IP Library Granted Patent US 12706627
Granted Patent B2
US 12706627 · App. 18/602,191 · Granted Aug 11, 2026

Assembly structure for mobile phone clip module

Inventor: Qi Lu (Ningbo, CN)
Assignee: Ningbo Weifeng Intelligent Technology Co., Ltd.
H04B1/3877H04M1/04
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12706627
App. No.
18/602,191
Granted
Aug 11, 2026
Kind
B2
Abstract

The present disclosure provides an assembly structure for a mobile phone clip module. The assembly structure for a mobile phone clip module includes a mobile phone clip body. The back of the mobile phone clip body is provided with a chuck for assembly. The assembly structure for a mobile phone clip module also includes an assembly seat. An assembly cavity for the chuck to enter is formed in the assembly seat. The assembly cavity is internally provided with a first locating piece, and the first locating piece acts on an outer surface of the chuck and applies pressure. The first locating piece is stressed by an elastic piece, so that the first locating piece can move elastically. The assembly cavity is also internally provided with a second locating piece, and the second locating piece acts on the side of the chuck and applies pressure.

Claims (10)

1 . An assembly structure for a mobile phone clip module, comprising a mobile phone clip body, wherein the back of the mobile phone clip body is provided with a chuck for assembly; the assembly structure for a mobile phone clip module also comprises an assembly seat, and an assembly cavity for the chuck to enter is formed in the assembly seat; the assembly cavity is internally provided with a first locating piece, and the first locating piece acts on an outer surface of the chuck and applies pressure; the first locating piece is stressed by an elastic piece, so that the first locating piece can move elastically; the assembly cavity is also internally provided with a second locating piece), and the second locating piece acts on the side of the chuck and applies pressure; and the second locating piece is stressed by an elastic piece, so that the second locating piece can move elastically.

2 . The assembly structure for a mobile phone clip module according to claim 1 , wherein the assembly seat is provided with an operating piece, and after the operating piece is operated, the operating piece can apply force on the first locating piece, and the pressure applied by the first locating piece on the outer surface of the chuck is reduced or disappeared.

3 . The assembly structure for a mobile phone clip module according to claim 2 , wherein the chuck is a disc-shaped chuck, and the periphery of the chuck is provided with a convex edge; a side wall of the assembly cavity is provided with a flanging and forms a clamping groove, and the convex edge of the chuck is limited in the clamping groove and can move.

4 . The assembly structure for a mobile phone clip module according to claim 3 , wherein the inner side of the assembly cavity is an arc structure matched with the contour of the chuck.

5 . The assembly structure for a mobile phone clip module according to claim 2 , wherein the inner side of the first locating piece is provided with a first locating piece base, the first locating piece base is placed in an inner cavity in the assembly seat, and the back side of the first locating piece base is provided with a first elastic piece mounting position, and the first elastic piece mounting position) is provided with an elastic piece.

6 . The assembly structure for a mobile phone clip module according to claim 5 , wherein the inner side of the operating piece is provided with a moving piece placed in the inner cavity, and the moving piece is provided with a force application position for acting on the first locating piece base, and when the moving piece moves in the direction of the first locating piece base, the force application position can apply force to the first locating piece base, and the pressure applied by the first locating piece on the outer surface of the chuck is reduced or disappeared.

7 . The assembly structure for a mobile phone clip module according to claim 6 , wherein the moving piece is provided with an elastic piece mounting position, and the elastic piece mounting position is provided with an elastic piece.

8 . The assembly structure for a mobile phone clip module according to claim 2 , wherein the inner side of the second locating piece is provided with a second locating piece base placed in the inner cavity, the second locating piece base is provided with a second elastic piece mounting position, and the second elastic piece mounting position is provided with an elastic piece.

9 . The assembly structure for a mobile phone clip module according to claim 8 , wherein the second locating piece is provided with a guide surface and a limiting surface.

10 . The assembly structure for a mobile phone clip module according to claim 1 , wherein the chuck is magnetic.