Micro light-emitting package
A micro light-emitting package is provided. The micro light-emitting package includes a multilayer resin wiring board, a plurality of micro LED chips, and an encapsulating layer. The multilayer resin wiring board includes a black resin structure and a conductive structure disposed in the black resin structure. The plurality of the micro LED chips is arranged on the multilayer resin wiring board and electrically-connected to the conductive structure. The encapsulating layer covers the plurality of the micro LED chips.
1 . A micro light-emitting package, comprising:
a multilayer resin wiring board comprising:
a black resin structure; and
a conductive structure disposed in the black resin structure and comprising a first conductive layer, a first via conductor, a second conductive layer with a topmost surface, and a second via conductor;
a plurality of micro LED chips arranged on the multilayer resin wiring board and electrically connected to the conductive structure; and
an encapsulating layer covering the plurality of micro LED chips,
wherein the topmost surface has a portion overlapping the first via conductor, and completely covered by the black resin structure in a vertical direction.
2 . The micro light-emitting package of claim 1 , wherein the black resin structure comprises a first black resin layer, and a second black resin layer having an upper surface.
3 . The micro light-emitting package of claim 2 , wherein:
the first black resin layer covers the first conductive layer;
the first via conductor penetrates the first black resin layer, and is electrically connected to the first conductive layer;
the second conductive layer is arranged on the first black resin layer, and electrically connected to the first via conductor;
the second black resin layer covers the second conductive layer; and
the second via conductor has an upper surface, and penetrates the second black resin layer.
4 . The micro light-emitting package of claim 3 , wherein the upper surface of the second via conductor and the upper surface of the second black resin layer are coplanar with each other.
5 . The micro light-emitting package of claim 3 , wherein a distance between the upper surface of the second via conductor and the upper surface of the second black resin layer is in a range from 0 μm to 5 μm.
6 . The micro light-emitting package of claim 3 , wherein the multilayer resin wiring board has an upper surface, and a ratio of an area of the upper surface of the second black resin layer to an area of the upper surface of the multilayer resin wiring board is between 93% and 97%.
7 . The micro light-emitting package of claim 3 , wherein the second via conductor is closer to a centerline of the multilayer resin wiring board than the first via conductor is.
8 . The micro light-emitting package of claim 3 , wherein the first black resin layer has a lower surface, the first conductive layer has a lower surface as a soldering pad, and the lower surface of the first black resin layer is substantially coplanar with the lower surface of the first conductive layer.
9 . The micro light-emitting package of claim 6 , wherein a ratio of a total area of upper surfaces of the plurality of micro LED chips to the area of the upper surface of the multilayer resin wiring board is between 1% and 6%.
10 . The micro light-emitting package of claim 6 , wherein the plurality of micro LED chips comprises a micro LED chip which has a light-emitting surface, and the light-emitting surface has a concave and convex pattern.
11 . The micro light-emitting package of claim 6 , wherein the plurality of micro LED chips comprises a micro LED chip which is devoid of a sapphire substrate.