Electric component module
An electric component module includes a substrate including a first metal foil provided on a first surface, and a second metal foil provided on a second surface and in which a via hole that penetrates from the first surface to the second surface and electrically connects the first metal foil and the second metal foil is provided, a heat generating component disposed away from the substrate, a heat transfer resin that has contact with the substrate and the heat generating component, a metal member that is disposed on an opposite side of the heat generating component with the substrate therebetween and disposed away from the substrate, a heat dissipation member that has contact with the substrate and the metal member, and a heat transfer pin to be inserted into the via hole. A part of the heat transfer pin has contact with the heat transfer resin.
1 . An electric component module comprising:
a substrate to include a first surface, a second surface facing an opposite side of the first surface, a first metal foil provided on the first surface, and a second metal foil provided on the second surface, in which a via hole that penetrates from the first surface to the second surface and electrically connects the first metal foil and the second metal foil is provided;
a heat generating component disposed away from the substrate in a plate thickness direction of the substrate;
a heat transfer resin to be disposed between the substrate and the heat generating component and have contact with the substrate and the heat generating component;
a metal member disposed on an opposite side of the heat generating component with the substrate therebetween and disposed away from the substrate in the plate thickness direction of the substrate;
a heat dissipation member to be disposed between the substrate and the metal member and have contact with the substrate and the metal member; and
a metal heat transfer pin to be inserted into the via hole, wherein
the first metal foil and the via hole are formed at positions overlapping at least the heat generating component as viewed along the plate thickness direction of the substrate, and
a part of the heat transfer pin inserted into the via hole has contact with the heat transfer resin.
2 . The electric component module according to claim 1 , wherein
the heat dissipation member is a liquid metal, and
the metal member includes a housing portion that houses the liquid metal.
3 . The electric component module according to claim 2 , wherein a part of the heat transfer pin has contact with the heat dissipation member.
4 . The electric component module according to claim 3 , wherein the heat transfer pin is soldered to the substrate.
5 . The electric component module according to claim 2 , wherein the heat transfer pin is soldered to the substrate.
6 . The electric component module according to claim 1 , wherein a part of the heat transfer pin has contact with the heat dissipation member.
7 . The electric component module according to claim 6 , wherein the heat transfer pin is soldered to the substrate.
8 . The electric component module according to claim 1 , wherein the heat transfer pin is soldered to the substrate.
9 . An electric component module comprising:
a substrate to include a first surface, a second surface facing an opposite side of the first surface, a first metal foil provided on the first surface, and a second metal foil provided on the second surface, in which a via hole that penetrates from the first surface to the second surface and electrically connects the first metal foil and the second metal foil is provided;
a heat generating component disposed away from the substrate in a plate thickness direction of the substrate;
a heat transfer resin to be disposed between the substrate and the heat generating component and have contact with the substrate and the heat generating component;
a metal member disposed on an opposite side of the heat generating component with the substrate therebetween and disposed away from the substrate in the plate thickness direction of the substrate;
a heat dissipation member to be disposed between the substrate and the metal member and have contact with the substrate and the metal member; and
a metal heat transfer pin to be inserted into the via hole, wherein
a part of the heat transfer pin protrudes toward the heat transfer resin than the first surface of the substrate and the first metal foil and has contact with the heat transfer resin.
10 . The electric component module according to claim 9 , wherein
the heat dissipation member is a liquid metal, and
the metal member includes a housing portion that houses the liquid metal.
11 . The electric component module according to claim 10 , wherein a part of the heat transfer pin has contact with the heat dissipation member.
12 . The electric component module according to claim 11 , wherein the heat transfer pin is soldered to the substrate.
13 . The electric component module according to claim 10 , wherein the heat transfer pin is soldered to the substrate.
14 . The electric component module according to claim 9 , wherein a part of the heat transfer pin has contact with the heat dissipation member.
15 . The electric component module according to claim 14 , wherein the heat transfer pin is soldered to the substrate.
16 . The electric component module according to claim 9 , wherein the heat transfer pin is soldered to the substrate.