Heatsink device

1 . A heatsink device, comprising:

a lead-frame having a die-pad, a first edge, a second edge, a third edge, and a fourth edge;

wherein the lead-frame further includes a set of heatsinks, including,

a first heatsink located where the first edge and the fourth edge of the lead-frame intersect;

a second heatsink located where the first edge and the second edge of the lead-frame intersect; and

a third heatsink located where the second edge and the third edge of the lead-frame intersect, wherein the heatsink device is configured to be embedded in an encapsulated package such that each of the first heatsink, the second heatsink, and the third heatsink is exposed on at least a top surface of the encapsulated package and a bottom surface of the encapsulated package.

2 . The heatsink device of claim 1 :

wherein the lead-frame further includes a fourth heatsink located where the third edge and the fourth edge of the lead-frame intersect.

3 . The heatsink device of claim 1 :

wherein the set of heatsinks and the die-pad are part of the lead-frame and have differing thicknesses.

4 . The heatsink device of claim 1 :

wherein the lead-frame under the die-pad has a first thickness that is an etched thickness; and

wherein the set of heatsinks has a second thickness that is greater than the first thickness.

5 . The heatsink device of claim 4 :

wherein the second thickness is a non-etched thickness.

6 . The heatsink device of claim 1 :

wherein the heatsinks are separate from each other.

7 . The heatsink device of claim 1 :

wherein each of the heatsinks is coupled to the die-pad by a separate tie-bar.

8 . The heatsink device of claim 1 :

wherein the heatsinks are located at corners of the lead-frame.

9 . The heatsink device of claim 1 :

wherein the lead-frame includes a first insulator that separates the first heatsink from the second heatsink along the first edge; and

wherein the lead-frame includes a second insulator that separates the second heatsink from the third heatsink along the second edge.

10 . The heatsink device of claim 9 :

wherein the lead-frame further includes a fourth heatsink located where the third edge and the fourth edge of the lead-frame intersect;

wherein the lead-frame includes a third insulator that separates the third heatsink from the fourth heatsink along the third edge; and

wherein the lead-frame includes a fourth insulator that separates the fourth heatsink from the first heatsink along the fourth edge.

11 . The heatsink device of claim 1 :

wherein the lead-frame further includes a fourth heatsink located where the third edge and the fourth edge of the lead-frame intersect;

wherein the lead-frame includes a first set of lead-pads that separate the first heatsink from the second heatsink along the first edge; and

wherein the lead-frame includes a second set of lead-pads that separate the second heatsink from the third heatsink along the second edge.

12 . The heatsink device of claim 11 :

wherein the lead-frame includes a first insulator that separates the second heatsink from the third heatsink along the second edge; and

wherein the lead-frame includes a second insulator that separates the first heatsink from the fourth heatsink along the fourth edge.

13 . The heatsink device of claim 11 :

wherein the lead-frame includes a third set of lead-pads that separate the third heatsink from the fourth heatsink along the third edge; and

wherein the lead-frame includes a fourth set of lead-pads that separate the fourth heatsink from the first heatsink along the fourth edge.

14 . The heatsink device of claim 11 :

wherein the die-pad is configured to be coupled to a chip-die;

wherein the first and second sets of lead-pads are configured to be coupled to the chip-die with a set of wire bonds; and

wherein at least one of the heatsinks is coupled to the die-pad with a tie-bar.

15 . The heatsink device of claim 11 , further comprising:

a chip-die coupled to the die-pad;

a set of wire bonds coupling the chip-die to the first set of lead-pads and the second set of lead-pads; and

at least one tie-bar coupling at least one heatsink of the set of heatsinks to the die-pad.

16 . The heatsink device of claim 1 , wherein each of the first heatsink, the second heatsink, and the third heatsink is further exposed on two sides of the encapsulated package.

17 . The heatsink device of claim 11 :

wherein each of the first set of lead-pads and the second set of lead-pads includes a set of exposed surfaces configured to protrude out from the encapsulated package.

18 . The heatsink device of claim 17 :

wherein the set of exposed surfaces of the first set of lead-pads and the set of exposed surfaces of the second set of lead-pads are configured to be galvanically coupled to an external circuit.

19 . The heatsink device of claim 16 , wherein the first heatsink, the second heatsink, and the third heatsink are configured to be thermally coupled, via an exposed surface, to an external heatsink.

20 . The heatsink device of claim 19 , wherein the external heatsink comprises a coolant.

21 . The heatsink device of claim 16 :

wherein the encapsulated package is a Quad Flat No-Lead (QFN) package.