Bulk acoustic wave device and method of making such a device

1 . A method for producing an electroacoustic device comprising a piezoelectric layer, said electroacoustic device being a bulk acoustic wave filter guided on a Bragg reflector, said method comprising:

providing a silicon-based substrate,

forming a first electrode on the substrate,

forming the piezoelectric layer on the first electrode, and

forming a second electrode on the piezoelectric layer,

wherein the first electrode is made of a nitride-based electrically conductive refractory material, and wherein the formation of the piezoelectric layer is done by epitaxy, on said first electrode, of an ABO3-type material, O being oxygen, A being at least one first chemical element taken from among sodium (Na), potassium (K), barium (Ba), lithium (Li), lead (Pb), and B being at least one second chemical element taken from among zirconium (Zr), titanium (Ti), niobium (Nb), tantalum (Ta),

said method further comprising, before formation of the first electrode, forming a stack of layers alternatively having high and low acoustic impedances, the low impedance layers being TiN- or VN-based, and the high impedance layers being HfN-or TaN-based.

2 . The method according to claim 1 , wherein the nitride-based electrically conductive refractory material is taken from among transition refractory nitrides with a basis of a transition metal.

3 . The method according to claim 2 , wherein the nitride-based electrically conductive refractory material is taken from among TiN, VN, ZrN, TaN, HfN, NbN, or their alloys.

4 . The method according to claim 1 , wherein the electroacoustic device is a bulk acoustic wave filter of the suspended membrane type, said method further comprising, after formation by epitaxy of the piezoelectric layer, an etching of the silicon-based substrate under the first electrode carrying the piezoelectric layer, so as to form a cavity.

5 . The method according to claim 1 , wherein the formation of the first electrode and the formation of the piezoelectric layer are achieved by pulsed laser deposition successively within one same reactor without venting with air between said formations.

6 . The method according to claim 1 , wherein the substrate is silicon-based, oriented along (111), the first electrode is titanium nitride TiN-based oriented along (111), and the piezoelectric layer is oriented along (0001).

7 . An electroacoustic device comprising, stacked in a vertical direction, a silicon-based substrate, a first electrode on said substrate, a piezoelectric layer epitaxially grown on said first electrode, said piezoelectric layer being with the basis of an ABO3-type material, O being oxygen, A being at least one first chemical element taken from among sodium (Na), potassium (K), barium (Ba), lithium (Li), lead (Pb), and B being at least one second chemical element taken from among zirconium (Zr), titanium (Ti), niobium (Nb), tantalum (Ta), a second electrode disposed on the piezoelectric layer,

wherein the first electrode is made of a nitride-based electrically conductive refractory material, and

said electroacoustic device is a bulk acoustic wave filter guided on a Bragg reflector, comprising, between the substrate and the first electrode, a stack of layers alternatively having high and low acoustic impedances, the low impedance layers being TiN-or VN-based, and the high impedance layers being HfN- or TaN-based.

8 . The device according to claim 7 , wherein the nitride-based electrically conductive refractory material is taken from among transition refractory nitrides with the basis of a transition metal, for example TiN, VN, ZrN, TaN, HfN, NbN, or their alloys.

9 . The device according to claim 7 , wherein the electroacoustic device is a bulk acoustic wave filter of the suspended membrane type, comprising a cavity under the first electrode carrying the piezoelectric layer.

10 . The device according to claim 7 , wherein the first and second electrodes are in contact with a front face of the device.

11 . The device according to claim 7 , wherein the first electrode is contacted at a rear face of the device, and wherein the second electrode is in contact with a front face of the device.