IP Library Granted Patent US 12707755
Granted Patent B2
US 12707755 · App. 18/006,234 · Granted Aug 11, 2026

Method for producing a solar cell

Inventors: Axel Schwabedissen (Bitterfeld-Wolfen, DE); Matthias Junghänel (Bitterfeld-Wolfen, DE); Kyung Hun Kim (Bitterfeld-Wolfen, DE); Fabian Fertig (Bitterfeld-Wolfen, DE)
Assignee: Hanwha Q Cells GmbH
H10F77/211C23C16/24C23C16/325C23C16/401C23C16/403C23C16/50C23C16/56H10F77/311
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Quick Facts
Patent No.
US 12707755
App. No.
18/006,234
Granted
Aug 11, 2026
Kind
B2
Abstract

A method for producing a solar cell, including the following steps: a) providing a substrate having a front side and a back side in a deposition apparatus, and b) coating the substrate in situ with two layers, including b1) oxidizing, by exposing the substrate to an oxygen-containing gas and a first plasma, to create an oxide layer and b2) subsequently depositing a silicon layer or SiC layer by exposure to a gas containing silicon, an optional gas containing carbon and a second plasma, wherein step b) is carried out under vacuum in the deposition apparatus and the vacuum is maintained continuously during step b).

Claims (52)

1 . A method for producing a solar cell, comprising steps as follows:

a) providing a substrate having a front side and a back side in a deposition apparatus, and

b) coating the substrate in situ with two layers, comprising:

b1) oxidizing the substrate by exposing it to an oxygen-containing gas and to a first plasma, to generate an oxide layer, or depositing the oxide layer by PECVD, and

b2) subsequently depositing a silicon layer or SiC-layer by exposure to a silicon-containing gas, an optional carbon-containing gas and a second plasma,

wherein step b) is carried out under vacuum in the deposition apparatus and the vacuum is maintained throughout step b); and

wherein step b) is carried out with a low-pressure plasma having a pressure in a range from 0.1 to 5.0 mbar or 0.1 to 10.0 mbar and/or step b) is carried out with a low-pressure glow discharge having an excitation frequency in a range from 10 to 500 kHz or 30 to 50 kHz and/or in step b) the plasma is pulsed in a range with a duty cycle of T on /(T on +T off )<10% and/or in a range of T on =1 to 100 ms.

2 . The method as claimed in claim 1 , wherein the back side is subjected to steps a) and b).

3 . The method as claimed in claim 1 , wherein between steps b1) and b2) the substrate is not moved spatially within the deposition apparatus.

4 . The method as claimed in claim 1 , wherein:

the oxygen-containing gas is selected from a group consisting of:

O 2 ,

a gas mixture of O 2 /inert gas, the inert gas being preferably Ar, Ne, Kr or N 2 ,

an oxygen-containing molecular gas, which is preferably N 2 O, CO 2 , NO 2 , NO or CO, and

a layer-forming gas mixture, the layer-forming gas mixture being preferably SiH 4 /O 2 , SiH 4 /CO 2 , AlC 3 H 9 /N 2 O or AlC 3 H 9 /N 2 O/Ar,

and/or:

the silicon-containing gas and the optional carbon-containing gas are selected from the group consisting of a gas mixture of SiH 4 /H 2 , a gas mixture of SiH 4 /H 2 /PH 3 , a gas mixture of SiH 4 /H 2 /B 2 H 6 , a gas mixture of SiH 4 /CH 4 , a gas mixture of SiH 4 /CH 4 /PH 3 or a gas mixture of SiH 4 /CH 4 /B 2 H 6 .

5 . The method as claimed in claim 4 , wherein the oxygen-containing molecular gas is N 2 O, CO 2 , NO 2 , NO or CO.

6 . The method as claimed in claim 4 , wherein the layer-forming gas mixture is SiH 4 /O 2 , SiH 4 /CO 2 , AlC 3 H 9 /N 2 O or AlC 3 H 9 /N 2 O/Ar.

7 . The method as claimed in claim 4 , wherein the inert gas is Ar, Ne, Kr or N 2 .

