Semiconductor device with blocks including units with a protection element and a bump connected to a main unit
The present disclosure relates to a semiconductor device capable of reducing design load. Provided is a semiconductor device including: a first substrate; and a second substrate bonded to the first substrate with a bonding portion where a bump is bonded, in which the bump pairs up with a predetermined function to constitute a unit. The present disclosure is applicable to, for example, a photodetection device such as a solid-state imaging device.
1 . A semiconductor device, comprising:
a first substrate, including:
an input unit, wherein the input unit includes a protection element and a bump;
an output unit, wherein the output unit includes a protection element and a bump; and
a main circuit, wherein the main circuit is connected to the input unit and to the output unit; and
a second substrate, including:
an input unit, wherein the input unit includes a protection element and a bump;
an output unit, wherein the output unit includes a protection element and a bump; and
a main circuit, wherein the main circuit is connected to the input unit and to the output unit,
wherein the second substrate is bonded to the first substrate with a bonding portion,
wherein the bump of the input unit of the first substrate is bump bonded to the bump of the output unit of the second substrate,
wherein the bump of the output unit of the first substrate is bump bonded to the bump of the input unit of the second substrate, and
wherein the main circuit of the first substrate is operatively connected to the main circuit of the second substrate.
2 . The semiconductor device according to claim 1 ,
wherein the main circuit of the first substrate performs a first function that pairs up with the bump of the input unit of the first substrate, and
wherein the main circuit of the second substrate performs a second function that pairs up with the bump of the input unit of the second substrate.
3 . The semiconductor device according to claim 1 ,
wherein the first substrate includes a plurality of input units that each include a bump and a plurality of output units that each include a bump,
wherein the first substrate has a first surface on which a plurality of the bumps is formed,
wherein the second substrate includes a plurality of input units that each include a bump and a plurality of output units that each include a bump, and
wherein the second substrate has a second surface on which a plurality of the bumps of the second substrate is formed.
4 . The semiconductor device according to claim 1 , wherein each of the input units includes, a wire for a power source and a wire for a ground.
5 . The semiconductor device according to claim 4 , wherein
the wires are formed in a rail form in a first direction and a second direction perpendicular to the first direction.
6 . The semiconductor device according to claim 1 , wherein each of the input and output units is associated with a predetermined function that includes a protection function and at least one of an input function, an output function, a power supply function, a ground supply function, a control function, a pull-up function, or a pull-down function.
7 . The semiconductor device according to claim 2 , wherein
the first function and the second function include different functions.
8 . The semiconductor device according to claim 3 , wherein
the plurality of the input units of the first substrate is arranged in an array form, and
wherein the plurality of the output units of the second substrate is arranged in an array form in correspondence with the plurality of the input units of the first substrate.
9 . The semiconductor device according to claim 8 , wherein
the plurality of the input units of the first substrate and the plurality of the output units of the second substrate are arranged in a rectangular form or an irregular form.
10 . The semiconductor device according to claim 1 , wherein
the semiconductor device is configured as a photodetection device.