Semiconductor package and method for manufacturing semiconductor package
Miniaturization is facilitated in a semiconductor package provided with pixels. A semiconductor package includes a transparent member, a semiconductor chip, a photosensitive rib, and an interposer. In this semiconductor package, pixels are arranged on a part of a chip plane of the semiconductor chip. The photosensitive rib is a photosensitive resin disposed between a region not corresponding to the pixel in the chip plane of the semiconductor chip and the transparent member. Furthermore, the interposer is electrically connected to the semiconductor chip.
1 . A semiconductor package, comprising:
a transparent member;
a semiconductor chip in which pixels are arranged on a part of a chip plane;
a photosensitive rib that is a photosensitive resin disposed between a region not corresponding to the pixel in the chip plane and the transparent member;
an interposer electrically connected to the semiconductor chip;
an adhesive resin that bonds the photosensitive rib and the semiconductor chip; and
a stopper, wherein
the semiconductor chip is disposed between the transparent member and the interposer,
the photosensitive rib is formed around a predetermined region facing the pixel on a lower surface of the transparent member where a direction from the interposer to the transparent member is set as an upward direction, and
the stopper is formed between the predetermined region of the lower surface and the photosensitive rib.
2 . The semiconductor package according to claim 1 , wherein
the transparent member is a lens.
3 . The semiconductor package according to claim 1 , wherein
a cross-sectional shape of the photosensitive rib is a tapered shape.
4 . The semiconductor package according to claim 1 , wherein
the semiconductor chip includes
a silicon substrate, and
an organic film formed on a part of a substrate surface of the silicon substrate, and
the photosensitive rib is disposed between a region of the substrate surface where the organic film is not formed and the transparent member.
5 . The semiconductor package according to claim 1 , wherein
a shape of an inner wall of the photosensitive rib is a shape obtained by connecting a plurality of triangular prisms with a direction toward the pixel as an inner direction.
6 . The semiconductor package according to claim 1 , further comprising:
a dam; and
a sealing resin that seals the semiconductor chip, the transparent member, and the interposer, wherein
the semiconductor chip is disposed between the transparent member and the interposer, and
the dam is formed around a light receiving region immediately above the pixel on an upper surface of the transparent member where a direction from the interposer to the transparent member is set as an upward direction.
7 . The semiconductor package according to claim 6 , wherein
a part of the sealing resin shields a region between an outer periphery of the transparent member and the dam in the upper surface of the transparent member.
8 . The semiconductor package according to claim 6 , further comprising:
a molding resin that shields a region between an outer periphery of the transparent member and the dam in the upper surface of the transparent member.
9 . A semiconductor package, comprising:
a transparent member;
a semiconductor chip in which pixels are arranged on a part of a chip plane, wherein the semiconductor chip includes:
a silicon substrate, and
an organic film formed on a part of a substrate surface of the silicon substrate;
a photosensitive rib that is a photosensitive resin disposed between a region not corresponding to the pixel in the chip plane and the transparent member, wherein the photosensitive rib is disposed between a region of the substrate surface where the organic film is not formed and the transparent member; and
an interposer electrically connected to the semiconductor chip,
wherein the semiconductor chip has an opening, and
wherein a distance from an end of the opening to the organic film is not less than 200 micrometers.
10 . The semiconductor package according to claim 9 , wherein
the photosensitive rib is formed in close contact with both the transparent member and the semiconductor chip.
11 . The semiconductor package according to claim 9 , wherein
the transparent member is a lens.
12 . The semiconductor package according to claim 9 , wherein
a cross-sectional shape of the photosensitive rib is a tapered shape.
13 . The semiconductor package according to claim 9 , wherein
a shape of an inner wall of the photosensitive rib is a shape obtained by connecting a plurality of triangular prisms with a direction toward the pixel as an inner direction.
14 . The semiconductor package according to claim 13 , wherein a shape of an outer wall of the photosensitive rib with respect to an inner wall is a shape in which a plurality of triangular prisms is connected.
15 . The semiconductor package according to claim 9 , further comprising:
a dam; and
a sealing resin that seals the semiconductor chip, the transparent member, and the interposer, wherein
the semiconductor chip is disposed between the transparent member and the interposer, and
the dam is formed around a light receiving region immediately above the pixel on an upper surface of the transparent member where a direction from the interposer to the transparent member is set as an upward direction.
16 . The semiconductor package according to claim 15 , wherein
a part of the sealing resin shields a region between an outer periphery of the transparent member and the dam in the upper surface of the transparent member.
17 . The semiconductor package according to claim 15 , further comprising:
a molding resin that shields a region between an outer periphery of the transparent member and the dam in the upper surface of the transparent member.
18 . The semiconductor package according to claim 9 , further comprising:
an adhesive resin that bonds the photosensitive rib and the semiconductor chip.
19 . A semiconductor package, comprising:
a transparent member;
a semiconductor chip in which pixels are arranged on a part of a chip plane;
a photosensitive rib that is a photosensitive resin disposed between a region not corresponding to the pixel in the chip plane and the transparent member; and
an interposer electrically connected to the semiconductor chip,
wherein a shape of an inner wall of the photosensitive rib is a shape obtained by connecting a plurality of triangular prisms with a direction toward the pixel as an inner direction, and
wherein a shape of an outer wall of the photosensitive rib with respect to an inner wall is a shape in which a plurality of triangular prisms is connected.
20 . A method for manufacturing a semiconductor package, the method comprising:
a connection procedure of electrically connecting a semiconductor chip in which pixels are arranged on a part of a predetermined chip plane and an interposer;
a photosensitive rib forming procedure of forming a photosensitive resin as a photosensitive rib in a region of one of both surfaces of a transparent member, the region not facing the pixel;
a placement procedure of placing the transparent member on which the photosensitive rib is formed on the semiconductor chip;
an application procedure of applying a resist to the semiconductor chip including a silicon substrate and an organic film formed on a substrate surface of the silicon substrate;
a resist removal procedure of removing a part of the resist; and
an organic film removal procedure of removing a portion of the organic film to which the resist is not applied,
wherein the connection procedure is executed after the organic film removal procedure.