LED light bulb and manufacturing process thereof

1 . A LED light bulb, comprising:

a glass shade and a LED bead, the LED bead being encapsulated in the glass shade, the LED bead comprising a first pin, a second pin, a LED illuminant, and a package body, the first pin and the second pin projecting out from a base of the glass shade, wherein

a first bent segment is formed at a top end of the first pin, and a second bent segment is formed at a top end of the second pin, the first pin forms a structure comprising a first base and a first inclined segment and the second pin forms a structure comprising a second base and a second inclined segment, the first inclined segment being connected between the first base and the first bent segment, the second inclined segment being connected between the second base and the second bent segment, an included angle between the first inclined segment and the first bent segment and an included angle between the second inclined segment and the second bent segment being both acute angles, the first bent segment and the second bent segment being bent in opposite directions perpendicular to a plane defined by the first base and the second base, the first bent segment and the second bent segment being substantially disposed on a first plane to form a mounting platform, the first plane being substantially perpendicular to an axial direction of the glass shade, the first bent segment and the second bent segment are spaced apart on the first plane, and projections of the first and second bent segments overlap in a direction perpendicular to a length direction of the first bent segment;

the LED illuminant is disposed flatly on the first bent segment and the second bent segment from top to down, the LED illuminant is secured on the mounting platform, wherein the LED illuminant includes an LED chip being disposed on a front side of a substrate, a positive weld joint surface and a negative weld joint surface being provided on a back side of the substrate that faces the first plane and on which the positive weld joint surface and the negative weld joint surface are formed for connection to the first bent segment and the second bent segment, the positive weld joint surface and the negative weld joint surface being spaced apart by an insulative gap, the first bent segment being welded to the positive weld joint surface and the second bent segment being welded to the negative weld joint surface, such that the LED illuminant is supported by the first bent segment and the second bent segment at overlapping projections of the first bent egment and the second bent segment; and

the package body encapsulates the LED illuminant and respective weld joints between the LED illuminant and the first bent segment and between the LED illuminant and the second bent segment.

2 . The LED light bulb according to claim 1 , wherein the LED light bulb adopts a white light source, the LED illuminant adopts a LED which emits white light, the package body adopts a transparent, colorless encapsulant, and the glass shade adopts colorless glass.

3 . The LED light bulb according to claim 1 , wherein the LED light bulb adopts a colored light source, the LED illuminant adopts a LED which emits colored light, the package body adopts a transparent, colorless encapsulant, and the glass shade adopts colorless glass;

or, the LED light bulb adopts a colored light source, the LED illuminant adopts a LED which emits white light, the package body adopts a transparent, colored encapsulant, and the glass shade adopts colorless glass;

or, the LED light bulb adopts a colored light source, the LED illuminant adopts a LED which emits white light, the package body adopts a transparent, colorless encapsulant, and the glass shade adopts colored glass.

4 . A LED bulb manufacturing process, applied to manufacture the LED light bulb according to claim 1 , comprising a step of forming the LED bead that is encapsulated by the glass shade, wherein the step of forming the LED bead that is encapsulated by the glass shade comprises:

S 100 : forming the first pin and the second pin with a metallic filament of a predetermined length;

S 110 : forming the first bent segment by bending the top end of the first pin and forming the second bent segment by bending the top end of the second pin, the first bent segment and the second bent segment being bent in the opposite directions to thereby form the mounting platform;

S 120 : forming a wick structure by securely welding the LED illuminant placed on the mounting platform, wherein the S 120 comprises:

S 121 : applying a solder on respective top surfaces of the first bent segment and the second bent segment;

S 122 : disposing the LED illuminant flatly on the first bent segment and the second bent segment from top to down; and

S 123 : heating the solder on the first bent segment and the second bent segment and cooling by air blowing to connect to the positive weld joint surface and the negative wel di: surface;

S 130 : flipping the wick structure upside-down so that the LED illuminant faces downward, impregnating the LED illuminant in an encapsulant so that the encapsulant envelops the LED illuminant as well as respective weld joints between the LED illuminant and the first bent segment and between the LED illuminant and the second bent segment;

S 140 : forming the LED bead by curing the encapsulant to form the package body; and

S 150 : inspecting the LED bead by turning it on, wherein if the LED bead lights up, it is determined to be a qualified product.

5 . The LED bulb manufacturing process according to claim 4 , wherein the S 110 further comprises: scraping off dirt from respective top surfaces of the first bent segment and the second bent segment while forming the first bent segment and the second bent segment by bending.

6 . The LED bulb manufacturing process according to claim 4 , wherein the step of forming the LED bead that is encapsulated by the glass shade further comprises between S 100 and S 110 :

S 101 : transporting the first pin and the second pin engaged by a gripper to an inspection workstation where whether the first pin and the second pin are present on the gripper is inspected; continuing manufacturing in the case of presence, while suspending manufacturing in a case of absence.

7 . The LED bulb manufacturing process according to claim 4 , wherein the step of forming the LED bead that is encapsulated by the glass shade further comprises after S 101 :

S 102 : flattening top ends of the first pin and the second pin to increase respective contact areas between the first bent segment and the LED illuminant and between the second bent segment and the LED illuminant.

8 . The LED bulb manufacturing process according to claim 4 , wherein the S 110 further comprises: when forming the first bent segment and the second bent segment by bending, performing shaping treatment to the first pin and the second pin so that the first pin forms a structure comprising a first base and a first inclined segment and the second pin forms a structure comprising a second base and a second inclined segment, the first inclined segment being connected between the first base and the first bent segment, the second inclined segment being connected between the second base and the second bent segment, an inclined angle between the first inclined segment and the first bent segment being an acute angle, an inclined angle between the second inclined segment and the second bent segment being an acute angle, the first bent segment and the second bent segment being bent in the opposite directions perpendicular to a plane defined by the first base and the second base.

9 . The LED bulb manufacturing process according to claim 4 , wherein the step of forming the LED bead that is encapsulated by the glass shade further comprises between S 110 and S 120 :

S 111 : adjusting spacing between the first bent segment and the second bent segment to satisfy a predetermined requirement.