Display device and manufacturing method of display device

1 . A display device comprising:

a substrate;

a lower electrode provided above the substrate;

a rib formed of an inorganic insulating material and comprising an aperture which overlaps the lower electrode;

a partition comprising a lower portion which is provided on the rib and is formed of a conductive material, and an upper portion which is provided on the lower portion and protrudes from a side surface of the lower portion;

an organic layer provided on the lower electrode in the aperture;

an upper electrode which covers the organic layer and is in contact with the lower portion of the partition;

a sealing layer which covers the upper electrode and is in contact with the lower portion of the partition; and

a common sealing layer formed of an inorganic insulating material and provided over a broader range than the sealing layer above the sealing layer, wherein

the sealing layer is formed of silicon nitride or a transparent oxide,

the common sealing layer covers the sealing layer and is in contact with the upper portion on the partition, and

a refractive index of the common sealing layer is less than a refractive index of the sealing layer.

2 . The display device of claim 1 , further comprising a transparent layer which is formed of an inorganic fluoride, is provided on the sealing layer, is covered with the common sealing layer and is in contact with the upper portion on the partition, wherein

a refractive index of the transparent layer is less than a refractive index of the sealing layer.

3 . The display device of claim 2 , wherein

a difference between the refractive index of the transparent layer and the refractive index of the sealing layer is greater than or equal to 0.2.

4 . The display device of claim 2 , wherein

the common sealing layer is formed of silicon nitride or silicon oxynitride.

5 . The display device of claim 4 , wherein

a refractive index of the common sealing layer is greater than the refractive index of the transparent layer.

6 . The display device of claim 1 , wherein

a difference between the refractive index of the common sealing layer and the refractive index of the sealing layer is greater than or equal to 0.2.

7 . The display device of claim 1 , wherein

the common sealing layer is formed of silicon oxide or silicon oxynitride.

8 . The display device of claim 1 , wherein

a thickness of the sealing layer is less than a thickness of the lower portion of the partition.

9 . The display device of claim 1 , wherein

a thickness of the sealing layer is less than a thickness of the common sealing layer.

10 . A manufacturing method of a display device, comprising:

forming a first lower electrode and a second lower electrode above a substrate;

forming a rib comprising a first aperture which overlaps the first lower electrode and a second aperture which overlaps the second lower electrode;

forming a partition comprising a lower portion located on the rib between the first aperture and the second aperture, and an upper portion which is located on the lower portion and protrudes from a side surface of the lower portion;

forming a first organic layer on the first lower electrode and the second lower electrode;

forming a first upper electrode on the first organic layer;

forming a first sealing layer which covers the first upper electrode and is in contact with the lower portion of the partition;

forming a first resist on the first sealing layer immediately above the first lower electrode;

removing the first sealing layer, the first upper electrode and the first organic layer using the first resist as a mask immediately above the second lower electrode;

forming a second organic layer on the first sealing layer and the second lower electrode;

forming a second upper electrode on the second organic layer;

forming a second sealing layer which covers the second upper electrode and is in contact with the lower portion of the partition;

forming a second resist on the second sealing layer immediately above the second lower electrode;

removing the second sealing layer, the second upper electrode and the second organic layer using the second resist as a mask immediately above the first sealing layer; and

forming a common sealing layer above the first sealing layer and the second sealing layer, wherein

each of the first sealing layer and the second sealing layer is formed of silicon nitride or a transparent oxide, and

the common sealing layer is formed of an inorganic insulating material.

11 . The manufacturing method of claim 10 , wherein

the first sealing layer and the second sealing layer are formed so as to have different thicknesses.

12 . The manufacturing method of claim 10 , further comprising,

forming a transparent layer which is located on the first sealing layer and the second sealing layer and is in contact with the upper portion on the partition is formed, before forming the common sealing layer, wherein

the transparent layer is formed of an inorganic fluoride, and

a refractive index of the transparent layer is less than refractive indices of the first sealing layer and the second sealing layer.

13 . The manufacturing method of claim 12 , wherein

the common sealing layer is formed of silicon nitride or silicon oxynitride.

14 . The manufacturing method of claim 12 , further comprising,

performing etching for the first sealing layer and the second sealing layer to reduce thicknesses of the first sealing layer and the second sealing layer, before forming the transparent layer.

15 . The manufacturing method of claim 10 , wherein

the common sealing layer is formed so as to cover the first sealing layer and the second sealing layer and to be in contact with the upper portion on the partition, and

a refractive index of the common sealing layer is less than refractive indices of the first sealing layer and the second sealing layer.

16 . The manufacturing method of claim 15 , wherein

the common sealing layer is formed of silicon oxide or silicon oxynitride.

17 . The manufacturing method of claim 15 , further comprising,

performing etching for the first sealing layer and the second sealing layer to reduce thicknesses of the first sealing layer and the second sealing layer, before forming the common sealing layer.

18 . The manufacturing method of claim 10 , wherein

a thickness of each of the first sealing layer and the second sealing layer is less than a thickness of the lower portion of the partition.

19 . The manufacturing method of claim 10 , wherein

a thickness of each of the first sealing layer and the second sealing layer is less than a thickness of the common sealing layer.

20 . A display device comprising:

a substrate;

a lower electrode provided above the substrate;

a rib formed of an inorganic insulating material and comprising an aperture which overlaps the lower electrode;

a partition comprising a lower portion which is provided on the rib and is formed of a conductive material, and an upper portion which is provided on the lower portion and protrudes from a side surface of the lower portion;

an organic layer provided on the lower electrode in the aperture;

an upper electrode which covers the organic layer and is in contact with the lower portion of the partition;

a sealing layer which is formed of an inorganic insulating material, covers the upper electrode and is in contact with the lower portion of the partition; and

a common sealing layer formed of an inorganic insulating material and provided over a broader range than the sealing layer above the sealing layer,

wherein

the common sealing layer covers the sealing layer and is in contact with the upper portion on the partition, and

a refractive index of the common sealing layer is less than a refractive index of the sealing layer.