Speaker module and electronic device
This application provides a speaker module and an electronic device, and the electronic device includes a speaker module. The speaker module includes a shell, a vibration assembly, and a damping film, where the vibration assembly is mounted in an inner portion of the shell, the vibration assembly divides the inner portion of the shell into a front cavity and a back cavity, the shell is provided with a through hole, the through hole is communicated with the front cavity and the back cavity, and the damping film is mounted in the inner portion of the shell and covers the through hole, where an elastic modulus of the damping film is less than an elastic modulus of the vibration assembly.
1 . A speaker module, comprising:
a shell, a vibration assembly, a plurality of through holes, and a damping film including a plurality of damping sub-films, wherein the shell comprises a main shell and a partition board, the partition board is mounted on an inner side of the main shell, the vibration assembly is mounted in an inner portion of the shell and on the partition board, the vibration assembly divides the inner portion of the shell into a front cavity and a back cavity, the partition board is provided with a first through hole of the plurality of through holes, the first through hole of the plurality of through holes is communicated with the front cavity and the back cavity, and each of the plurality of damping sub-films is mounted on an inner side of the shell and covers one of the plurality of through holes, including a first damping sub-film of the plurality of damping sub-films covering the first through hole, wherein
an elastic modulus of the damping film is less than an elastic modulus of the vibration assembly.
2 . The speaker module according to claim 1 , wherein the partition board is provided with a mounting hole, both the mounting hole and the first through hole run through the partition board in a thickness direction of the partition board, the mounting hole and the first through hole are spaced apart, and the vibration assembly covers the mounting hole.
3 . The speaker module according to claim 1 , wherein a material of the damping film comprises one or more of polycarbonate, acrylic ester, polylactic acid, and butyronitrile.
4 . The speaker module according to claim 1 , wherein an effective area of the vibration assembly is S 1 , an effective area of the damping film is S 2 , an effective vibration volume of the vibration assembly in the back cavity is V 1 , an effective vibration volume of the damping film in the back cavity is V 2 , and a relationship among the four satisfies:
S
1
A
1
α
V
1
=
S
2
A
2
V
2
wherein A 1 is an amplitude of the vibration assembly, A 2 is a maximum amplitude of the damping film, and a is a compensation coefficient.
5 . The speaker module according to claim 1 , wherein the shell is provided with a sound outlet, and the sound outlet is communicated with the front cavity and an outer side of the shell.
6 . The speaker module according to claim 1 , wherein the shell is provided with a leak hole, and the leak hole is communicated with the back cavity and an outer side of the shell.
7 . The speaker module according to claim 1 , wherein the speaker module is a moving coil speaker module, the speaker module further comprises a support assembly and a magnet assembly, the support assembly supports the vibration assembly and the magnet assembly, and the magnet assembly is configured to provide a driving magnetic field for the vibration assembly.
8 . An electronic device, comprising:
a housing; and
a speaker module, comprising: a shell, a vibration assembly, a plurality of through holes, and a damping film including a plurality of damping sub-films, wherein the shell comprises a main shell and a partition board, the partition board is mounted on an inner side of the main shell, the vibration assembly is mounted in an inner portion of the shell and on the partition board, the vibration assembly divides the inner portion of the shell into a front cavity and a back cavity, the partition board is provided with a first through hole of the plurality of through holes, the first through hole of the plurality of through holes is communicated with the front cavity and the back cavity, and each of the plurality of damping sub-films is mounted on an inner side of the shell and covers one of the plurality of through holes, including a first damping sub-film of the plurality of damping sub-films covering the first through hole, wherein
an elastic modulus of the damping film is less than an elastic modulus of the vibration assembly; and
the housing is provided with a speaker hole, the speaker hole is communicated with an inner side and an outer side of the housing, the speaker module is mounted on the inner side of the housing, and a sound outlet of the speaker module is communicated with the speaker hole.
9 . The electronic device according to claim 8 , wherein the electronic device further comprises a processor, and the processor is mounted on the inner side of the housing and electrically connected to the speaker module.
10 . The electronic device according to claim 8 , wherein the partition board is provided with a mounting hole, both the mounting hole and the first through hole run through the partition board in a thickness direction of the partition board, the mounting hole and the first through hole are spaced apart, and the vibration assembly covers the mounting hole.
11 . The electronic device according to claim 8 , wherein a material of the damping film comprises one or more of polycarbonate, acrylic ester, polylactic acid, and butyronitrile.
12 . The electronic device according to claim 8 , wherein an effective area of the vibration assembly is S 1 , an effective area of the damping film is S 2 , an effective vibration volume of the vibration assembly in the back cavity is V 1 , an effective vibration volume of the damping film in the back cavity is V 2 , and a relationship among the four satisfies:
S
1
A
1
α
V
1
=
S
2
A
2
V
2
wherein A 1 is an amplitude of the vibration assembly, A 2 is a maximum amplitude of the damping film, and a is a compensation coefficient.
13 . The electronic device according to claim 8 , wherein the shell is provided with a sound outlet, and the sound outlet is communicated with the front cavity and an outer side of the shell.
14 . The electronic device according to claim 8 , wherein the shell is provided with a leak hole, and the leak hole is communicated with the back cavity and an outer side of the shell.
15 . The electronic device according to claim 8 , wherein the speaker module is a moving coil speaker module, the speaker module further comprises a support assembly and a magnet assembly, the support assembly supports the vibration assembly and the magnet assembly, and the magnet assembly is configured to provide a driving magnetic field for the vibration assembly.
16 . The electronic device according to claim 15 , wherein the speaker module is a moving iron speaker module.
17 . The speaker module according to claim 1 , wherein the speaker module is a moving iron speaker module.
18 . The speaker module according to claim 1 , wherein a material of the damping film comprises butyronitrile.
19 . The electronic device according to claim 8 , wherein the speaker module is a moving iron speaker module.
20 . The electronic device according to claim 8 , wherein a material of the damping film comprises butyronitrile.