IP Library Granted Patent US 12707687
Granted Patent B2
US 12707687 · App. 18/486,528 · Granted Aug 11, 2026

Semiconductor device

Inventors: Shunta Murai (Kanazawa, JP); Daiki Yoshikawa (Kanazawa, JP); Kazutoshi Nakamura (Nonoichi, JP)
Assignees: Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation
H10D62/127H10D12/481H10D62/133H10D64/112H10D64/117
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Quick Facts
Patent No.
US 12707687
App. No.
18/486,528
Granted
Aug 11, 2026
Kind
B2
Abstract

According to one embodiment, a semiconductor device includes first and second electrodes, and first and second regions. The first region includes a first semiconductor region of a first conductivity type, a second semiconductor region of a second conductivity type, a plurality of third semiconductor regions of the first conductivity type, a gate electrode, a conductive part, a fourth semiconductor region of the second conductivity type, a fifth semiconductor region of the first conductivity type, and a sixth semiconductor region of the second conductivity type. The gate electrode faces one of the plurality of third semiconductor regions via a gate insulating layer. The conductive part faces another one of the plurality of third semiconductor regions via an insulating layer, and is electrically connected with the second electrode. The fourth and six semiconductor regions are located on the one and the other one of the plurality of third semiconductor regions, respectively.

Claims (76)

1 . A semiconductor device, comprising:

a first electrode;

a second electrode separated from the first electrode;

a first region located on a portion of the first electrode and positioned between the first electrode and the second electrode, the first region including

a first semiconductor region of a first conductivity type,

a second semiconductor region of a second conductivity type, a portion of the second semiconductor region being located on the first semiconductor region,

a plurality of third semiconductor regions located on the portion of the second semiconductor region, the plurality of third semiconductor regions being of the first conductivity type,

a gate electrode facing one of the plurality of third semiconductor regions via a gate insulating layer in a second direction perpendicular to a first direction, the first direction being from the first electrode toward the second electrode,

a conductive part facing an other one of the plurality of third semiconductor regions via an insulating layer in the second direction, the conductive part being electrically connected with the second electrode,

a fourth semiconductor region located on the one of the plurality of third semiconductor regions, the fourth semiconductor region being of the second conductivity type,

a fifth semiconductor region located on the one of the plurality of third semiconductor regions, the fifth semiconductor region being of the first conductivity type, a first-conductivity-type impurity concentration of the fifth semiconductor region being greater than a first-conductivity-type impurity concentration of the one of the plurality of third semiconductor regions, and

a sixth semiconductor region located on the other one of the plurality of third semiconductor regions, the sixth semiconductor region being of the second conductivity type, a length of the sixth semiconductor region in a third direction being greater than a length of the fourth semiconductor region in the third direction, the third direction being perpendicular to the first and second directions; and

a second region located on an other portion of the first electrode and positioned between the first electrode and the second electrode, the second region including

a seventh semiconductor region of the second conductivity type, the seventh semiconductor region having a higher second-conductivity-type impurity concentration than the second semiconductor region,

an other portion of the second semiconductor region located on the seventh semiconductor region, and

an eighth semiconductor region located on the other portion of the second semiconductor region, the eighth semiconductor region being of the first conductivity type.

2 . The device according to claim 1 , wherein

the fourth semiconductor region and the fifth semiconductor region are alternately arranged in the third direction.

3 . The device according to claim 1 , wherein

the fifth semiconductor regions are provided respectively on the plurality of third semiconductor regions, and

a length in the second direction of the fifth semiconductor region positioned on the other one of the plurality of third semiconductor regions is less than a length in the second direction of an other of the fifth semiconductor regions positioned on the one of the plurality of third semiconductor regions.

4 . The device according to claim 3 , wherein

a plurality of the fifth semiconductor regions is arranged in the third direction on the other one of the plurality of third semiconductor regions, and

the sixth semiconductor region is located around the plurality of fifth semiconductor regions along a first plane perpendicular to the first direction.

5 . The device according to claim 1 , wherein

the first region includes:

a first part in which the gate electrode, the fifth semiconductor region, the fourth semiconductor region, and the one of the plurality of third semiconductor regions are located; and

a second part in which the conductive part, the sixth semiconductor region, and the other one of the plurality of third semiconductor regions are located, and

the second part is positioned between the first part and the second region.

6 . The device according to claim 5 , wherein

a length in the second direction of the second part is greater than a distance in the first direction between the first electrode and the second electrode.

7 . The device according to claim 1 , wherein the first region includes:

a first part in which the gate electrode, the fifth semiconductor region, the fourth semiconductor region, and the one of the plurality of third semiconductor regions are located; and

a second part in which the conductive part, the sixth semiconductor region, and the other one of the plurality of third semiconductor regions are located, and the first part is positioned between the second part and the second region.

8 . The device according to claim 1 , wherein the sixth semiconductor region includes first and second portions adjacent to each other in the second direction, the first portion is longer than the second portion in the third direction, and a length of the first portion in the third direction corresponds to the length of the sixth semiconductor region.

