Electronic structure and a method of manufacturing such
An electronic structure includes a plurality of subassemblies, wherein each subassembly includes a circuit design and or is configured to host at least one electrically functional element, wherein in at least one of the subassemblies at least one of the functional elements of the structure is a connector element, each subassembly being mechanically and electrically coupled to at least one other subassembly via at least one coupling element, wherein the subassemblies and coupling elements are modular entities joined together to establish the electronic structure, further wherein at least a portion of the electronic structure includes at least one molded plastic layer, the molded plastic layer being provided to at least partially embed, surround, or host coupling elements, preferably each coupling element, the molded plastic layer further being provided to at least partially embed, surround, or host subassemblies, preferably each subassembly.
1 . An electronic structure comprising a plurality of subassemblies, wherein each subassembly comprises a circuit design and comprises or is configured to host at least one electrically functional element, wherein in at least one of the subassemblies at least one of the functional elements of the structure is a connector element, each subassembly being mechanically and electrically coupled to at least one other subassembly via at least one coupling element, wherein the subassemblies and coupling elements are modular entities joined together to establish the electronic structure, further wherein at least a portion of the electronic structure comprises at least one molded plastic layer, said molded plastic layer being provided to at least partially embed, surround, or host the coupling elements, the molded plastic layer further being provided to at least partially embed, surround, or host the subassemblies.
2 . The electronic structure of claim 1 , wherein the molded plastic layer is a continuous layer.
3 . The electronic structure of claim 1 , wherein the molded plastic layer is a discontinuous layer comprising regions of discontinuity between subassemblies.
4 . The electronic structure of claim 1 , wherein the structure comprises a further molded plastic layer or layers.
5 . The electronic structure of claim 1 , wherein the electronic structure further comprises a host substrate accommodating the subassemblies and the coupling elements, said host substrate comprising at least one material selected from the group consisting of polymer, thermoplastic material, electrically insulating material, Polymethyl methacrylate (PMMA), Poly Carbonate (PC), copolyester, copolyester resin, polyimide, a copolymer of Methyl Methacrylate and Styrene (MS resin), glass, Polyethylene Terephthalate (PET), carbon fiber, organic material, biomaterial, leather, wood, textile, fabric, metal, organic natural material, solid wood, veneer, plywood, bark, tree bark, birch bark, cork, natural leather, natural textile or fabric material, naturally grown material, cotton, wool, linen, silk, and any combination of the above.
6 . The electronic structure of claim 5 , wherein the host substrate is formed, through high pressure forming.
7 . The electronic structure of claim 1 , wherein at least a portion of the subassemblies each comprise a substrate, accommodating the functional element, wherein the substrate is formed, through high pressure forming.
8 . The electronic structure of claim 1 , wherein the coupling elements comprise metal or metal particle conductors.
9 . The electronic structure of claim 1 , wherein the molded plastic layer comprises thermoplastic material.
10 . The electronic structure of claim 1 , wherein the coupling elements are discrete elements, provided as physically separate entities from the subassemblies.
11 . The electronic structure of claim 1 , wherein the coupling elements comprise material that is different from a material of the subassemblies to which the coupling elements are coupled.
12 . The electronic structure of claim 1 , wherein the coupling elements comprise at least one of: conductive wiring, a flexible printed circuit carrier, an elastomeric printed circuit carrier, a printed conductor, conductive adhesive, or adhesive metal foil.
13 . The electronic structure of claim 1 , wherein a largest dimension of the electronic structure is over 30 cm.
14 . A method of manufacturing an electronic structure, the method comprising:
obtaining a plurality of subassemblies, wherein each subassembly is provided with a circuit design and comprises or is configured to host at least one electrically functional element, wherein in at least one of the subassemblies at least one of the functional elements of the structure is a connector element,
providing a plurality of coupling elements to mechanically and electrically couple each subassembly to at least one other subassembly, wherein the subassemblies and coupling elements are modular entities joined together to establish the electronic structure, and
molding a plastic material layer onto at least a portion of the electronic structure to at least partially embed, surround, or host coupling elements, the molded plastic layer further being provided to at least partially embed, surround, or host subassemblies.
15 . The method of claim 14 , wherein the method further comprises providing the plurality of subassemblies with a substrate film onto which the at least one electrically functional element is provided.
16 . The method of claim 14 , further comprising providing the plurality of subassemblies and the plurality of coupling elements on a host substrate.
17 . The method of claim 14 , further comprising providing the plurality of coupling elements by printing conductive material.
18 . The method of claim 14 , wherein the method further comprises:
providing a mold tool comprising a main body and a plurality of alignment components, said plurality of alignment components and/or the main body comprising attachment features for releasably attaching the alignment components to the main body at selected locations, and
providing selected locations of the electronic structure upon the alignment components before molding, and providing at least some of the subassemblies onto the plurality of alignment components,
placing the electronic structure in the main body of the mold tool, and allowing the attachment features to attach the alignment components to the main body, thereby aligning the selected locations of the electronic structure with selected locations of the mold tool.
19 . The method of claim 18 , wherein the attachment features comprise magnets, and wherein the alignment components comprise magnetic material or electromagnetic elements.
20 . The method of claim 18 , wherein the alignment components comprise retention features for attaching the alignment components to the electronic structure.