Electronic device comprising printed circuit board structure accommodating thermal interface material

1 . An electronic device comprising a printed circuit board (PCB) structure accommodating a thermal interface material (TIM), wherein the PCB structure comprises:

a base plate;

a first component disposed on the base plate;

a second component disposed on the base plate and provided at a position spaced apart from the first component;

an interposer connected to the base plate and surrounding the first component and the second component;

a cover plate comprising a cover plate body connected to the interposer and configured to cover the first component and the second component and a cover hole formed penetrating the cover plate body; and

a heat dissipation plate comprising:

a heat dissipation plate body disposed on the cover plate body and facing the first component and the second component,

a heat dissipation hole formed penetrating the heat dissipation plate body and communicating with the cover hole, and

a flow guide formed on the heat dissipation plate body and configured to guide flow of the TIM.

2 . The electronic device of claim 1 , wherein the flow guide overlaps the first component based on a penetrating direction of the heat dissipation hole.

3 . The electronic device of claim 1 , wherein the flow guide is connected to the heat dissipation hole.

4 . The electronic device of claim 1 , wherein a thickness of a portion, of the heat dissipation plate body, in which the flow guide is formed is less than a thickness of a portion, of the heat dissipation plate body, in which the flow guide is not formed.

5 . The electronic device of claim 1 , wherein the flow guide is recessed from a surface, of the heat dissipation plate body, facing the first component.

6 . The electronic device of claim 5 , wherein a distance from a bottom surface of the flow guide to the base plate is greater than a distance from the heat dissipation plate body to the base plate.

7 . The electronic device of claim 5 , wherein an area of the flow guide is greater than an area occupied by the first component on the base plate.

8 . The electronic device of claim 5 , wherein the flow guide completely covers an upper surface of the first component.

9 . The electronic device of claim 1 , wherein the flow guide comprises:

a main guide extending from the heat dissipation hole in a first direction; and

an auxiliary guide extending from the main guide in a second direction intersecting with the first direction.

10 . The electronic device of claim 1 , wherein the heat dissipation plate comprises:

a bottom plate on which the flow guide is formed;

a top plate connected to the bottom plate and disposed on the cover plate; and

a heat dissipation space provided inside the bottom plate and the top plate.

11 . The electronic device of claim 10 , wherein the heat dissipation plate further comprises a heat dissipation fluid with which the heat dissipation space is filled.

12 . The electronic device of claim 1 , wherein the heat dissipation plate further comprises a heat spreader disposed on the heat dissipation plate body and overlapping the first component based on a penetrating direction of the heat dissipation hole.

13 . The electronic device of claim 1 ,

wherein the PCB structure further comprises the TIM with which an accommodation space is filled, and

wherein the accommodation space is surrounded by the base plate, the interposer, and the cover plate.

14 . The electronic device of claim 13 , wherein the TIM is provided in a solid state by being hardened in the accommodation space.

15 . The electronic device of claim 13 , wherein the TIM is injected in a liquid state into a space between the first component and the second component through the cover hole and the heat dissipation hole.