8 . The method as claimed in claim 1 , wherein step b1) is carried out with a deposition rate of <0.2 nm/s or <0.1 nm/s and/or step b1) is carried out with a duty cycle<5% and/or step b1) is carried out at a temperature<500° C. or in a range from 300 to 450° C.

9 . The method as claimed in claim 8 , wherein two or more substrates are arranged in a boat in which pairs of substrates are arranged oppositely and have a different polarity.

10 . The method as claimed in claim 1 , wherein two or more substrates are subjected simultaneously to steps a) and b).

11 . The method as claimed in claim 1 , wherein the oxide layer generated in step b1) is configured as a tunnel layer and/or the solar cell is a TOPCon solar cell.

12 . The method as claimed in claim 1 , wherein the method is carried out as a direct plasma process or as a remote plasma process with a capacitive plasma as radiofrequency plasma or with an excitation frequency of 13.56 MHz or multiples thereof.

13 . The method as claimed in claim 1 , wherein before step a) with the substrate first a wet-chemical treatment, then a doping for the front side and subsequently a further wet-chemical treatment are carried out and after step b) with the substrate an annealing, then yet a further wet-chemical treatment of the front side, subsequently a passivation of the front side and of the back side and then a metallization of the front side and of the back side are carried out.

14 . The method as claimed in claim 1 , wherein the deposition apparatus is a tube furnace.

15 . A method for producing a solar cell, comprising steps as follows:

a) providing a substrate having a front side and a back side in a deposition apparatus, and

b) coating the substrate in situ with two layers, comprising:

b1) oxidizing the substrate by exposing it to an oxygen-containing gas and to a first plasma, to generate an oxide layer, or depositing the oxide layer by PECVD, and

b2) subsequently depositing a silicon layer or SiC-layer by exposure to a silicon-containing gas, an optional carbon-containing gas and a second plasma,

wherein step b) is carried out under vacuum in the deposition apparatus and the vacuum is maintained throughout step b), and

wherein:

the oxygen-containing gas is selected from a group consisting of:

O 2 ,

a gas mixture of O 2 /inert gas, the inert gas being preferably Ar, Ne, Kr or N 2 ,

an oxygen-containing molecular gas, which is preferably N 2 O, CO 2 , NO 2 , NO or CO, and

a layer-forming gas mixture, the layer-forming gas mixture being preferably SiH 4 /O 2 , SiH 4 /CO 2 , AlC 3 H 9 /N 2 O or AlC 3 H 9 /N 2 O/Ar,

and/or:

the silicon-containing gas and the optional carbon-containing gas are selected from the group consisting of a gas mixture of SiH 4 /H 2 , a gas mixture of SiH 4 /H 2 /PH 3 , a gas mixture of SiH 4 /H 2 /B 2 H 6 , a gas mixture of SiH 4 /CH 4 , a gas mixture of SiH 4 /CH 4 /PH 3 or a gas mixture of SiH 4 /CH 4 /B 2 H 6 .

16 . The method as claimed in claim 15 , wherein the inert gas is Ar, Ne, Kr or N 2 .

17 . The method as claimed in claim 15 , wherein the oxygen-containing molecular gas is N 2 O, CO 2 , NO 2 , NO or CO.

18 . A method for producing a solar cell, comprising steps as follows:

a) providing a substrate having a front side and a back side in a deposition apparatus, and

b) coating the substrate in situ with two layers, comprising:

b1) oxidizing the substrate by exposing it to an oxygen-containing gas and to a first plasma, to generate an oxide layer, or depositing the oxide layer by PECVD, and

b2) subsequently depositing a silicon layer or SiC-layer by exposure to a silicon-containing gas, an optional carbon-containing gas and a second plasma,

wherein step b) is carried out under vacuum in the deposition apparatus and the vacuum is maintained throughout step b); and

wherein step b1) is carried out with a deposition rate of <0.2 nm/s or <0.1 nm/s and/or step b1) is carried out with a duty cycle<5% and/or step b1) is carried out at a temperature<500° C. or in a range from 300 to 450° C.

19 . The method as claimed in claim 18 , wherein two or more substrates are arranged in a boat in which pairs of substrates are arranged oppositely and have a different polarity.

20 . The method as claimed in claim 18 , wherein two or more substrates are subjected simultaneously to steps a) and b).