Array base plate and light emitting apparatus
The present application provides an array base plate and a light emitting apparatus, which relates to the technical field of displaying. The array base plate includes: a substrate; and a plurality of electrically-conductive-pad groups located on the substrate, wherein each of the electrically-conductive-pad groups includes at least one electrically conductive pad; the electrically conductive pad includes an electrically conducting layer and a first connecting layer, the first connecting layer is located on one side of the electrically conducting layer away from the substrate, and an orthographic projection of the first connecting layer on the substrate and an orthographic projection of the electrically conducting layer on the substrate at least partially intersect or overlap; and a thickness of the first connecting layer in a thickness direction of the substrate is greater than or equal to a thickness of the electrically conducting layer in the thickness direction of the substrate.
1 . An array base plate, wherein the array base plate comprises:
a substrate; and
a plurality of electrically-conductive-pad groups located on the substrate, wherein each of the electrically-conductive-pad groups comprises at least two electrically conductive pads;
the electrically conductive pad comprises an electrically conducting layer and a first connecting layer, the first connecting layer is located on one side of the electrically conducting layer away from the substrate, and an orthographic projection of the first connecting layer on the substrate and an orthographic projection of the electrically conducting layer on the substrate at least partially intersect or overlap; and
a thickness of the first connecting layer in a thickness direction of the substrate is greater than or equal to a thickness of the electrically conducting layer in the thickness direction of the substrate;
the array base plate further comprises an insulating layer, and the insulating layer is located between the electrically conductive pads of a same one electrically-conductive-pad group;
wherein an orthographic projection of the insulating layer on the substrate and the orthographic projection of the electrically conducting layer on the substrate do not intersect or overlap with each other.
2 . The array base plate according to claim 1 , wherein
a distance from a surface of the insulating layer away from the substrate to the substrate in the thickness direction of the substrate is less than or equal to a distance from a surface of the first connecting layer away from the substrate to the substrate in the thickness direction of the substrate.
3 . The array base plate according to claim 2 , wherein the distance from the surface of the insulating layer away from the substrate to the substrate in the thickness direction of the substrate is greater than a distance from a surface of the electrically conducting layer away from the substrate to the substrate in the thickness direction of the substrate.
4 . The array base plate according to claim 1 , wherein the orthographic projection of the first connecting layer on the substrate and the orthographic projection of the insulating layer on the substrate do not intersect or overlap with each other.
5 . The array base plate according to claim 1 , wherein the array base plate further comprises a plurality of second connecting layers and a plurality of element devices, the second connecting layers are located on one side of the first connecting layer away from the substrate, and orthographic projections of the second connecting layers on the substrate are located within the orthographic projection of the first connecting layer on the substrate;
the electrically conductive pads of one electrically-conductive-pad group are electrically connected to one element device by the second connecting layers; and
a maximum thickness of the first connecting layer in the thickness direction of the substrate is greater than a maximum thickness of the second connecting layers in the thickness direction of the substrate.
6 . The array base plate according to claim 5 , wherein the maximum thickness of the first connecting layer in the thickness direction of the substrate is greater than or equal to two times of the maximum thickness of the second connecting layers in the thickness direction of the substrate.
7 . The array base plate according to claim 5 , wherein each of the element devices comprises an element device body and at least one lead, the array base plate further comprises a soldering layer located between the lead and the first connecting layer, and the soldering layer comprises a soldering material; and
in a predetermined condition, an extent of reaction between a material of the first connecting layer and a material of the soldering layer is less than an extent of reaction between a material of the electrically conducting layer and the material of the soldering layer.
8 . The array base plate according to claim 5 , wherein the array base plate comprises a device disposing area and a bonding area that are located on the substrate;
the device disposing area comprises the element devices, the electrically-conductive-pad groups and the second connecting layers; and
the bonding area comprises a circuit board, the electrically-conductive-pad groups and the second connecting layers, and the circuit board is electrically connected to the electrically-conductive-pad groups by the second connecting layers.
9 . The array base plate according to claim 8 , wherein a thickness of the first connecting layer within the device disposing area in the thickness direction of the substrate ranges 2 μm-5 μm; and
a thickness of the first connecting layer within the bonding area in the thickness direction of the substrate ranges 2 μm-4 μm.
10 . The array base plate according to claim 5 , wherein a shape of an orthographic projection of each of the element devices on the substrate comprises a rectangle, and a length-width ratio of the rectangle ranges 1:1-1.5:1.
11 . The array base plate according to claim 10 , wherein each of the element devices comprises at least four leads, a quantity of the leads is equal to a quantity of the electrically conductive pads in each of the electrically-conductive-pad groups, the leads of a same one element device are electrically connected to the electrically conductive pads of a same one electrically-conductive-pad group;
orthographic projections of the leads on the substrate are located within the orthographic projection of the first connecting layer on the substrate; and
a minimum distance between any two neighboring leads of a same one element device is greater than or equal to 40 μm.
12 . The array base plate according to claim 11 , wherein a shape of an orthographic projection of each of the leads on the substrate comprises any one of a polygon and a shape formed by a polygon and an arc; and
both of two opposing faces of two neighboring leads of a same one element device are planes, and the two planes are parallel.
13 . The array base plate according to claim 12 , wherein all of spacings between every two neighboring leads are equal.
14 . The array base plate according to claim 12 , wherein areas of the two planes are equal.
15 . The array base plate according to claim 5 , wherein the first connecting layer comprises a nickel layer and a gold layer, and the gold layer is located on one side of the nickel layer away from the substrate; and
the second connecting layers extend throughout a part of an area of the gold layer and extend into the nickel layer.
16 . A light emitting apparatus, wherein the light emitting apparatus comprises the array base plate according to claim 1 .
17 . The light emitting apparatus according to claim 16 , wherein
a distance from a surface of the insulating layer away from the substrate to the substrate in the thickness direction of the substrate is less than or equal to a distance from a surface of the first connecting layer away from the substrate to the substrate in the thickness direction of the substrate.