wherein the third solid pattern is grounded to a housing of the power conversion device.
9 . The power conversion device according to claim 2 , wherein
a smoothing capacitor is provided between positive side and negative side of the first power supply, and
the heat generating components are discharge resistors connected in parallel with the smoothing capacitor.
10 . The power conversion device according to claim 2 , wherein a permittivity of a material forming the multi-layer wiring substrate has a positive gradient with respect to temperature rise.
11 . The power conversion device according to claim 2 , wherein
the first solid pattern and the second solid pattern are respectively arranged on separate layers in the multi-layer wiring substrate, and
the third solid pattern is arranged between the first solid pattern and the second solid pattern.
12 . The power conversion device according to claim 3 , wherein
the first solid pattern and the second solid pattern are respectively arranged on separate layers in the multi-layer wiring substrate, and
the third solid pattern is arranged between the first solid pattern and the second solid pattern.
13 . The power conversion device according to claim 10 , wherein
the first solid pattern and the second solid pattern are respectively arranged on separate layers in the multi-layer wiring substrate, and
the third solid pattern is arranged between the first solid pattern and the second solid pattern.
14 . The power conversion device according to claim 2 , wherein
a Y capacitor is formed by the first solid pattern and the third solid pattern arranged so as to at least partially overlap in the first direction of the multi-layer wiring substrate, and
another Y capacitor is formed by the second solid pattern and the third solid pattern arranged so as to at least partially overlap in the first direction of the multi-layer wiring substrate.
15 . The power conversion device according to claim 3 , wherein
a Y capacitor is formed by the first solid pattern and the third solid pattern arranged so as to at least partially overlap in the first direction of the multi-layer wiring substrate, and
another Y capacitor is formed by the second solid pattern and the third solid pattern arranged so as to at least partially overlap in the first direction of the multi-layer wiring substrate.
16 . The power conversion device according to claim 4 , wherein
a Y capacitor is formed by the first solid pattern and the third solid pattern arranged so as to at least partially overlap in the first direction of the multi-layer wiring substrate, and
another Y capacitor is formed by the second solid pattern and the third solid pattern arranged so as to at least partially overlap in the first direction of the multi-layer wiring substrate.
17 . The power conversion device according to claim 10 , wherein
a Y capacitor is formed by the first solid pattern and the third solid pattern arranged so as to at least partially overlap in the first direction of the multi-layer wiring substrate, and
another Y capacitor is formed by the second solid pattern and the third solid pattern arranged so as to at least partially overlap in the first direction of the multi-layer wiring substrate.
18 . The power conversion device according to claim 11 , wherein
a Y capacitor is formed by the first solid pattern and the third solid pattern arranged so as to at least partially overlap in the first direction of the multi-layer wiring substrate, and
another Y capacitor is formed by the second solid pattern and the third solid pattern arranged so as to at least partially overlap in the first direction of the multi-layer wiring substrate.
19 . The power conversion device according to claim 12 , wherein
a Y capacitor is formed by the first solid pattern and the third solid pattern arranged so as to at least partially overlap in the first direction of the multi-layer wiring substrate, and
another Y capacitor is formed by the second solid pattern and the third solid pattern arranged so as to at least partially overlap in the first direction of the multi-layer wiring substrate.
20 . The power conversion device according to claim 13 , wherein
a Y capacitor is formed by the first solid pattern and the third solid pattern arranged so as to at least partially overlap in the first direction of the multi-layer wiring substrate, and
another Y capacitor is formed by the second solid pattern and the third solid pattern arranged so as to at least partially overlap in the first direction of the multi-layer wiring substrate.