Electrostatic discharge (ESD) protection structure
Electrostatic discharge (ESD) protection structures are provided. A first N-type well region is formed over a P-type semiconductor substrate. First P-type well region and second N-type well region are formed over the first N-type well region. A plurality of first device areas are formed over the first P-type well region. Each first device area includes a plurality of P-type fins extending in a first direction. The P-type fins are divided into a plurality of first groups in each of the first device areas. A second device area is formed over the first P-type well region, and includes a plurality of N-type fins extending in the first direction and surrounded by the first device areas. When an ESD event is present, an ESD current flows sequentially through the P-type fins, the first P-type well region and the N-type fins.
1 . An electrostatic discharge (ESD) protection structure, comprising:
a P-type semiconductor substrate;
a first N-type well region formed over the P-type semiconductor substrate;
a first P-type well region formed over the first N-type well region;
a second N-type well region formed over the first N-type well region and surrounding the first P-type well region;
a plurality of first device areas over the first P-type well region, each comprising a plurality of P-type fins extending in a first direction, wherein the P-type fins are divided into a plurality of first groups in each of the first device areas;
a second device area over the first P-type well region, comprising a plurality of N-type fins extending in the first direction and surrounded by the first device areas, wherein the N-type fins are divided into a plurality of second groups in the second device area;
a plurality of first metal lines formed in a metal layer and extending in the first direction, wherein each of the first metal lines overlaps an individual first device area; and
a second metal line formed in the metal layer and extending in the first direction, wherein the second metal line overlaps the second device area,
wherein when an ESD event is present, an ESD current flows from the first metal lines to the second metal line through the P-type fins, the first P-type well region and the N-type fins in sequence.
2 . The ESD protection structure as claimed in claim 1 , further comprising:
a plurality of first connecting features, each extending in a second direction that is perpendicular to the first direction and overlapping the P-type fins of an individual first group; and
a plurality of second connecting features, each extending in the second direction and overlapping the N-type fins of an individual second group,
wherein the P-type fins in each of the first groups are electrically connected to the overlapping first metal line through the overlapping first connecting features and P-type epitaxially-grown materials between the overlapping first connecting features and the P-type fins,
wherein the N-type fins in each of the second groups are electrically connected to the overlapping second metal line through the overlapping second connecting features and N-type epitaxially-grown materials between the overlapping second connecting features and the N-type fins.
3 . The ESD protection structure as claimed in claim 1 , further comprising:
a plurality of first connecting features, each extending in a second direction that is perpendicular to the first direction and overlapping the P-type fins of the first groups in an individual first device area; and
a plurality of second connecting features, each extending in the second direction and overlapping the N-type fins of the second groups in the second device area,
wherein the P-type fins in each of the first groups are electrically connected to the overlapping first metal line through the overlapping first connecting features and P-type epitaxially-grown materials between the overlapping first connecting features and the P-type fins,
wherein the N-type fins in each of the second groups are electrically connected to the overlapping second metal line through the overlapping second connecting features and N-type epitaxially-grown materials between the overlapping second connecting features and the N-type fins.
4 . The ESD protection structure as claimed in claim 1 , wherein the first metal lines are electrically connected to a ground pad, and the second metal line is electrically connected to an input/output (I/O) pad.
5 . The ESD protection structure as claimed in claim 1 , wherein a PN junction is formed between the first P-type well region and the N-type fins.
6 . The ESD protection structure as claimed in claim 1 , wherein the first groups have a different number of P-type fins in each of the first device areas, and the second groups have a different number of N-type fins in the second device area.
7 . The ESD protection structure as claimed in claim 1 , wherein the first groups have the same number of P-type fins in each of the first device areas, and the second groups have the same number of N-type fins in the second device area.
8 . The ESD protection structure as claimed in claim 1 , wherein in each of the first device areas, a distance between the two adjacent P-type fins of the different first groups is greater than a distance between the two adjacent P-type fins of the same first group.
9 . The ESD protection structure as claimed in claim 1 , wherein in the second device area, a distance between the two adjacent N-type fins of the different second groups is greater than a distance between the two adjacent N-type fins of the same second group.
10 . The ESD protection structure as claimed in claim 1 , wherein the second device area is sandwiched between the first device areas, and the P-type fins of the first device areas are longer than the N-type fins of the second device area in the first direction.