IP Library Granted Patent US 12707595
Granted Patent B2
US 12707595 · App. 17/698,387 · Granted Aug 11, 2026

Cold plate with folded heat dissipation features for datacenter cooling systems

Inventor: Ali Heydari (Albany, CA)
Assignee: NVIDIA Corporation
H05K7/20327H05K7/20809H05K7/20818H05K7/20836
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Quick Facts
Patent No.
US 12707595
App. No.
17/698,387
Granted
Aug 11, 2026
Kind
B2
Abstract

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a cold plate includes folded heat dissipation features to be cooled by at least one two-phase fluid via folded heat dissipation features having first and second channels of different widths; having first mechanical couplings for top portions of such folded heat dissipation features to an upper section of a cold pate; and having second mechanical couplings for bottom portions of the folded heat dissipation features to a lower section of the cold plate.

Claims (37)

1 . A datacenter cooling system, comprising:

a cold plate comprising a plurality of folded heat dissipation features to be cooled by at least one two-phase fluid, the folded heat dissipation features forming first channels having a first width and second channels having a different second width, wherein the first width is constant along a first length of the first channels, and wherein the second width is constant along a second length of the second channels, the folded heat dissipation features comprising first mechanical couplings along at least one of the first length or the second length to couple top folds of the folded heat dissipation features to an upper section of the cold plate and second mechanical couplings along at least one of the first length or the second length to couple bottom folds of the folded heat dissipation features to a lower section of the cold plate.

2 . The datacenter cooling system of claim 1 , wherein the folded heat dissipation features are continuous metallic strips that are compression-folded or compression-formed to provide the first channels and the second channels.

3 . The datacenter cooling system of claim 2 , wherein the folded heat dissipation features are comprised of two or more metallic strips to be brazed together to form the continuous metallic strips.

4 . The datacenter cooling system of claim 1 , wherein the first channels and the second channels are serially located or parallelly located so that the first channels and the second channels receive the at least one two-phase fluid concurrently or receive the at least one two-phase fluid separately at least during an introduction of the at least one two-phase fluid into the cold plate.

5 . The datacenter cooling system of claim 1 , wherein the first channels and the second channels are located in accordance with locations of a first computing device and a second computing device to be associated with the cold plate so that the first width of the first channels are physically coincidental with the first computing device and the second width of the second channels are physically coincidental with the second computing device, the first width narrower than the second width and the first computing device adapted to generate more heat than the second computing device.

6 . The datacenter cooling system of claim 1 , further comprising:

one or more flow controllers adapted to comprise expansion valve features and associated with the first channels and the second channels to enable one or more two-phase fluids to flow into one or more of the first channels or the second channels.

7 . The datacenter cooling system of claim 1 , further comprising:

one or more flow controllers to provide a flow of the at least one two-phase fluid at a rated pressure for the folded heat dissipation features to enable cooling of the cold plate and to enable a structure of the first channels and the second channels to be maintained during the cooling.

8 . The datacenter cooling system of claim 1 , further comprising:

at least one processor to determine a difference in pressures from one or more sensors associated with an input of the cold plate and with an output of the cold plate, the at least one processor to enable one or more flow controllers to perform as an expansion valve to enable controlled flow of the at least one two-phase fluid into one or more of the first channels or the second channels.

9 . The datacenter cooling system of claim 1 , further comprising:

one or more sensors to be associated with the cold plate to enable one or more flow controllers to perform as an expansion valve, the one or more flow controllers to enable controlled flow of the at least one two-phase fluid into one or more of the first channels or the second channels.

10 . The datacenter cooling system of claim 9 , further comprising:

at least one processor to cause a change in pressure of an input of the at least one two-phase fluid into the cold plate based in part on sensor input from the one or more sensors associated with the cold plate, the pressure associated with the controlled flow of the at least one two-phase fluid.

11 . The datacenter cooling system of claim 10 , further comprising:

one or more neural networks to receive the sensor input and to infer the change in pressure to be caused for the at least one two-phase fluid using the one or more flow controllers, the one or more neural networks trained using prior inlet pressures and using prior outlet pressures associated with the at least one two-phase fluid.

12 . A processor comprising one or more circuits, the processor to receive cooling requirements for a datacenter cooling system, the one or circuits to cause cooling by a two-phase fluid through a cold plate that comprises a plurality of folded heat dissipation features, the folded heat dissipation features forming first channels having a first width and second channels having a different second width, wherein the first width is constant along a first length of the first channels, and wherein the second width is constant along a second length of the second channels, the folded heat dissipation features comprising first mechanical couplings along at least one of the first length or the second length to couple top folds of the folded heat dissipation features to an upper section of the cold plate and second mechanical couplings along at least one of the first length or the second length to couple bottom folds of the folded heat dissipation features to a lower section of the cold plate.

13 . The processor of claim 12 , further comprising:

an output to provide output signals to one or more flow controllers adapted to comprise expansion valve features and associated with the first channels and the second channels to enable one or more two-phase fluids to flow into one or more of the first channels or the second channels.

14 . The processor of claim 12 , further comprising:

an input to receive sensor input from one or more sensors to be associated with the cooling requirements, the input to enable the processor to cause one or more flow controllers to perform as an expansion valve, the one or more flow controllers to enable controlled flow of the two-phase fluid into one or more of the first channels and or the second channels.

15 . The processor of claim 14 , further comprising:

one or more neural networks to receive the sensor input and to infer change in pressure to be caused for the two-phase fluid using the one or more flow controllers, the one or more neural networks trained using prior inlet pressures and using prior outlet pressures associated with the two-phase fluid.

16 . The processor of claim 12 , further comprising:

at least one logic unit to determine a difference in pressures from one or more sensors associated with an input of the cold plate and with an output of the cold plate, the processor to enable one or more flow controllers to perform as an expansion valve to enable controlled flow of the two-phase fluid into one or more of the first channels or the second channels.

17 . A method for datacenter cooling system, comprising:

providing a cold plate comprising a plurality of folded heat dissipation features to be cooled by at least one two-phase fluid;

enabling the folded heat dissipation features to channel the at least one two-phase fluid through first channels having a first width and second channels having a different second width, formed by the plurality of folded heat dissipation features, wherein the first width is constant along a first length of the first channels, and wherein the second width is constant along a second length of the second channels; and

retaining the at least one two-phase fluid in the cold plate by first mechanical couplings along at least one of the first length or the second length to couple top folds of the folded heat dissipation features to an upper section of the cold plate and second mechanical couplings along at least one of the first length or the second length to couple bottom folds of the folded heat dissipation features to a lower section of the cold plate.

18 . The method of claim 17 , further comprising:

enabling the folded heat dissipation features to be continuous metallic strips that are compression-folded or compression-formed to provide the first channels and the second channels.

19 . The method of claim 17 , further comprising:

locating the first channels and the second channels in a serial or a parallel configuration so that the first channels and the second channels receive the at least one two-phase fluid concurrently or receive the at least one two-phase fluid separately at least during an introduction of the at least one two-phase fluid into the cold plate.

20 . The method of claim 17 , further comprising:

locating the first channels and the second channels in accordance with locations of a first computing device and a second computing device to be associated with the cold plate, so that the first width of the first channels are physically coincidental with the first computing device and the second width of the second channels are physically coincidental with the second computing device, the first width narrower than the second width and the first computing device adapted to generate more heat than the second computing device.