IP Library Granted Patent US 12,706,553
Granted Patent B2
US 12,706,553 · App. 17/894,056 · Granted Aug 11, 2026

Energy harvesting module and method of making an energy harvesting module

Inventors: Vibhu Vivek (Santa Clara, CA); Ishita Jain (Milpitas, CA); John Sze (Saratoga, CA); Ryan Griswold (San Martin, CA); Keisuke Ishida (San Jose, CA)
Assignee: TDK Corporation
H02N2/18H02J7/32H02J50/001H10N30/067H10N30/30H10N30/857B60C23/0411
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Quick Facts
Patent No.
US 12,706,553
App. No.
17/894,056
Granted
Aug 11, 2026
Kind
B2
Abstract

Energy harvesting module and, more particularly, energy harvesting module configured to be coupled to a rotatable component of a vehicle's wheel, and methods of making an energy harvesting module are disclosed. In some embodiments, an energy harvesting system includes: a piezoelectric component configured to produce energy in response to mechanical strain imparted on the piezoelectric component, wherein the piezoelectric component is configured to deform while experiencing the mechanical strain, and the piezoelectric component comprises a piezoelectric material layer, one or more conductive bonding layers, a load backing layer, and one or more electrode layers, wherein the load backing layer comprises a fiber reinforced composite material.

Claims (34)

1 . An energy harvesting module, comprising:

a piezoelectric component configured to produce energy in response to mechanical strain imparted on the piezoelectric component, wherein:

the piezoelectric component is configured to deform while experiencing the mechanical strain,

the piezoelectric component comprises:

one or more electrode layers comprising a first electrode layer,

a piezoelectric material layer surrounded by, but not in contact with, the first electrode layer on a first plane, and

one or more conductive bonding layers comprising a first conductive bonding layer in contact with the piezoelectric material layer in a first direction that is perpendicular to the first plane, wherein the first conductive bonding layer is positioned between the piezoelectric material layer and a load backing layer, and wherein the first conductive bonding layer is in contact with both the piezoelectric material layer and the load backing layer, and

the load backing layer comprises a fiber reinforced composite material.

2 . The energy harvesting module of claim 1 , wherein the fiber reinforced composite material comprises at least one of: a carbon fiber composite material, a glass fiber composite material, a carbon nanotube reinforced composite material, a graphene reinforced composite, and a ceramic matrix composite material.

3 . The energy harvesting module of claim 2 , wherein the fiber reinforced composite material comprises an exposed fiber surface in contact with the first conductive bonding layer.

4 . The energy harvesting module of claim 3 , wherein the fiber reinforced composite material has a corresponding elastic modulus, wherein the elastic modulus corresponding to the fiber reinforced composite material with the exposed fiber surface is higher than the elastic modulus corresponding to the fiber reinforced composite material without the exposed fiber surface.

5 . The energy harvesting module of claim 1 , wherein the one or more electrode layers further comprise a second electrode layer, the one or more conductive bonding layers further comprise a second conductive bonding layer, wherein:

the second conductive bonding layer is in contact with the piezoelectric material layer, and

the second electrode layer is in contact with the second conductive bonding layer.

6 . The energy harvesting module of claim 1 , wherein the one or more conductive bonding layers comprise metal powders and resin.

7 . An energy harvesting module, comprising:

a piezoelectric component configured to produce energy in response to mechanical strain imparted on the piezoelectric component, wherein:

the piezoelectric component is configured to deform while experiencing the mechanical strain, and

the piezoelectric component comprises:

one or more electrode layers comprising a first electrode layer,

a piezoelectric material layer surrounded by, but not in contact with, the first electrode layer on a first plane,

one or more conductive bonding layers comprising a first conductive bonding layer in contact with the piezoelectric material layer in a first direction that is perpendicular to the first plane, wherein the first conductive bonding layer is positioned between the piezoelectric material layer and a load backing layer, and wherein the first conductive bonding layer is in contact with both the piezoelectric material layer and the load backing layer, and

one or more metal layers, wherein the load backing layer comprises a fiber reinforced composite material.

8 . The energy harvesting module of claim 7 , wherein the one or more metal layers comprise a first metal layer, wherein:

the first metal layer is in contact with the first conductive bonding layer and is electrically connected with the first conductive bonding layer, and

the piezoelectric material layer is vertically above the first metal layer while the piezoelectric material layer is horizontally surrounded by the first electrode layer.

9 . The energy harvesting module of claim 8 , wherein the piezoelectric component further comprises one or more interface layers, wherein the one or more interface layers comprise a first interface layer, wherein:

the first interface layer is in contact with the first metal layer, and

the piezoelectric material layer is in contact with the first interface layer.

10 . The energy harvesting module of claim 8 , wherein the one or more metal layers further comprise a second metal layer, the one or more electrode layers further comprise a second electrode layer, and the one or more conductive bonding layers further comprise a second conductive bonding layer, and wherein the second metal layer is vertically above the piezoelectric material layer.

11 . The energy harvesting module of claim 10 , wherein the second conductive bonding layer is vertically above and in contact with the second metal layer, and wherein the second conductive bonding layer is electrically connected with the second metal layer.

12 . The energy harvesting module of claim 7 , wherein the one or more metal layers comprise one or more silver (Ag) metal layers, copper (Cu) metal layers, aluminum (AI) metal layers, or gold (Au) metal layers.

13 . The energy harvesting module of claim 9 , wherein the one or more interface layers comprise amorphous lead oxide or amorphous bismuth oxide.

14 . The energy harvesting module of claim 13 , wherein the one or more interface layers comprise voids.