9 . The device according to claim 1 , further comprising:

a plurality of fifth semiconductor regions including the fifth semiconductor region, wherein:

an other fifth semiconductor region is located on the other one of the plurality of third semiconductor regions and contacts the sixth semiconductor region, and

the fifth semiconductor region and the other fifth semiconductor region overlap in the second direction.

10 . The device according to claim 1 , wherein at least one of the gate electrode and the conductive part is located between the fifth semiconductor region and the sixth semiconductor region in the second direction.

11 . A semiconductor device, comprising:

a first electrode;

a second electrode separated from the first electrode;

a first region located on a portion of the first electrode and positioned between the first electrode and the second electrode, the first region including

a first semiconductor region of a first conductivity type,

a second semiconductor region of a second conductivity type, a portion of the second semiconductor region being located on the first semiconductor region,

a plurality of third semiconductor regions located on the portion of the second semiconductor region, the plurality of third semiconductor regions being of the first conductivity type,

a gate electrode facing one of the plurality of third semiconductor regions via a gate insulating layer in a second direction perpendicular to a first direction, the first direction being from the first electrode toward the second electrode,

a conductive part facing an other one of the plurality of third semiconductor regions via an insulating layer in the second direction, the conductive part being electrically connected with the second electrode,

a fourth semiconductor region located on the one of the plurality of third semiconductor regions, the fourth semiconductor region being of the second conductivity type,

a fifth semiconductor region located on the one of the plurality of third semiconductor regions, the fifth semiconductor region being of the first conductivity type, a first-conductivity-type impurity concentration of the fifth semiconductor region being greater than a first-conductivity-type impurity concentration of the one of the plurality of third semiconductor regions, and

a sixth semiconductor region located on the other one of the plurality of third semiconductor regions, the sixth semiconductor region being of the first conductivity type, a first-conductivity-type impurity concentration of the sixth semiconductor region being greater than a first-conductivity-type impurity concentration of the other one of the plurality of third semiconductor regions, an area of the sixth semiconductor region per unit area being greater than an area of the fifth semiconductor region per unit area at a first plane perpendicular to the first direction; and

a second region located on an other portion of the first electrode and positioned between the first electrode and the second electrode, the second region including

a seventh semiconductor region of the second conductivity type, the seventh semiconductor region having a higher second-conductivity-type impurity concentration than the second semiconductor region,

an other portion of the second semiconductor region located on the seventh semiconductor region, and

an eighth semiconductor region located on the other portion of the second semiconductor region, the eighth semiconductor region being of the first conductivity type.

12 . The device according to claim 11 , wherein the fourth semiconductor region and the fifth semiconductor region are alternately arranged in the third direction.

13 . The device according to claim 11 , wherein:

the fifth semiconductor regions are provided respectively on the plurality of third semiconductor regions, and

a length in the second direction of the fifth semiconductor region positioned on the other one of the plurality of third semiconductor regions is less than a length in the second direction of an other of the fifth semiconductor regions positioned on the one of the plurality of third semiconductor regions.

14 . The device according to claim 13 , wherein:

a plurality of the fifth semiconductor regions is arranged in the third direction on the other one of the plurality of third semiconductor regions, and

the sixth semiconductor region is located around the plurality of fifth semiconductor regions along a first plane perpendicular to the first direction.

15 . The device according to claim 11 , wherein the first region includes:

a first part in which the gate electrode, the fifth semiconductor region, the fourth semiconductor region, and the one of the plurality of third semiconductor regions are located; and

a second part in which the conductive part, the sixth semiconductor region, and the other one of the plurality of third semiconductor regions are located, and the second part is positioned between the first part and the second region.

16 . The device according to claim 15 , wherein a length in the second direction of the second part is greater than a distance in the first direction between the first electrode and the second electrode.

17 . The device according to claim 11 , wherein the first region includes:

a first part in which the gate electrode, the fifth semiconductor region, the fourth semiconductor region, and the one of the plurality of third semiconductor regions are located; and

a second part in which the conductive part, the sixth semiconductor region, and the other one of the plurality of third semiconductor regions are located, and the first part is positioned between the second part and the second region.

18 . The device according to claim 11 , wherein the sixth semiconductor region includes first and second portions adjacent to each other in the second direction, the first portion is longer than the second portion in the third direction, and a length of the first portion in the third direction corresponds to the length of the sixth semiconductor region.

19 . The device according to claim 11 , further comprising:

a plurality of fifth semiconductor regions including the fifth semiconductor region, wherein:

an other fifth semiconductor region is located on the other one of the plurality of third semiconductor regions and contacts the sixth semiconductor region, and

the fifth semiconductor region and the other fifth semiconductor region overlap in the second direction.

20 . The device according to claim 11 , wherein at least one of the gate electrode and the conductive part is located between the fifth semiconductor region and the sixth semiconductor region in the second direction.